Bonding corners of light emitting diode chip to substrate using laser
A light emitting diode (LED) chip is bonded to a substrate. The LED chip includes a plurality of electrodes that each corresponds to a contact on the substrate. The plurality of electrodes are exposed to one or more laser beams for coupling the LED chip to the substrate. The laser beams may be directed to one or more edges or corners of the plurality of electrodes, where the edges or corners lie outside emission areas of LEDs on the LED chip.
1. A method comprising:
placing an electrode of at least one light emitting diode (LED) on a contact of a substrate, each of the at least one LED comprising an emission area; and
bonding the electrode of the at least one LED to the contact of the substrate by exposing one or more edges or corners of the electrode of the at least one LED outside the emission area to one or more laser beams, wherein a substantial portion of the emission area is not exposed to the one or more laser beams.
2. The method of claim 1 , further comprising controlling trajectory of the one or more laser beams so that four corners of the electrode of the at least one LED are sequentially exposed to the one or more laser beams.
3. The method of claim 1 , wherein the at least one LED is part of an LED chip including a plurality of LEDs.
4. The method of claim 3 , further comprising:
testing operability of the plurality of LEDs by applying signals to electrodes of the LED chip;
determining a subset of the plurality of LEDs including the at least one LED that are operable; and
selectively exposing edges or corners of electrodes of the subset of the LEDs to one or more laser beams to bond the electrodes of the subset of the LEDs to the substrate.
5. The method of claim 4 , wherein the edges or corners of the electrodes of the subset of the LEDs are sequentially exposed to the one or more laser beams.
6. The method of claim 3 , wherein each of the plurality of LEDs emit light of a same color.
7. The method of claim 3 , further comprising bonding one or more common electrodes of the LED chip to corresponding one or more contacts on the substrate by exposing the one or more common electrodes of the LED chip to the one or more laser beams.
8. The method of claim 7 , wherein the one or more common electrodes are provided at a periphery of the LED chip.
9. The method of claim 1 , wherein the one or more laser beams are projected in a direction that forms an angle smaller than 90 degrees relative to a surface of the substrate.
10. The method of claim 1 , wherein a portion of the emission area not exposed to the one or more laser beams is larger than another portion of the emission area exposed to the one or more laser beams.
11. A non-transitory computer readable storage medium storing instructions thereon, the instructions when executed by a processor cause the processor to:
place an electrode of at least one light emitting diode (LED) on a contact of a substrate, each of the at least one LED comprising an emission area; and
bond the electrode of the at least one LED to the contact of the substrate by exposing one or more edges or corners of the electrode of at least one LED outside the emission area to one or more laser beams, wherein a substantial portion of the emission area is not exposed to the one or more laser beams.
12. The non-transitory computer readable storage medium of claim 11 , storing further instructions that cause the processor to:
control trajectory of the one or more laser beams so that four corners of the electrode of the at least one LED are sequentially exposed to the one or more laser beams.
13. The non-transitory computer readable storage medium of claim 11 , wherein the at least one LED is part of an LED chip including a plurality of LEDs.