IP Library Granted Patent US 11,444,453
Granted Patent B2
US 11,444,453 · App. 16/667,937 · Granted Sep 13, 2022

Electrostatic discharge protection circuit

Inventor: Je Cheol Moon (Seongnam-si, KR)
Assignee: Dialog Semiconductor Korea Inc.
H02H9/04
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Quick Facts
Patent No.
US 11,444,453
App. No.
16/667,937
Granted
Sep 13, 2022
Kind
B2
Abstract

An ESD protection circuit is provided. An embodiment provides an ESD protection circuit of a crystal oscillator for bearing an output swing level in an ESD IO for improving a reference clock isolation by adding a stacked diode to the ESD protection circuit and for improving a protection function by applying a secondary diode structure.

Claims (24)

1. An electrostatic discharge (ESD) protection circuit comprising:

a first rectifier unit including a first stacked diode generated by connecting a plurality of rectifier elements in a form of a stack and a first reversed diode, and configured to connect another end of the first stacked diode and another end of the first reversed diode to a common ground;

a second rectifier unit including a second stacked diode generated by connecting a plurality of rectifier elements in a form of a stack and a second reversed diode, and configured to connect another end of the second stacked diode and another end of the second reversed diode to the common ground,

a second stage ESD protection circuit including a fourth resistance (R 4 ) connected to one side of a crystal oscillator, a third rectifier unit connected to the fourth resistance (R 4 ), a sixth resistance (R 6 ) connected to another side of the crystal oscillator, and a fourth rectifier unit connected to the sixth resistance (R 6 ); and

a first stage ESD protection circuit including a fifth resistance (R 5 ) connected to a contact of the fourth resistance (R 4 ) and the third rectifier unit, the first rectifier unit connected to the fifth resistance (R 5 ), a seventh resistance (R 7 ) connected to a contact of the sixth resistance (R 6 ) and the fourth rectifier unit, and the second rectifier unit connected to the seventh resistance (R 7 ),

wherein an electrostatic shock applied to an input and output (IO) port of the first rectifier unit and the second rectifier unit flows to a discharge path according to an operation mode and the electrostatic shock is discharged to the common ground.

2. The ESD protection circuit as claimed in claim 1 , wherein one end of the fifth resistance (R 5 ) is connected to a contact of another end of the fourth resistance (R 4 ) and one end of the third rectifier unit, and another end of the fifth resistance (R 5 ) is connected to one end of a quartz crystal, and

wherein one end of the first rectifier unit is connected to a contact of another end of the fifth resistance (R 5 ) and one end of the quartz crystal, and the other end of the first rectifier unit is connected to the common ground.

3. The ESD protection circuit as claimed in claim 1 , wherein the first rectifier unit includes a first diode (D 1 ), a second diode (D 2 ), a third diode (D 3 ), and a fourth diode (D 4 ),

wherein a contact of an anode of the first diode (D 1 ) and a cathode of the fourth diode (D 4 ) is connected to a contact of another end of the fifth resistance and one end of the quartz crystal, and

wherein a cathode of the first diode (D 1 ) is connected to an anode of the second diode (D 2 ), a cathode of the second diode (D 2 ) is connected to an anode of the third diode (D 3 ), and a contact of a cathode of the third diode (D 3 ) and an anode of the fourth diode (D 4 ) is connected to the common ground.

4. The ESD protection circuit as claimed in claim 1 , wherein one end of the seventh resistance (R 7 ) is connected to a contact of another end of the sixth resistance (R 6 ) and one end of the fourth rectifier unit, and another end of the seventh resistance (R 7 ) is connected to one end of the second rectifier unit, and the other end of the second rectifier unit is connected to the common ground, and

wherein one end of the second rectifier unit is connected to a contact of another end of the seventh resistance (R 7 ) and another end of the quartz crystal, and another end of second rectifier unit is connected to the common ground.

5. The ESD protection circuit as claimed in claim 3 , wherein the second rectifier unit includes a fifth diode (D 5 ), a sixth diode (D 6 ), a seventh diode (D 7 ), and an eighth diode (D 8 ),

wherein a contact of an anode of the fifth diode (D 5 ) and a cathode of the eighth diode (D 8 ) is connected to a contact of another end of the seventh resistance and another end of the quartz crystal, and

wherein a cathode of the fifth diode (D 5 ) is connected to an anode of the sixth diode (D 6 ), a cathode of the sixth diode (D 6 ) is connected to an anode of the seventh diode (D 7 ), and a contact of a cathode of the seventh diode (D 7 ) and an anode of the eighth diode (D 8 ) is connected to the common ground.

