Display substrate with microprism structure and manufacturing method therefor

1. A display substrate, comprising:

a base substrate;

a luminescent element, including a first electrode, a luminescent material layer and a second electrode which are sequentially laminated on the base substrate, and a microprism structure being disposed on a light-emitting side of the luminescent material layer,

a driving circuit layer, disposed between the base substrate and the luminescent element; and

a package layer, disposed on a side of the second electrode away from the base substrate,

wherein the second electrode, the package layer and an electron transporting layer are conformal.

2. The display substrate according to claim 1 , wherein the luminescent material layer is a layer in a luminescent function layer, the second electrode is disposed on the light-emitting side of the luminescent function layer, and the microprism structure is disposed between the luminescent function layer and the second electrode.

3. The display substrate according to claim 2 , wherein the luminescent function layer further includes an electron transporting layer which is disposed on the light-emitting side of the luminescent material layer, the electron transporting layer has the microprism structure.

4. The display substrate according to claim 3 , wherein the second electrode and the electron transporting layer are conformal.

5. The display substrate according to claim 1 , wherein the luminescent material layer is a layer in a luminescent function layer, the luminescent function layer also includes a plurality of function layers disposed on the light-emitting side of the luminescent material layer, and a surface of one of the plurality of function layers has the microprism structure.

6. The display substrate according to claim 5 , wherein an outmost layer of the luminescent function layer disposed on the light-emitting side has the microprism structure.

7. The display substrate according to claim 5 , wherein a first layer of the luminescent function layer disposed between the luminescent material layer and the outmost layer on the light-emitting side has the microprism structure, and the first layer and a function layer of the luminescent function layer disposed on a light-emitting side of the first layer are conformal.

8. The display substrate according to claim 5 , wherein the function layer with the microprism structure on a surface and the microprism structure are an integral structure formed by an identical material.

9. The display substrate according to claim 1 , wherein the microprism structure includes a bottom surface and at least one side surface connected with the bottom surface, an included angle between the bottom surface and at least a portion of the at least one side surface connected with the bottom surface is greater than or equal to 45° and less than or equal to 90°.

10. The display substrate according to claim 1 , wherein in a direction perpendicular to a surface of the display substrate, a cross-section of the microprism structure is triangular, rectangular, trapezoidal or cambered.

11. A method for manufacturing a display substrate, comprising:

providing a base substrate;

forming a luminescent element on the base substrate which includes sequentially forming of a first electrode, a luminescent material layer and a second electrode on the base substrate;

forming a driving circuit layer on the base substrate, wherein the luminescent element is formed on a side of the driving circuit layer away from the base substrate; and

forming a package layer on a side of the second electrode away from the base substrate,

wherein the second electrode, the package layer and an electron transporting layer are conformal, and a microprism structure is formed on a light-emitting side of the luminescent material layer.

12. The method according to claim 11 , wherein the forming the microprism structure on the light-emitting side of the luminescent material layer includes:

forming the electron transporting layer on the light-emitting side of the luminescent material layer, and forming the microprism structure by utilizing the electron transporting layer.

13. The method according to claim 12 , wherein the forming the microprism structure by utilizing the electron transporting layer includes:

forming a mask layer on a surface of the electron transporting layer away from the base substrate by utilizing an ink containing a metal particle;

etching the electron transporting layer by using the mask layer, to form the microprism structure on a surface of the electron transporting layer away from the base substrate; and

removing the mask layer.

14. The method according to claim 13 , wherein the forming the mask layer includes:

forming the mask layer by using an ink via a printing or a spin coating;

the etching the electron transporting layer by using the mask layer includes:

etching the electron transporting layer by using an inductively coupled plasma process or a high-density plasma process; and

the removing the mask layer includes:

removing the mask layer by utilizing a magnet or an electromagnet to adsorb the metal particle.

15. The method according to claim 13 , wherein during etching the electron transporting layer, a flow rate of a plasma gas in an etching environment is adjusted, to control an etching rate of the electron transporting layer, and the flow rate of the plasma gas is positively related to the etching rate.

16. The method according to claim 13 , wherein the metal particle is of spherical shape, a diameter of the metal particle is 50 nm to 100 μm, and the metal particle includes ferroferric oxide.

17. The method according to claim 12 , wherein the electron transporting layer includes zinc oxide.

18. The method according to claim 12 , wherein the second electrode is a cathode, and the forming the second electrode includes:

conformally forming the second electrode on a surface of the electron transporting layer on which the microprism structure is formed by adoption of lithium fluoride or aluminum via an evaporation manner,

and the forming the package layer on the second electrode includes:

conformally forming the package layer on a side of the second electrode away from the base substrate by adoption of indium tin oxide or indium zinc oxide via a sputtering manner.