Signal delivery in stacked device
Some embodiments include apparatus, systems, and methods having a base, a first die, a second arranged in a stacked with the first die and the base, and a structure located in the stack and outside at least one of the first and second dice and configured to transfer signals between the base and at least one of the first and second dice.
1. A method comprising:
receiving signals at a base of an integrated circuit package, the integrated circuit package including a first device and a second device, the second device arranged in a stack with the first device and the base, the first device including at least one conductive path at least partly through the first device;
transferring at least one subset of the signals from the base to the second device using conductive paths of a structure inside the stack and outside the first device and the second device, at least a portion of the conductive paths of the structure going through vias of the structure, wherein the first device includes a memory device;
the integrated circuit package including an interposer located between and coupled to the first device and the second device;
the structure including a first structure portion located on a first side of the first device, and a second structure portion located on a second side of the first device; and
the conductive paths including a first portion of conductive paths going through vias of the first structure portion, and a second portion of conductive paths going through vias of the second structure portion.
2. The method of claim 1 , wherein transferring at least one subset of the signals includes transferring at least one data signal of the signals from the base to the second device and transferring at least one power signal of the signals from the base to the second device.
3. The method of claim 1 , further comprising:
transferring an additional subset of the signals from the base to the first device; and
transferring the additional subset of the signals from the first device to the second device.
4. The method of claim 3 , wherein transferring the additional subset of the signals from the first device to the second device includes transferring the additional subset of the signals from the first device to a portion of the structure, and transferring the additional subset of the signals from the portion of the structure to the second device.
5. The method of claim 3 , wherein transferring the additional subset of the signals from the first device to the second device includes transferring the additional subset of the signals through at least one vias of at least one stack of dice of the first device.
6. The method of claim 3 , wherein at least one signal of the additional subset of the signals is transferred through a conductive path inside a via of the first device.
7. The method of claim 1 , wherein one of the signals is transferred through a conductive path inside a via of the structure.
8. The method of claim 1 , wherein the signals include only data signals.
9. The method of claim 1 , wherein the memory device includes dice arranged in a stack over the base.
10. The method of claim 9 , wherein the second device includes a processor.
11. The method of claim 10 , further comprising:
transferring additional signals from the base to the memory device;
transferring the additional signals from the memory device to the structure; and
transferring the additional signals from the structure to the processor.
12. A method comprising:
receiving signals at a base of an integrated circuit package, the integrated circuit package including a first device and a second device, the second device arranged in a stack with the first device and the base, the first device including at least one conductive path at least partly through the first device;
transferring at least one subset of the signals from the base to the second device using conductive paths of a structure inside the stack and outside at least one of the first device and the second device, at least a portion of the conductive paths of the structure going through vias of the structure, wherein the integrated circuit package includes an interposer located between and coupled to the first device and the second device, and transferring at least one subset of the signals includes transferring only power signals from the base to the second device through the interposer.
13. A method comprising:
receiving signals at a base of an integrated circuit package, the integrated circuit package including a first device and a second device, the second device arranged in a stack with the first device and the base, the first device including at least one conductive path at least partly through the first device;
transferring at least one subset of the signals from the base to the second device using conductive paths of a structure inside the stack and outside the first device and the second device, at least a portion of the conductive paths of the structure going through vias of the structure, wherein the first device includes a memory device;
the integrated circuit package including an interposer located between and coupled to the first device and the second device;
the structure including a first structure portion located on a first side of the first device, and a second structure portion located on a second side of the first device;
the conductive paths including a first portion of conductive paths going through vias of the first structure portion, and a second portion of conductive paths going through vias of the second structure portion;
transferring an additional subset of the signals from the base to the first device; and
transferring the additional subset of the signals from the first device to the second device, wherein the additional subset of the signals excludes power signals.
14. A method comprising:
receiving signals at a base of an integrated circuit package, the integrated circuit package including a first device and a second device, the second device arranged in a stack with the first device and the base, the first device including at least one conductive path at least partly through the first device;
transferring at least one subset of the signals from the base to the second device using conductive paths of a structure inside the stack and outside at least one of the first device and the second device, at least a portion of the conductive paths of the structure going through vias of the structure, wherein the signals exclude power signals;
the integrated circuit package including an interposer located between and coupled to the first device and the second device;
the structure including a first structure portion located on a first side of the first device, and a second structure portion located on a second side of the first device; and
the conductive paths including a first portion of conductive paths going through vias of the first structure portion, and a second portion of conductive paths going through vias of the second structure portion.