IP Library Granted Patent US 11,127,871
Granted Patent B2
US 11,127,871 · App. 16/653,492 · Granted Sep 21, 2021

Structures and methods for forming electrodes of solar cells

Inventors: Paul W. Loscutoff (Castro Valley, CA); Hung-Ming Wang (San Jose, CA); Matthew J. Dawson (Menlo Park, CA); Mark A. Kleshock (Phoenix, AZ)
Assignee: SunPower Corporation
H01L31/05H01L25/042H01L31/186H01L31/1876
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Quick Facts
Patent No.
US 11,127,871
App. No.
16/653,492
Granted
Sep 21, 2021
Kind
B2
Abstract

Solar cells are attached together to form a plating assembly. The plating assembly is attached to a belt, which transports the plating assembly through a plating chamber where metal is electroplated on the solar cells. The electroplated metal is patterned to form metal contact fingers. After the metal is electroplated, the plating assembly is singulated to separate the two solar cells.

Claims (31)

1. A method of forming electrodes of solar cells, the method comprising:

applying a bonding agent on a first side of a first solar cell;

attaching the first side of the first solar cell to a first side of a second solar cell to form a plating assembly;

passing the plating assembly through a plating chamber to electroplate metal on a second side of the first solar cell and on a second side of the second solar cell of the plating assembly; and

singulating the plating assembly to separate the first solar cell from and the second solar cell.

2. The method of claim 1 , further comprising:

before attaching the first side of the first solar cell to the first side of the second solar cell to form the plating assembly, applying the bonding agent on the first side of the second solar cell.

3. The method of claim 1 , wherein applying the bonding agent on the first side of the first solar cell comprises:

applying the bonding agent around a rim of a surface on the first side of the first solar cell but not on an entirety of the surface on the first side of the first solar cell.

4. The method of claim 1 , wherein the bonding agent comprises an ink.

5. The method of claim 1 , wherein attaching the first side of the first solar cell to the first side of the second solar cell comprises:

heating the first solar cell, the second solar cell, and the bonding agent.

6. The method of claim 1 , wherein singulating the plating assembly to separate the first solar cell from the second solar cell comprises:

heating the plating assembly.

7. The method of claim 1 , wherein the first side of the first solar cell is a front side of the first solar cell and the first side of the second solar cell is a front side of the second solar cell.

8. The method of claim 1 , further comprising:

etching the second side of the first solar cell and the second side of the second solar cell to form metal contact fingers.

9. The method of claim 8 , wherein the metal contact fingers are interdigitated.

10. The method of claim 1 , wherein the metal comprises copper.

11. A method of forming electrodes of solar cells, the method comprising:

forming a plating assembly by attaching a first solar cell to a second solar cell;

attaching the plating assembly to a belt of a plating tool;

moving the belt of the plating tool to transport the plating assembly through a plating chamber and electroplate metal on the first solar cell and on the second solar cell of the plating assembly; and

separating the first solar cell from the second solar cell.

12. The method of claim 11 , wherein attaching the first solar cell to the second solar cell comprises:

bonding the first solar cell to the second solar cell by a bonding agent.

13. The method of claim 12 , wherein the bonding agent bonds a front side of the first solar cell to a front side of the second solar cell.

14. The method of claim 11 , further comprising forming metal contact fingers on the first solar cell and on the second solar cell.

15. The method of claim 14 , wherein the metal contact fingers are formed before separating the first solar cell from the second solar cell.

16. The method of claim 11 , wherein attaching the plating assembly to the belt of the plating tool comprises:

holding the plating assembly by a clip that is attached to the belt of the plating tool.

Assignments (5)
SECURITY INTEREST Recorded Jun 27, 2024
From: MAXEON SOLAR PTE. LTD.
To: DB TRUSTEES (HONG KONG) LIMITED
Reel/Frame 067924/0062 →
SECOND LIEN SECURITY INTEREST AGREEMENT Recorded Jun 26, 2024
From: MAXEON SOLAR PTE. LTD
To: DB TRUSTEES (HONG KONG) LIMITED
Reel/Frame 071343/0553 →
SECURITY INTEREST Recorded Jun 5, 2024
From: MAXEON SOLAR PTE. LTD.
To: DB TRUSTEES (HONG KONG) LIMITED
Reel/Frame 067637/0598 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 24, 2023
From: SUNPOWER CORPORATION
To: MAXEON SOLAR PTE. LTD.
Reel/Frame 062490/0742 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 5, 2019
From: LOSCUTOFF, PAUL W.; WANG, HUNG-MING; DAWSON, MATTHEW J.; KLESHOCK, MARK A.
To: SUNPOWER CORPORATION
Reel/Frame 050918/0283 →