Transition in a multi-layer substrate between a substrate integrated waveguide portion and a coplanar waveguide portion
Transitional elements to offset a capacitive impedance in a transmission line are disclosed. Described are various examples of transitional elements in a multilayer substrate that introduce a transitional reactance to cancel the transmission line capacitive effects. The transitional elements reduce insertion loss.
1. An integrated circuit, comprising:
a plurality of layers of different compositions comprising at least one conductive material and at least one dielectric material;
substrate integrated waveguide (SIW) portions coupled to the plurality of layers;
coplanar waveguide (CPW) portions coupled to the SIW portions;
at least one electromagnetic signal path formed within the plurality of layers; and
at least one transition coupling the SIW portions and the CPW portions, wherein the at least one transition has a width larger than the SIW portions.
2. The integrated circuit of claim 1 , wherein each of the at least one transition comprises a respective transition element coupled to a corresponding conductor.
3. The integrated circuit of claim 2 , wherein the respective conductor of the at least one transition is coupled to at least one of the CPW portions.
4. The integrated circuit of claim 2 , wherein the respective conductor of the at least one transition is formed within at least a portion of the plurality of layers.
5. The integrated circuit of claim 2 , wherein the respective transition element of each of the at least one transition comprises a respective resistive component and a respective inductive component that offsets a respective capacitive component of at least one of the SIW portions.
6. The integrated circuit of claim 2 , wherein the respective transition element of each of the at least one transition has dimensions configured to provide an inductance.
7. The integrated circuit of claim 2 , wherein the respective transition element of each of the at least one transition has different dimensions than the SIW portions.
8. The integrated circuit of claim 1 , wherein the integrated circuit is an antenna device.
9. The integrated circuit of claim 8 , wherein the antenna device is employed in an autonomous vehicle.
10. The integrated circuit of claim 1 , wherein at least one of the SIW portions is positioned within an antenna array layer of the plurality of layers and forms a slotted antenna.
11. A transition in a multilayer substrate, comprising:
a substrate integrated waveguide (SIW) portion in a first layer of the multilayer substrate;
a coplanar waveguide (CPW) portion on a second layer of the multilayer substrate, wherein the second layer is different from the first layer;
a conductor coupled to the CPW portion and through the first and second layers; and
a transition element configured to couple the SIW portion to the conductor.
12. The transition of claim 11 , wherein the transition element has a width larger than the SIW portion.
13. The transition of claim 11 , wherein the conductor is formed within at least a portion of a plurality of layers of the multilayer substrate.
14. The transition of claim 11 , wherein the transition element comprises a resistive component and an inductive component that offsets a capacitive component of the SIW portion.
15. The transition of claim 11 , wherein the transition element has dimensions configured to provide an inductance.
16. The transition of claim 11 , wherein the transition element has different dimensions than the SIW portion.
17. The transition of claim 11 , wherein the multilayer substrate is an antenna device.
18. The transition of claim 17 , wherein the antenna device is employed in an autonomous vehicle.
19. The transition of claim 11 , wherein the SIW portion is positioned within an antenna array layer of the multilayer substrate and forms a slotted antenna.
20. A process for preparing a connection in a multilayer substrate, comprising:
determining connecting layers of the multilayer substrate;
determining a transmission line reactance of the connecting layers; and
generating a transition having a reactance to offset the transmission line reactance by using design constraints and operational parameters of the multilayer substrate,
wherein the design constraints comprise at least one of a height or elevation of the multilayer substrate, a layout of circuitry, transition points, a type of transmission lines coupled, or dimensions of the transmission line, and
wherein the operational parameters comprise at least one of a frequency of operation, a bandwidth, or a return loss.