IP Library Patent Application 16634745
Patent Application
App. No. 16/634,745

PHYSICAL QUANTITY DETECTION DEVICE

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Quick Facts
Patent No.
US None
App. No.
16/634,745
Abstract

To obtain a physical quantity detection device that can prevent a thermal influence on a sensor due to downsizing. A physical quantity detection device of the present invention includes a chip package in which a flow sensor and an electronic component are sealed using resin and a circuit board on which the chip package is mounted. The chip package is fixed to a circuit board surface of the circuit board with a part of the chip package protruding laterally from an end of the circuit board, and the circuit board includes a flat margin region S wider than a width of the chip package, the margin region S being provided at a position on a circuit board surface and at a position biased in an opposite direction to a protruding direction from the chip package.

Claims (24)

1 . A physical quantity detection device that detects a physical quantity of a measured gas flowing in a main passage, the physical quantity detection device comprising:

a flow sensor that detects a flow rate of the measured gas;

an LSI that drives the flow sensor;

a chip package formed by sealing the flow sensor and a lead frame supporting the LSI using resin; and

a circuit board on which the chip package is mounted,

wherein a part of the chip package including the flow sensor is fixed to the circuit board with the chip package protruding laterally from an end of the circuit board.

2 . The physical quantity detection device according to claim 1 , wherein

the circuit board has a rectangular shape in which an aspect ratio is greater than 1 , and

a part of the chip package including the flow sensor is disposed so as to protrude with respect to a long side of the circuit board.

3 . The physical quantity detection device according to claim 2 , wherein

the circuit board includes a margin region where an electronic component is not mounted, the margin region being provided on a surface of the circuit board on which the chip package is mounted and at a position biased in a short-side direction with respect to the chip package, and

a width of the margin region in a longitudinal direction of the margin region is greater than or equal to a width of the chip package.

4 . The physical quantity detection device according to claim 3 , wherein the margin region has a size that accepts a protruding portion of the chip package mounted on another adjacent circuit board with a plurality of the circuit boards being disposed in a protruding direction of the chip package.

5 . The physical quantity detection device according to claim 3 , wherein the margin region is a region in which a circuit component is not mounted and a circuit wiring is provided.

6 . The physical quantity detection device according to claim 2 , wherein the flow sensor and the LSI are integrally formed in an identical semiconductor element.

7 . The physical quantity detection device according to claim 2 , wherein the long side of the circuit board is provided along an insertion direction.

8 . The physical quantity detection device according to claim 7 , further comprising:

a circuit chamber that accommodates the circuit board; and

a sub-passage in which the flow sensor is disposed,

wherein an inlet of the sub-passage is provided on a downstream side with respect to an upstream sidewall of the circuit chamber.

9 . The physical quantity detection device according to claim 8 , further comprising a flange that is fixed to the main passage such that the circuit chamber and the sub-passage are located in the main passage,

wherein a pressure sensor, the chip package, a humidity sensor, and a temperature sensor are mounted on the circuit board in order closest to the flange.

10 . The physical quantity detection device according to claim 9 , wherein the temperature sensor is provided on the downstream side of an upstream outer wall and on the upstream side of an inlet of the sub-passage.

11 . The physical quantity detection device according to claim 10 , wherein the chip package has a narrowed shape that is narrowed in a width direction and a thickness direction.

Assignments (3)
CHANGE OF NAME Recorded Nov 22, 2021
From: HITACHI AUTOMOTIVE SYSTEMS, LTD.
To: HITACHI ASTEMO, LTD.
Reel/Frame 058598/0321 →
CORRECTIVE ASSIGNMENT TO CORRECT THE ASSIGNEE'S CITY ADDRESS. PREVIOUSLY RECORDED AT REEL: 051651 FRAME: 0193. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT OF ASSIGNORS INTEREST. Recorded May 12, 2020
From: YOGO, TAKAYUKI; FATIN FARHANAH, BINTI HARIDAN; UENODAN, AKIRA; MIKI, TAKAHIRO; HOSHIKA, HIROAKI
To: HITACHI AUTOMOTIVE SYSTEMS, LTD.
Reel/Frame 052643/0662 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 29, 2020
From: YOGO, TAKAYUKI; FATIN FARHANAH, BINTI HARIDAN; UENODAN, AKIRA; MIKI, TAKAHIRO; HOSHIKA, HIROAKI
To: HITACHI AUTOMOTIVE SYSTEMS, LTD.
Reel/Frame 051651/0193 →