Light emitting device and manufacturing method thereof
The present invention relates to the field of automotive lamps, particularly a method for manufacturing a light emitting device ( 10 ) for use in automotive lamps. The method comprises: providing a base substrate ( 11 ) with a LED die ( 12 ) and one or more electrical components ( 13 ) attached thereon into a first mold; melting and injecting an optical transparent material over the LED die ( 12 ) to form an optical structure ( 14 ); removing the base substrate ( 11 ) from the first mold once the optical transparent material is partially solidified; providing the base substrate ( 11 ) into a second mold different from the first mold; and melting and injecting a thermally conductive material into the second mold while the optical transparent material is not fully solidified, such that an intimate connection is formed between the thermally conductive material and the optical transparent material. The present invention further discloses the light emitting device ( 10 ) per se.
1. A method for manufacturing a light emitting device, comprising steps of:
providing a base substrate with a LED die and one or more electrical components attached thereon into a first mold,
melting and injecting an optical transparent material over the LED die to form an optical structure,
removing the base substrate from the first mold once the optical transparent material is partially solidified,
providing the base substrate into a second mold different from the first mold, and
melting and injecting a thermally conductive material into the second mold while the optical transparent material is not fully solidified, for forming a thermally conductive body over the one or more electrical components, and such that an intimate connection is formed between the thermally conductive material and the optical transparent material.
2. The method for manufacturing the light emitting device in accordance with claim 1 , further comprising:
curing completely the optical transparent material and the thermally conductive material.
3. The method for manufacturing the light emitting device in accordance with claim 1 , further comprising:
a step of cooling, after melting and injecting the optical transparent material or the thermally conductive material.
4. The method for manufacturing the light emitting device in accordance with claim 1 , wherein
the step of melting and injecting the thermally conductive material results in an encapsulation of the one or more electrical components outside the optical structure by the thermally conductive material.
5. The method for manufacturing the light emitting device in accordance with claim 1 , wherein
the step of melting and injecting the thermally conductive material occurs 1-10 seconds after the step of melting and injecting the optical transparent material.
6. The method for manufacturing the light emitting device in accordance with claim 1 , wherein
the thermally conductive material comprises a non-transparent material.
7. The method for manufacturing the light emitting device in accordance with claim 1 , wherein
the thermally conductive material and the optical transparent material are made of a same base material.
8. The method for manufacturing the light emitting device in accordance with claim 1 , wherein
the thermally conductive material and the optical transparent material are both in a liquid or gelatinous state when encountering each other.
9. The method for manufacturing the light emitting device in accordance with claim 1 , wherein
the optical transparent material is melted and injected at a temperature ranging from 140° C. to 250° C. for a time duration ranging from 10 seconds to 200 seconds.
10. The method for manufacturing the light emitting device in accordance with claim 1 , wherein
an injecting speed of the optical transparent material ranges from 0.1 mm/second to 5 mm/second.
11. The method for manufacturing the light emitting device in accordance with claim 2 , further comprising:
releasing a resulting light emitting device from the second mold.
12. The method for manufacturing the light emitting device in accordance with claim 1 , wherein
the thermally conductive material is melted and injected at a temperature ranging from 140° C. to 250° C. for a time duration ranging from 10 seconds to 200 seconds.
13. The method for manufacturing the light emitting device in accordance with claim 1 , wherein
an injecting speed of the thermally conductive material ranges from 0.1 mm/second to 5 mm/second.
14. The method for manufacturing the light emitting device in accordance with claim 1 , wherein
the thermally conductive material is epoxy or resin.
15. The method for manufacturing the light emitting device in accordance with claim 1 , wherein
the optical transparent material is epoxy or resin.
16. The method for manufacturing the light emitting device in accordance with claim 1 , wherein
the thermally conductive material and the optical transparent material are both in a liquid or gelatinous state when encountering each other, and are made of a same base material.