Plastic composite lens array in optical networks

1. An optoelectronic assembly comprising:

a printed circuit board (PCB) including a top surface, at least a portion of the top surface including a first material with a first coefficient of thermal expansion (CTE); and

an optical lens including:

a lens frame coupled to the top surface of the PCB, the lens frame including a second material with a second coefficient of thermal expansion (CTE), the second material being different from the first material; and

an optical portion positioned within the lens frame, the optical portion including a third material with a third coefficient of thermal expansion (CTE), the third material being different from the first material and the second material, and the third material being optically transparent,

wherein the first CTE of the first material and the second CTE of the second material are similar or identical; and

wherein the third CTE of the third material is higher than at least the second CTE of the second material.

2. The optoelectronic assembly of claim 1 , wherein the second material of the lens frame is configured to reduce lateral displacement of the optical lens in a direction parallel to the top surface of the PCB when the optoelectronic assembly is heated during epoxy curing and/or operation.

3. The optoelectronic assembly of claim 1 , wherein the second material of the lens frame is configured to reduce a bending stress of the optical lens when the optoelectronic assembly is heated during epoxy curing and/or operation.

4. The optoelectronic assembly of claim 1 , wherein the lens frame is coupled to the top surface of the PCB via an epoxy bond cured at about 150° Celsius.

5. The optoelectronic assembly of claim 4 , wherein during curing of the epoxy bond, the second material of the lens frame is configured to limit lateral displacement of the optical lens in a direction parallel to the top surface of the PCB to be an amount of lateral displacement in a closed range of [−12 μm, 12 μm].

6. The optoelectronic assembly of claim 1 , wherein:

the lens frame includes legs extending from a bottom surface of the lens frame; and the lens frame is coupled to the top surface of the PCB with an epoxy bond between

the legs and the top surface of the PCB.

7. The optoelectronic assembly of claim 1 , wherein under an operational temperature of 75° Celsius, the second material of the lens frame is configured to limit bending stress of the optical lens to be an amount of bending stress in a closed range of [0 MPa, 50 MPa].

8. An optoelectronic assembly comprising:

a printed circuit board (PCB) including a top surface, at least a portion of the top surface including a first material with a first thermal property; and

an optical lens including:

a lens frame coupled to the top surface of the PCB, the lens frame including a second material with a second thermal property, the second material being different from the first material, wherein the second material includes polyether ether ketone (PEEK); and

an optical portion positioned within the lens frame, the optical portion including a third material with a third thermal property, the third material being different from the first material and the second material, and the third material being optically transparent.

9. The optoelectronic assembly of claim 8 , wherein:

the first thermal property of the first material, the second thermal property of the second material, and the third thermal property of the third material include a respective coefficient of thermal expansion (CTE);

the CTE of the first material and the CTE of the second material are similar or identical; and

the CTE of the third material is higher than at least the CTE of the second material.

10. The optoelectronic assembly of claim 8 , wherein the second material further includes glass fiber.

11. A method to manufacture an optoelectronic assembly, the method comprising:

forming an optical lens that includes:

a lens frame including a lens frame material with a first coefficient of thermal expansion (CTE); and

an optical portion positioned within the lens frame, the optical portion including an optical portion material with a second coefficient of thermal expansion (CTE), the optical portion material being different from the lens frame material, and the optical portion material being optically transparent; and

coupling the optical lens to a top surface of a printed circuit board (PCB) that includes a PCB material with a third coefficient of thermal expansion (CTE),

wherein coupling the optical lens to the top surface of the PCB comprises coupling the lens frame to the top surface of the PCB;

the third CTE of the PCB material and the first CTE of the lens frame material are similar or identical; and

the second CTE of the optical portion material is higher than the first CTE of the lens frame material.

12. The method of claim 11 , wherein the lens frame material of the lens frame is configured to reduce lateral displacement of the optical lens in a direction parallel to the top surface of the PCB when the optoelectronic assembly is heated during epoxy curing and/or operation.

13. The method of claim 11 , wherein the lens frame material of the lens frame is configured to reduce a bending stress of the optical lens when the optoelectronic assembly is heated during epoxy curing and/or operation.

14. The method of claim 11 , wherein coupling the optical lens to the top surface of the PCB includes coupling the lens frame to the top surface of the PCB via an epoxy bond cured at about 150° Celsius.

15. The method of claim 14 , wherein during curing of the epoxy bond, the lens frame material of the lens frame is configured to limit lateral displacement of the optical lens in a direction parallel to the top surface of the PCB to be an amount of lateral displacement in a closed range of [−12 μm, 12 μm].

16. The method of claim 11 , wherein:

the lens frame includes legs extending from a bottom surface of the lens frame; and coupling the optical lens to the top surface of the PCB includes coupling the lens frame to the top surface of the PCB via an epoxy bond between the legs and the top surface of the PCB.

17. The method of claim 11 , wherein under an operational temperature of 75° Celsius, the lens frame material of the lens frame is configured to limit bending stress of the optical lens to be an amount of bending stress in a closed range of [0 MPa, 50 MPa].

18. A method to manufacture an optoelectronic assembly, the method comprising:

forming an optical lens that includes:

a lens frame including a lens frame material with a lens frame thermal property, wherein the lens frame material includes polyether ether ketone (PEEK); and

an optical portion positioned within the lens frame, the optical portion including an optical portion material with an optical portion thermal property, the optical portion material being different from the lens frame material, and the optical portion material being optically transparent; and

coupling the optical lens to a top surface of a printed circuit board (PCB) that includes a PCB material with a PCB thermal property, wherein coupling the optical lens to the top surface of the PCB comprises coupling the lens frame to the top surface of the PCB.

19. The method of claim 18 , wherein:

the PCB thermal property of the PCB material, the lens frame thermal property of the lens frame material, and the optical portion thermal property of the optical portion material include a respective coefficient of thermal expansion (CTE);

the CTE of the PCB material and the CTE of the lens frame material are similar or identical; and

the CTE of the optical portion material is higher than the CTE of the lens frame material.

20. The method of claim 18 , wherein the lens frame material further includes glass fiber.