Microelectronic assemblies
Microelectronic assemblies, and related devices and methods, are disclosed herein. For example, in some embodiments, a microelectronic assembly may include a package substrate having a first surface and an opposing second surface, and a die secured to the package substrate, wherein the die has a first surface and an opposing second surface, the die has first conductive contacts at the first surface and second conductive contacts at the second surface, and the first conductive contacts are coupled to conductive pathways in the package substrate by first non-solder interconnects.
1. A microelectronic assembly, comprising:
a package substrate having a first surface and an opposing second surface;
a first die having a first surface and an opposing second surface, wherein the first surface of the first die is coupled to the second surface of the package substrate by first interconnects, and the first surface of the first die is at least partially between the second surface of the package substrate and the second surface of the first die; and
a second die having a first surface and an opposing second surface, wherein the first surface of the second die is coupled to the second surface of the package substrate by second interconnects, the first surface of the second die is coupled to the second surface of the first die by third interconnects, and the first surface of the second die is at least partially between the second surface of the package substrate and the second surface of the second die,
wherein the package substrate includes a recess, the first die is at least partially in the recess, and a portion of the second surface of the package substrate to which the first surface of the first die is coupled to by the first interconnects is a bottom of the recess.
2. The microelectronic assembly of claim 1 , wherein the first interconnects include an anisotropic conductive material or solder.
3. The microelectronic assembly of claim 1 , wherein the second interconnects include an anisotropic conductive material or solder.
4. The microelectronic assembly of claim 1 , wherein the third interconnects include solder or an anisotropic conductive material; or the third interconnects are plated interconnects.
5. A microelectronic assembly, comprising:
a package substrate having a first surface and an opposing second surface;
a first die embedded in the package substrate, wherein the first die has a first surface and an opposing second surface, the first die has first conductive contacts at the first surface and second conductive contacts at the second surface, the first conductive contacts are coupled to conductive pathways in the package substrate by first interconnects, and the second conductive contacts are coupled to conductive pathways in the package substrate by second interconnects; and
a second die having a first surface and an opposing second surface, wherein the first surface of the second die is coupled to the second surface of the package substrate by third interconnects, the first surface of the second die is at least partially between the second surface of the package substrate and the second surface of the second die, and the second die is at least partially above the first die,
wherein the second die includes third conductive contacts and fourth conductive contacts at its first surface, and the third conductive contacts have a pitch that is less than a pitch of the fourth conductive contacts.
6. The microelectronic assembly of claim 5 , wherein the third conductive contacts are above the first die.
7. The microelectronic assembly of claim 5 , wherein the package substrate includes conductive pathways between at least some of the third conductive contacts of the second die and at least some of the second conductive contacts of the first die.
8. The microelectronic assembly of claim 5 , wherein the fourth conductive contacts are not above the first die.
9. The microelectronic assembly of claim 5 , wherein the microelectronic assembly further includes at least one conductive pathway between the first surface of the package substrate and at least one of the fourth conductive contacts.
10. The microelectronic assembly of claim 9 , wherein the at least one conductive pathway is a power pathway.
11. The microelectronic assembly of claim 1 , further comprising conductive pathways between the first surface of the package substrate and the second surface of the package substrate, wherein at least one of the first interconnects is coupled to at least a first one of the conductive pathways.
12. The microelectronic assembly of claim 11 , wherein at least one of the second interconnects is coupled to at least a second one of the conductive pathways.
13. The microelectronic assembly of claim 1 , wherein the second interconnects are not surrounded by a material of the package substrate.
14. The microelectronic assembly of claim 1 , wherein the second surface of the package substrate is between the first surface of the package substrate and the second interconnects.
15. The microelectronic assembly of claim 1 , wherein the first interconnects are not surrounded on all sides by a material of the package substrate.
16. The microelectronic assembly of claim 1 , wherein a pitch of the first interconnects is different from a pitch of the second interconnects.
17. The microelectronic assembly of claim 1 , wherein the first die includes at least one transistor.
18. The microelectronic assembly of claim 1 , wherein the first die does not include a transistor.
19. The microelectronic assembly of claim 5 , wherein the microelectronic assembly further includes at least one conductive pathway between the first surface of the package substrate and at least one of the first conductive contacts.
20. The microelectronic assembly of claim 5 , wherein at least one of:
the first interconnects have a pitch between 10 microns and 100 microns, and
the second interconnects have a pitch between 80 microns and 300 microns.