6. The ESD protection circuit as claimed in claim 5 , wherein based on an electrostatic shock being applied to the IO port in an ESD VSS (+) mode, the electrostatic shock is discharged to the common ground via the fourth diode (D 4 ) of the first rectifier unit in the first stage ESD protection circuit, and

wherein based on an electrostatic shock being applied to the IO port in an ESD VSS (−) mode, the electrostatic shock is discharged to the common ground via the eighth diode (D 8 ) of the second rectifier unit in the first stage ESD protection circuit.

7. The ESD protection circuit as claimed in claim 5 , wherein based on an electrostatic shock being applied to the IO port in an ESD VDD (+) mode, the electrostatic shock is discharged to the common ground via the first diode (D 1 ), the second diode (D 2 ), and the third diode (D 3 ) of the first rectifier unit in the first stage ESD protection circuit, and based on the electrostatic shock being applied to N-channel metal oxide semiconductor (NMOS) Low-Dropout (LDO) along with a discharge path of a common substrate, the electrostatic shock is discharged to a VDD in the NMOS LDO, and

wherein based on an electrostatic shock being applied to the IO port in an ESD VDD (−) mode, the electrostatic shock is discharged to the common ground via the fifth diode (D 5 ), the sixth diode (D 6 ), and the seventh diode (D 7 ) of the second rectifier unit in the first stage ESD protection circuit, and based on the electrostatic shock being applied to the NMOS LDO along with the discharge path of the common substrate, the electrostatic shock is discharged to the VDD in the NMOS LDO.

8. The ESD protection circuit as claimed in claim 5 , wherein based on an electrostatic shock being applied to the IO port in an ESD IO (+) mode, the electrostatic shock flows to the common ground via the fourth diode (D 4 ) of the first rectifier unit in the first stage ESD protection circuit, the electrostatic shock is applied to the second rectifier unit 144 along with a discharge path of a common substrate of the first stage ESD protection circuit, the electrostatic shock flows along with a discharge path of the eighth diode (D 8 ) in the second rectifier unit in the first stage ESD protection circuit, and the electrostatic shock is discharged along with a discharge path of another PIN.

9. The ESD protection circuit as claimed in claim 5 , wherein based on an electrostatic shock being applied to the IO port in an ESD IO (−) mode, the electrostatic shock flows to the common ground via the eighth diode (D 8 ) of the second rectifier unit in the first stage ESD protection circuit, based on the electrostatic shock being applied to the first rectifier unit along with a discharge path of a common substrate of the first stage ESD protection circuit, the electrostatic shock flows along with a discharge path of the fourth diode (D 4 ) in the first rectifier unit in the first stage ESD protection circuit, and the electrostatic shock is discharged in a discharge path of another PIN.

10. The ESD protection circuit as claimed in claim 5 , wherein based on an electrostatic shock being applied to the IO port in an ESD VDD (+) mode, the electrostatic shock is discharged to the common ground via the first diode (D 1 ), the second diode (D 2 ), and the third diode (D 3 ) of the first rectifier unit in the first stage ESD protection circuit, and based on the electrostatic shock being applied to PMOS LDO along with a discharge path of a common substrate, the electrostatic shock is discharged to VDD in the PMOS LDO, and

wherein based on an electrostatic shock being applied to the IO port in an ESD VDD (−) mode, the electrostatic shock is discharged to the common ground via the fifth diode (D 5 ), the sixth diode (D 6 ), and the seventh diode (D 7 ) of the second rectifier unit in the first stage ESD protection circuit, and based on the electrostatic shock being applied to the PMOS LDO along with the discharge path of the common substrate, the electrostatic shock is discharged to the VDD in the PMOS LDO.

Assignments (4)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 25, 2026
From: RENESAS DESIGN KOREA INC.
To: RENESAS ELECTRONIC AMERICA INC.
Reel/Frame 074176/0251 →
CHANGE OF NAME Recorded Nov 8, 2025
From: DIALOG SEMICONDUCTOR KOREA INC.
To: RENESAS DESIGN KOREA INC.
Reel/Frame 073513/0861 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 3, 2020
From: FCI INC.
To: DIALOG SEMICONDUCTOR KOREA INC.
Reel/Frame 053687/0698 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 7, 2020
From: MOON, JE CHEOL
To: FCI INC.
Reel/Frame 051429/0959 →
Priority Claims (1)
KR 10-2018-0150975 · Nov 29, 2018 · national
Continuity (1)
Related Publication 20200176979A1 · Jun 4, 2020