Method for detecting and removing buildup on a component, system and computer program

1. A method for removing buildup from a component, said method comprising:

imparting a first vibration to an exterior surface of a component, said component subject to a buildup on an interior surface of said component, said component comprising a hopper, or a grinding tube of a mill;

detecting the first vibration of the component by a sensor operably connected to the exterior surface of the component;

providing a sensor signal from the sensor to a control device;

analyzing the sensor signal by the control device;

detecting whether the buildup is present on the interior surface of the component based upon analysis of the sensor signal; and

imparting a second vibration to the exterior surface of the component to remove the buildup on the interior surface of the component when the buildup on the interior surface of the component has been detected, wherein the second vibration is caused by impulses imparted to the component with a continuous increase in frequency of the second vibration as a function of time such that a time interval between said impulses decreases, wherein the continuous increase in the frequency of the second vibration results in excitation of resonance frequencies of the component.

2. The method of claim 1 , wherein the sensor determines a frequency, an amplitude and/or a phase of the first vibration and provides the sensor signal based on the frequency, amplitude and/or phase.

3. The method of claim 1 , wherein the first and second vibrations are imparted by an excitation unit, an amplitude of the first vibration being lower than an amplitude of the second vibration.

4. The method of claim 1 , wherein the first vibration is excited by a first excitation unit and the second vibration is excited by a second excitation unit.

5. The method of claim 1 , wherein a presence of the buildup is determined based on a variance in a Fourier spectrum of the sensor signal.

6. The method of claim 1 , wherein at least one of the first vibration and the second vibration is imparted at a frequency which increases from 0.1 Hz to 1 kHz.

7. The method of claim 1 , wherein at least one of the first vibration and the second vibration is imparted at a frequency which increases from 1 to 50 Hz.

8. The method of claim 1 , wherein the first vibration is caused by impulses imparted to the component.

9. The method of claim 4 , wherein the first excitation unit and/or the second excitation unit impart the first and second vibrations, respectively, to the component at a resonance frequency of the component.

10. A computer program for removing buildup from a component, said computer program embodied in a non-transitory computer readable medium, wherein the computer program, when loaded into a processor unit and executed by the processor unit, causes the processor unit to perform the steps of:

imparting a first vibration to a component, said component subject to a buildup on an interior surface of said component, said component comprising a hopper or a grinding tube of a mill,

detecting the first vibration of the component by a sensor operably connected to the exterior surface of the component,

providing a sensor signal by the control device,

detecting whether the buildup is present on the interior surface of the component based upon analysis of the sensor signal, and

imparting a second vibration to the exterior surface of the component to remove the buildup on the interior surface of the component when the buildup on the interior surface of the component has been detected, wherein the second vibration is caused by impulses imparted to the component with a continuous increase in frequency of the second vibration as a function of time such that a time interval between said impulses decreases, wherein the continuous increase in the frequency of the second vibration results in excitation of resonance frequencies of the component.