Hybrid and thinned millimeter-wave antenna solutions
Apparatuses and systems for millimeter-wave antennas are described. An apparatus comprises a board assembly, and a first and second antenna disposed within the board assembly. A third antenna can comprise a semiconductor antenna attached to the board assembly. A parasitic layer can be gap-coupled to the first and second antenna. The first and second antenna can include a rectangular patch antenna and an annular ring antenna. Other aspects are described.
1. An apparatus comprising:
a board assembly;
an annular patch antenna disposed within the board assembly and having a rectangular outside perimeter, the annular patch antenna electrically coupled to a first feed;
a rectangular patch antenna disposed within the board assembly the rectangular patch antenna electrically coupled to a second feed; and
a parasitic layer gap-coupled to the annular patch antenna and to the rectangular patch antenna and disposed outside the rectangular outside perimeter,
wherein the annular patch antenna and the rectangular patch antenna are electrically coupled to a common feed.
2. The apparatus of claim 1 , wherein the parasitic layer is co-planar with the annular patch antenna in a first layer of the board assembly.
3. The apparatus of claim 2 , wherein the rectangular patch antenna is disposed on a plane between a ground plane of the board assembly and the first layer of the board assembly.
4. The apparatus of claim 1 , wherein the common feed allows the parasitic layer to be shared between the annular patch antenna and the rectangular patch antenna through gap coupling, and
wherein the parasitic layer is electrically isolated from annular patch antenna and the rectangular patch antenna.