ULTRASONIC CONSOLIDATION OF PARTICULATES IN INK FOR FUNCTIONAL COATINGS
A process for ultrasonically consolidating particulates in an ink onto a substrate at ambient temperatures in less than 5 seconds to form a completely dense, well adhered functional coatings is disclosed. The coating can be used for electronic components. The process is applicable to various substrates such as metals, plastics and ceramics.
1 . A process for consolidating particulates in an ink to form a dense well adhered coating comprising:
formulating the ink;
selectively applying the ink to a substrate and drying the ink on the substrate; and
ultrasonically consolidating the particulates at ambient temperature and low pressure to form a dense, well adhered coating on the substrate.
2 . A process according to claim 1 , wherein said ink is selectively applied to the substrate using an analog printing method, wherein said analog print method is chosen from the group consisting essentially of: roll coating, gravure printing, flexographic printing, doctor blade, stencil printing, and screen printing.
3 . A process according to claim 1 , wherein said ink is selectively applied to the substrate using a digital printing method, wherein said digital printing method is chosen from the group consisting essentially of dispense jet, aerosol jet and ink jet methods.
4 . The process according to claim 1 , wherein said process is completed in less than 5 seconds.
5 . The process according to claim 4 , wherein said process is completed in less than 2 seconds.
6 . The process according to claim 1 , wherein ultrasonically consolidating the particulates includes subjecting the ink on the substrate to a static compressive load and vibratory energy.
7 . The process according to claim 1 , wherein the ultrasonic consolidation occurs at a frequency of about 15 to about 60 kilohertz.
8 . The process according to claim 1 , wherein the ultrasonic consolidation occurs at an amplitude of about 8 to about 100 microns.
9 . The process according to claim 1 , wherein the ultrasonic consolidation occurs at peak power of about 1 to about 10,000 watts.
10 . The process according to claim 1 , wherein the ultrasonic consolidation occurs at a static pressure of about 1 to about 80 psi.
11 . The process according to claim 1 , wherein said substrate comprises a metal, a ceramic, ceramic with a plastic or a metal coated with a plastic.
12 . The process according to claim 1 , wherein a cap is placed upon ink on the substrate prior to ultrasonically consolidating the particulates.
13 . The process according to claim 1 , wherein said ultrasonic consolidation occurs in a metal welding press, a torsional welding press or a roll seam welding press.
14 . A product formed by a process for consolidating particulates in an ink having a dense well adhered coating comprising:
formulating the ink;
selectively applying the ink to a substrate and drying the ink on the substrate; and
ultrasonically consolidating the particulates at ambient temperature and low pressure to form a dense, well adhered coating on the substrate
15 . A product as claimed in claim 14 , wherein said product is used as an electrical component.
16 . A product as claimed in claim 14 , wherein said product is used as a sensor.
17 . A product as claimed in claim 14 , wherein said product is used as an antenna.
18 . A conductive layer formed by the process for consolidating particulates in an ink comprising:
formulating a conductive ink comprising dispersing particulates in a binder;
applying the ink to the substrate, wherein the binder provides good adhesion to the substrate prior to ultrasonic consolidation;
ultrasonically consolidating the particulates at ambient temperature and low pressure to for a dense, well adhered conductive layer on the substrate.
19 . The conductive layer of claim 18 , wherein the conductive layer comprises consolidated particles and the binder.
20 . The conductive layer of claim 18 , wherein the conductive layer has a porosity of less than 1 vol. %.