Biocompatible electromechanical connection for ceramic substrate electronics for biomedical implant

1. A biocompatible electrical connector, comprising:

a substrate;

a ferrule comprising a concentric flange at a first end of the ferrule;

a first adhesive; and

a second adhesive,

wherein:

the substrate comprises a hole having a diameter that is a specified amount larger than an outside diameter of the ferrule forming an annular space between the hole and the ferrule,

the first adhesive adheres a first surface of the concentric flange of the ferrule to a first surface of the substrate, and

the second adhesive fills the annular space between the hole and the ferrule.

2. The biocompatible electrical connector of claim 1 , wherein the ferrule further comprises a substantially concentric through hole configured to accept a conductive wire lead.

3. The biocompatible electrical connector of claim 2 , wherein an electrical connection between the conductive wire lead and the ferrule is formed by a welded joint between the conductive wire lead and the ferrule around a circumference of the through hole.

4. The biocompatible electrical connector of claim 3 , wherein the welded joint is formed using one of a laser welding process and a resistive welding process.

5. The biocompatible electrical connector of claim 1 , wherein the substrate comprises a ceramic material.

6. The biocompatible electrical connector of claim 1 , wherein the ferrule comprises one of a platinum-iridium (Pt—Ir) material and an implant grade stainless steel.

7. The biocompatible electrical connector of claim 1 , wherein the first adhesive and the second adhesive comprise one of a platinum-gold ink and a ceramic-platinum-gold ink.

8. A method for forming a biocompatible electrical connection, the method comprising:

forming a hole in a substrate;

applying a first adhesive on a first surface of the substrate around a circumference of the hole;

inserting a ferrule comprising a concentric flange at a first end into the hole, wherein a diameter of the hole is a specified amount larger than an outside diameter of the ferrule forming an annular space between the hole and the ferrule, and wherein the first adhesive adheres a first surface of the concentric flange to a first surface of the substrate;

filling the annular space between the hole and the ferrule with a second adhesive; and

curing the first adhesive and the second adhesive to form a bond between the ferrule and the substrate.

9. The method of claim 8 , wherein the curing the first adhesive and the second adhesive comprises:

firing the substrate with the first adhesive applied to the substrate and the ferrule inserted; and

firing the substrate again with the annular space between the hole and the ferrule filled with the second adhesive.

10. The method of claim 8 , further comprising:

inserting a conductive wire lead into a substantially concentric through hole in the ferrule; and

forming a welded joint between the conductive wire lead and the ferrule around a circumference of the through hole.

11. The method of claim 10 , wherein the forming a welded joint comprises using one of a laser welding process and a resistive welding process to weld the conductive wire lead and the ferrule.

12. The method of claim 8 , wherein the applying a first adhesive comprises using a screen printing process to apply the first adhesive to the substrate around the circumference of the hole.

13. The method of claim 8 , wherein the filling the annular space comprises using a syringe to inject the first adhesive into the annular space.

14. The method of claim 8 , wherein the substrate comprises a ceramic material.

15. The method of claim 8 , wherein the ferrule comprises one of a platinum-iridium (Pt—Ir) material and an implant grade stainless steel.

16. The method of claim 8 , wherein the first adhesive and the second adhesive comprise one of a platinum-gold ink and a ceramic-platinum-gold ink.

17. A biocompatible device, comprising:

electronic circuitry enclosed in a conductive biocompatible housing; and

a biocompatible antenna disposed external to the conductive biocompatible housing and electrically connected to the electronic circuitry; and

a biocompatible electrical connector configured to electrically connect the biocompatible antenna to the electronic circuitry,

wherein the biocompatible electrical connector comprises:

a ferrule having a concentric flange at a first end of the ferrule;

a first adhesive;

a second adhesive; and

a substrate comprising a hole having a diameter that is a specified amount larger than an outside diameter of the ferrule forming an annular space between the hole and the ferrule,

wherein the first adhesive adheres a first surface of the concentric flange of the ferrule to a first surface of the substrate, and

wherein the second adhesive fills the annular space between the hole and the ferrule.

18. The biocompatible device of claim 17 , wherein the ferrule further comprises a substantially concentric through hole configured to accept a conductive wire lead.

19. The biocompatible device of claim 18 , wherein an electrical connection between the conductive wire lead and the ferrule is formed by a welded joint between the conductive wire lead and the ferrule around a circumference of the through hole.

20. The biocompatible device of claim 19 , wherein the welded joint is formed using one of a laser welding process and a resistive welding process.