IP Library Granted Patent US 11,127,695
Granted Patent B2
US 11,127,695 · App. 16/648,102 · Granted Sep 21, 2021

Power conversion device for reducing an inductance difference between control signal wires of a power semiconductor and suppressing a current unbalancing of the control signals

Inventors: Akihiro Namba (Tokyo, JP); Takashi Hirao (Tokyo, JP); Masami Oonishi (Tokyo, JP)
Assignee: HITACHI AUTOMOTIVE SYSTEMS, LTD.
H01L23/645H01L23/3672H01L23/49844H01L24/48H01L25/072H01L25/16H01L2224/48225H01L2924/1207H01L2924/13055H01L2924/14252H01L2924/30107
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Quick Facts
Patent No.
US 11,127,695
App. No.
16/648,102
Granted
Sep 21, 2021
Kind
B2
Abstract

A power conversion device includes first and second power semiconductor elements, and a circuit for transferring a drive signal of the first and second power semiconductor elements. The circuit board includes a first emitter wire which is formed along an arranging direction of the first power semiconductor element and the second power semiconductor element, a first gate wire which is disposed between the first power semiconductor element and the first emitter wire, a second gate wire which is disposed between the second power semiconductor element and the emitter wire, a third gate wire which is disposed to face the first gate wire and the second gate wire with the emitter wire interposed between the third gate wire and the first gate wire and the second gate wire, and a first gate resistor which connects the first gate wire and the third gate wire over the first emitter wire.

Claims (22)

1. A power conversion device, comprising:

a first power semiconductor element;

a second power semiconductor element; and

a circuit board which includes a circuit to transfer a drive signal of the first power semiconductor element and the second power semiconductor element,

wherein the circuit board includes

a first emitter wire which is formed along an arranging direction of the first power semiconductor element and the second power semiconductor element,

a first gate wire which is disposed between the first power semiconductor element and the first emitter wire,

a second gate wire which is disposed between the second power semiconductor element and the first emitter wire,

a third gate wire which is disposed to face the first gate wire and the second gate wire with the first emitter wire interposed between the third gate wire and the first gate wire and the second gate wire, and

a first gate resistor which connects the first gate wire and the third gate wire over the first emitter wire.

2. The power conversion device according to claim 1 , wherein the circuit board includes a second gate resistor which connects the second gate wire and the third gate wire over the first emitter wire.

3. A power conversion device, comprising:

a first power semiconductor element;

a second power semiconductor element; and

a circuit board which includes a circuit to transfer a drive signal of the first power semiconductor element and the second power semiconductor element,

wherein the circuit board includes

a first emitter wire and a second emitter wire which are formed in a traversing direction with respect to an arranging direction of the first power semiconductor element and the second power semiconductor element,

a first gate wire which is disposed between the first power semiconductor element and the first emitter wire,

a fourth gate wire which is disposed between the second power semiconductor element and the second emitter wire,

a third gate wire which is disposed between the first emitter wire and the second emitter wire, and

a first gate resistor which connects the first gate wire and the third gate wire over the first emitter wire.

4. The power conversion device according to claim 3 , wherein the circuit board includes a second gate resistor which connects the fourth gate wire and the third gate wire over the second emitter wire.

Assignments (2)
CHANGE OF NAME Recorded Nov 22, 2021
From: HITACHI AUTOMOTIVE SYSTEMS, LTD.
To: HITACHI ASTEMO, LTD.
Reel/Frame 058598/0321 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 17, 2020
From: NAMBA, AKIHIRO; HIRAO, TAKASHI; OONISHI, MASAMI
To: HITACHI AUTOMOTIVE SYSTEMS, LTD.
Reel/Frame 052142/0906 →
Priority Claims (1)
JP JP2017-189404 · Sep 29, 2017 · national
Continuity (1)
Related Publication 20200258853A1 · Aug 13, 2020