Circuit assembly
The invention describes a circuit assembly comprising a circuit board with a metal core, a pattern of conductive tracks, and a dielectric layer between the metal core and the conductive tracks; at least one circuit component mounted to the circuit board by means of solder interconnects, wherein a solder interconnect is formed between a contact pad of the circuit component and a conductive track; characterized in that the metal core comprises at least one cavity, wherein a cavity is arranged in the vicinity of a solder interconnect. The invention further describes a circuit board for such a circuit assembly, and a method of manufacturing such a circuit assembly.
1. A device comprising:
a circuit board comprising:
a metal core comprising a flat rectangular metal plate and at least two blind holes having a right cylindrical shape,
a pattern of conductive tracks, and
a dielectric layer between the metal core and the conductive tracks;
at least one circuit component adjacent the circuit board and comprising at least two contact pads; each contact pad including a respective corresponding solder bond interconnecting the corresponding contact pad of the circuit component and a respective corresponding one of the conductive tracks of the circuit board, wherein each respective corresponding solder bond is aligned with a respective corresponding one of the at least two blind holes of the metal core.
2. The device according to claim 1 , wherein the metal core and the dielectric layer meet at an interface, and each of the at least one two blind holes has a longitudinal axis that is essentially perpendicular to the horizontal plane of the interface.
3. The device according to claim 1 , wherein each of the at least two blind holes is disposed directly under a respective corresponding one of the solder bonds.
4. The device according to claim 1 , wherein the metal core is made of aluminum.
5. The device according to claim 1 , wherein at least one of the at least two blind holes has a maximum cross-sectional area of 2.5 mm2.
6. The device according to claim 1 , wherein at least one of the at least two blind holes has a minimum cross-sectional area of 0.05 mm2.
7. The device according to claim 1 , wherein at least one of the at least two blind holes is disposed directly under the corresponding solder bond.
8. The device according to claim 1 , wherein at least one of the at least two blind holes extends partially through the metal core from a lower surface of the metal core towards the dielectric layer.
9. The device according to claim 1 , wherein the at least one circuit component further comprises a plurality of LEDs on a ceramic carrier.
10. A circuit board comprising:
a metal core comprising a flat rectangular metal plate and at least one two blind holes having a right cylindrical shape;
a dielectric layer on a surface of the metal core; and
a pattern of conductive tracks on the dielectric layer, each of the conductive tracks comprising a respective corresponding interconnect region, each respective corresponding interconnect region disposed over a respective corresponding one of the at least two blind holes of the metal core.
11. The circuit board of claim 10 , wherein the metal core and the dielectric layer intersect at a horizontally planar interface, and each of the at least two blind holes has a longitudinal axis that is essentially perpendicular to a horizontal plane of the horizontally planar interface.
12. The circuit board of claim 10 , wherein at least one of the at least two blind holes is aligned directly under a corresponding solder interconnect region.
13. The circuit board of claim 10 , wherein the metal core is made of aluminum.
14. The circuit board of claim 10 , wherein each of the at least one blind holes is disposed directly under a corresponding solder interconnect.
15. The circuit board of claim 10 , wherein at least one of the at least two blind holes extends partially through the metal core from a lower surface of the metal core towards the dielectric layer.
16. The device according to claim 1 , wherein at least one of the at least two blind holes is un-filled.
17. The device according to claim 1 , wherein at least one of the at least two blind holes is filled with a thermal grease.
18. The circuit board according to claim 10 , wherein at least one of the at least two blind holes is un-filled.
19. The circuit board according to claim 10 , wherein at least one of the at least two blind holes is filled with a thermal grease.