Semiconductor laser element
A semiconductor light-emitting element includes: an n-type cladding layer formed of a nitride semiconductor; an active layer which is arranged above the n-type cladding layer and formed of a nitride semiconductor; a p-type cladding layer arranged above the active layer and formed of a nitride semiconductor; and a p-side electrode arranged above the p-type cladding layer, wherein the p-type cladding layer contains hydrogen, and a first concentration of the hydrogen at a center of the p-type cladding layer in a region below the p-side electrode is lower than a second concentration of the hydrogen at a position located on a side closer to an outer edge than to the center in the region below the p-side electrode.
1. A semiconductor laser element, comprising:
an n-type cladding layer containing AlGaN;
an active layer which is arranged above the n-type cladding layer and contains InGaN;
a p-type cladding layer which is arranged above the active layer and has a laminated structure of a GaN layer and an AlGaN layer and a ridge part;
a p-side electrode arranged above the ridge part; and
an insulating layer which is arranged above the p-type cladding and has an opening;
wherein the p-type cladding layer contains magnesium and hydrogen,
a width of the ridge part is 15 μm or more,
the p-side electrode is arranged at least in the opening; and
on a cross-section passing through the ridge part, in a region below the opening, the ridge part has a portion where a hydrogen concentration is 1×10 17 cm −3 or more and 1×10 18 cm −3 or less.
2. The semiconductor laser element according to claim 1 , wherein
a hydrogen concentration in the p-type cladding layer in a region below the p-side electrode is lower than a hydrogen concentration in the p-type cladding layer in a region other than the region below the p-side electrode.
3. The semiconductor laser element according to claim 2 , wherein the region below the p-side electrode is a region located below a portion of the p-side electrode arranged in the opening.
4. The semiconductor laser element according to claim 3 , further comprising:
a contact layer which is arranged above the p-type cladding layer and formed of a nitride semiconductor, wherein
the insulating layer is arranged above the contact layer, and
the p-side electrode is in contact with the contact layer in the opening.
5. The semiconductor laser element according to claim 3 , wherein
the opening is arranged above the ridge part, and
the p-side electrode is arranged above the ridge part.
6. The semiconductor laser element according to claim 5 , further comprising:
a contact layer which is arranged above the ridge part and formed of a nitride semiconductor, wherein
the p-side electrode is in contact with the contact layer in the opening.
7. The semiconductor laser element according to claim 1 , wherein
the active layer has a layer containing GaN.
8. The semiconductor laser element according to claim 1 , wherein
the active layer has: one or more layers containing InGaN; and one or more layers containing GaN, and
the one or more layers containing InGaN and the one or more layers containing GaN are alternately laminated.
9. The semiconductor laser element according to claim 1 , wherein
a width of the p-side electrode is 10 μm or more and 150 μm or less.
10. The semiconductor laser element according to claim 1 , wherein
as the ridge part, the p-type cladding layer has a plurality of ridge parts.
11. A semiconductor laser element, comprising:
a substrate; and
an array part having three or more light-emitting element parts which are arrayed in parallel to a main surface of the substrate above the main surface and each of which emits light, wherein
each of the three or more light-emitting element parts includes: on the substrate, an n-type cladding layer containing AlGaN, an active layer containing InGaN, and a p-type cladding layer formed arranged above the active layer and having a laminated structure of a GaN layer and an AlGaN layer, which are arranged in stated order from closest to furthest from the substrate,
the p-type cladding layer contains magnesium and hydrogen, and
a concentration of the hydrogen in the p-type cladding layer of the light-emitting element part included in the three or more light emitting element parts and located on a side closer to a center of the array part is lower than a concentration of the hydrogen in the p-type cladding layer of the light-emitting element part included in the three or more light emitting element parts and located on a side closer to an end part of the array part than the light-emitting element part included in the three or more light emitting element parts and located on the side closer to the center of the array part.
12. The semiconductor laser element according to claim 11 , wherein
the active layer has a layer containing GaN.
13. The semiconductor laser element according to claim 11 , wherein
the active layer has: one or more layers containing InGaN; and one or more layers containing GaN, and
the one or more layers containing InGaN and the one or more layers containing GaN are alternately laminated.
14. The semiconductor laser element according to claim 11 , wherein
each of the three or more light-emitting parts further includes a p-side electrode disposed above the p-type cladding layer, and
a width of the p-side electrode is 10 μm or more and 150 μm or less.