Pressure sensor for measuring a pressure of a fluid and method for producing a pressure sensor for measuring a pressure of a fluid

1. A pressure sensor for measuring a pressure of a fluid, comprising:

a sensor element for measuring the pressure of the fluid;

a control and/or evaluation circuit for controlling and/or evaluating a measuring signal of the sensor element;

a circuit carrier, wherein the control and/or evaluation circuit is situated on the circuit carrier;

a carrier element, wherein the circuit carrier is fastened on the carrier element;

a housing element, wherein the carrier element together with the circuit carrier is fastened in the housing element in a form-locking and/or force-locking manner;

at least one connecting spring disposed on an upper side of the circuit carrier, and for electrically connecting the control and/or evaluation circuit to further elements; and

a grounding spring for connecting the control and/or evaluation circuit to ground, the grounding spring being located on a lower side of the circuit carrier facing away from the at least one connecting spring;

wherein the carrier element has a recess for accommodating the grounding spring,

wherein the housing element includes a lower housing element and an upper housing element, which are connectable together,

wherein the fastened circuit carrier and carrier element are inserted into the lower housing element,

wherein the circuit carrier, the carrier element, and the lower housing element have a complementary shape, so that the circuit carrier is aligned when inserted into the carrier element, and wherein the carrier element and the circuit carrier are aligned when inserted into the lower housing element,

wherein the carrier element is fastened in the lower housing element by a snap-in or clip-on connection, wherein for this purpose, the lower housing element has one or multiple projections protruding toward the inside,

wherein the carrier element has one or multiple snap lugs complementary to the projections, and

wherein the carrier element is configured in one piece from an electrically non-conducting material.

2. The pressure sensor of claim 1 , wherein the control and/or evaluation circuit is situated on two opposite sides of the circuit carrier.

3. The pressure sensor of claim 1 , wherein the circuit carrier is connected to the carrier element by a form-locking and/or force-locking connection.

4. The pressure sensor of claim 3 , wherein the circuit carrier is connected to the carrier element by a snap-in connection.

5. A method for producing a pressure sensor for measuring a pressure of a fluid, the method comprising:

providing a pressure sensor base unit, the pressure sensor base unit including a housing element and a sensor element for measuring the pressure of the fluid;

providing a circuit carrier including a control and/or evaluation circuit for controlling and/or evaluating a measuring signal of the sensor element,

connecting the circuit carrier to a carrier element, which is formed in one piece from an electrically non-conducting material, by a form-locking and/or a force-locking connection;

inserting the carrier element together with the circuit carrier into the housing element and connecting the carrier element to the housing element;

disposing at least one connecting spring disposed on an upper side of the circuit carrier, and for electrically connecting the control and/or evaluation circuit to further elements; and

providing a grounding spring for connecting the control and/or evaluation circuit to ground, the grounding spring being located on a lower side of the circuit carrier facing away from the at least one connecting spring;

wherein the carrier element has a recess for accommodating the grounding spring,

wherein the housing element includes a lower housing element and an upper housing element, which are connected together,

wherein the fastened circuit carrier and carrier element are inserted into the lower housing element,

wherein the circuit carrier, the carrier element, and the lower housing element have a complementary shape, so that the circuit carrier is aligned when inserted into the carrier element, and wherein the carrier element and the circuit carrier are aligned when inserted into the lower housing element,

wherein the carrier element is fastened in the lower housing element by a snap-in or clip-on connection, wherein for this purpose, the lower housing element has one or multiple projections protruding toward the inside, and

wherein the carrier element has one or multiple snap lugs complementary to the projections.

6. The method of claim 5 , wherein, for connecting the control and/or evaluation circuit to ground, a grounding spring is inserted into a recess of the carrier element, in particular before the circuit carrier is connected to the carrier element.