Stray inductance reduction in packaged semiconductor devices

1. A semiconductor device package comprising:

a substrate;

a positive power supply terminal electrically coupled with the substrate, the positive power supply terminal being arranged in a first plane;

a first negative power supply terminal that is laterally disposed from the positive power supply terminal, the first negative power supply terminal being arranged in the first plane;

a second negative power supply terminal that is laterally disposed from the positive power supply terminal, the second negative power supply terminal being arranged in the first plane, the positive power supply terminal being disposed between the first negative power supply terminal and the second negative power supply terminal; and

a conductive clip electrically coupling the first negative power supply terminal with the second negative power supply terminal via a conductive bridge, a portion of the conductive bridge being arranged in a second plane that is parallel to, and non-coplanar with the first plane.

2. The semiconductor device package of claim 1 , wherein a line orthogonal to the first plane and the second plane intersects the positive power supply terminal and the portion of the conductive bridge arranged in the second plane.

3. The semiconductor device package of claim 1 , wherein the conductive clip is a first conductive clip, the semiconductor device package further comprising a second conductive clip,

the first negative power supply terminal, the second negative power supply terminal and the first conductive clip being electrically coupled with the second conductive clip.

4. The semiconductor device package of claim 3 , further comprising:

a semiconductor die disposed on the substrate; and

a third conductive clip electrically coupling the semiconductor die with the substrate, the third conductive clip being arranged in parallel with the second conductive clip.

5. The semiconductor device package of claim 4 , wherein the semiconductor die is a first semiconductor die, the semiconductor device package further comprising:

a second semiconductor die disposed on the substrate, the second conductive clip electrically coupling the second semiconductor die with the first conductive clip, the first negative power supply terminal and the second negative power supply terminal.

6. The semiconductor device package of claim 5 , further comprising:

a molding compound, the molding compound:

partially encapsulating the substrate, a surface of the substrate being exposed through the molding compound;

partially encapsulating the second conductive clip, a portion of the second conductive clip being exposed through the molding compound, the first conductive clip being electrically coupled with the portion of the second conductive clip exposed through the molding compound, and

encapsulating the first semiconductor die, the second semiconductor die and the third conductive clip,

the first negative power supply terminal, the second negative power supply terminal and the first conductive clip being disposed, at least in part, external to the molding compound.

7. The semiconductor device package of claim 5 , further comprising:

an output terminal electrically coupled with the substrate,

a first current path between the positive power supply terminal and the output terminal including the substrate, the first semiconductor die and the third conductive clip, and

a second current path between the output terminal and the first negative power supply terminal, the second negative power supply terminal and the first conductive clip includes the substrate, the second semiconductor die and the second conductive clip, the second current path being substantially parallel with the first current path.

8. The semiconductor device package of claim 4 , wherein the first negative power supply terminal, the second negative power supply terminal and the conductive clip are electrically coupled with the second conductive clip using direct-lead-attachment.

9. The semiconductor device package of claim 1 , further comprising:

an output terminal electrically coupled with the substrate.

10. The semiconductor device package of claim 9 , wherein the positive power supply terminal and the output terminal are electrically coupled with the substrate using direct-lead-attachment.

11. The semiconductor device package of claim 1 , further comprising:

a molding compound encapsulating at least a portion of the semiconductor device package,

the first negative power supply terminal, the second negative power supply terminal and the conductive clip being disposed, at least in part, external to the molding compound.

12. A semiconductor device package comprising:

a substrate;

a positive power supply terminal electrically coupled with the substrate, the positive power supply terminal being arranged in a plane;

a first negative power supply terminal that is laterally disposed from the positive power supply terminal, the first negative power supply terminal being arranged in the plane;

a second negative power supply terminal that is laterally disposed from the positive power supply terminal, the second negative power supply terminal being arranged in the plane, the positive power supply terminal being disposed between the first negative power supply terminal and the second negative power supply terminal;

a first semiconductor die disposed on the substrate;

a second semiconductor die disposed on the substrate;

a first conductive clip electrically coupling the first negative power supply terminal and the second negative power supply terminal with the first semiconductor die; and

a second conductive clip electrically coupling the second semiconductor die with the substrate, the second conductive clip being arranged parallel to the first conductive clip.

13. The semiconductor device package of claim 12 , wherein the plane is a first plane, the semiconductor device package further comprising:

a third conductive clip electrically coupling the first negative power supply terminal with the second negative power supply terminal via a conductive bridge, a portion of the conductive bridge being arranged in a second plane that is parallel to, and non-coplanar with the first plane.

14. The semiconductor device package of claim 13 , wherein the first conductive clip further electrically couples the first semiconductor die with the third conductive clip.

15. The semiconductor device package of claim 14 , further comprising an output terminal electrically coupled with the substrate,

a first current path between the positive power supply terminal and the output terminal including the substrate, the second semiconductor die and the second conductive clip, and

a second current path between the output terminal and the first negative power supply terminal, the second negative power supply terminal and the third conductive clip includes the substrate, the first semiconductor die and the first conductive clip, the second current path being substantially parallel with the first current path.

16. The semiconductor device package of claim 12 , wherein:

the first semiconductor die includes a low-side transistor of a power transistor pair; and

the second semiconductor die includes a high-side transistor the power transistor pair.

17. The semiconductor device package of claim 16 , wherein the low-side transistor is a first low-side transistor and the high-side transistor is a first high-side transistor, the semiconductor device package further comprising:

a third semiconductor die including a second low-side transistor coupled in parallel with the first low-side transistor; and

a fourth semiconductor die including a second high-side transistor coupled in parallel with the first high-side transistor.

18. A semiconductor device package comprising:

a substrate;

a positive power supply terminal electrically coupled with the substrate, the positive power supply terminal being arranged in a first plane;

a first negative power supply terminal that is laterally disposed from the positive power supply terminal, the first negative power supply terminal being arranged in the first plane;

a second negative power supply terminal that is laterally disposed from the positive power supply terminal, the second negative power supply terminal being arranged in the first plane, the positive power supply terminal being disposed between the first negative power supply terminal and the second negative power supply terminal;

a first semiconductor die disposed on the substrate, the first semiconductor die including a low-side transistor of a power transistor pair;

a second semiconductor die disposed on the substrate, the second semiconductor die including a high-side transistor of the power transistor pair;

a first conductive clip electrically coupling the first negative power supply terminal and the second negative power supply terminal with the low-side transistor;

a second conductive clip electrically coupling the high-side transistor with the substrate, the second conductive clip being arranged parallel to the first conductive clip;

a third conductive clip electrically coupling the first negative power supply terminal with the second negative power supply terminal via a conductive bridge, a portion of the conductive bridge being arranged in a second plane that is parallel to, and non-coplanar with the first plane, the third conductive clip, the first negative power supply terminal and the second negative power supply terminal being electrically coupled with the first conductive clip; and

an output terminal electrically coupled with the substrate.

19. The semiconductor device package of claim 18 , wherein:

the low-side transistor includes a first insulated-gate bipolar transistor (IGBT), the first conductive clip being coupled with an emitter terminal of the first IGBT, a collector terminal of the first IGBT being electrically coupled with the output terminal via the substrate; and

the high-side transistor includes a second IGBT, the second conductive clip being coupled with an emitter terminal of the second IGBT, a collector terminal of the second IGBT being electrically coupled with the positive power supply terminal via the substrate.

20. The semiconductor device package of claim 19 , further comprising:

a first signal lead electrically coupled with a gate terminal of the first IGBT; and

a second signal lead electrically coupled with a gate terminal of the second IGBT.