Pump driven liquid cooling module with tower fins
A pump driven liquid cooling device with tower fins is disclosed. The device includes a thermal interface component configured to be coupled to an electronic component to be cooled via the thermal interface component. The device further includes at least one coolant pipe coupled to the thermal interface component. The device includes a local heat exchanger coupled to the at least one coolant pipe and comprising a plurality of stacked horizontal fins. The device includes a local coolant pump configured to pump a liquid coolant through the at least one coolant pipe in a local closed loop.
1. A device, comprising:
a thermal interface component configured to be coupled to an electronic component to be cooled via the thermal interface component;
at least one coolant pipe coupled to the thermal interface component, wherein the at least one coolant pipe comprises a plurality of portions of the at least one coolant pipe that form a local closed loop;
a local heat exchanger coupled to the at least one coolant pipe and comprising a plurality of stacked horizontal fins; and
a local coolant pump configured to pump a liquid coolant through the at least one coolant pipe in the local closed loop, wherein the plurality of portions of the at least one coolant pipe comprises one or more portions directing the liquid coolant upwards and away from the thermal interface component and the electronic component, and wherein the plurality of stacked horizontal fins is coupled to the one or more portions directing the liquid coolant upwards and away from the thermal interface component and the electronic component.
2. The device of claim 1 , wherein the electronic component is mounted on a printed circuit board in a server chassis.
3. The device of claim 1 , wherein the thermal interface component comprises a lower flat interface surface in contact with the electronic component and absorbing heat from the electronic component.
4. The device of claim 1 , wherein the thermal interface component comprises a cold plate formed with a metal.
5. The device of claim 1 , wherein the thermal interface component comprises a cold plate comprising one or more inlets and one or more outlets directing the liquid coolant to flow in and out of one or more internal channels that direct the liquid coolant to flow through the thermal interface component.
6. The device of claim 5 , wherein the one or more internal channels comprise a plurality of micro-channels that winds through the thermal interface component.
7. The device of claim 1 , wherein the one or more portions directing the liquid coolant upwards and away from the thermal interface component and the electronic component comprise one or more vertical portions running substantially perpendicular to the electronic component.
8. The device of claim 1 , wherein the plurality of portions of the at least one coolant pipe comprises one or more portions directing the liquid coolant downwards and back to the thermal interface component and the electronic component.
9. The device of claim 8 , wherein the plurality of stacked horizontal fins are coupled to the one or more portions directing the liquid coolant downwards and back to the thermal interface component and the electronic component.
10. The device of claim 8 , wherein the one or more portions directing the liquid coolant downwards and back to the thermal interface component and the electronic component comprise one or more vertical portions running substantially perpendicular to the electronic component.
11. The device of claim 9 , wherein the plurality of portions of the at least one coolant pipe comprises one or more portions directing the liquid coolant substantially horizontally and connecting the one or more portions directing the liquid coolant upwards and away from the thermal interface component and the electronic component with the one or more portions directing the liquid coolant downwards and back to the thermal interface component and the electronic component to form the local closed loop.
12. The device of claim 1 , further comprising a reservoir coupled to the local coolant pump.
13. The device of claim 1 , wherein the device is pre-assembled as a single module and collocated with the electronic component.
14. The device of claim 1 , wherein the device has a cooling limit above 500 watts.
15. The device of claim 1 , wherein the device has a height limit above 90 millimeters.
16. A method, comprising:
providing a thermal interface component configured to be coupled to an electronic component to be cooled via the thermal interface component;
providing at least one coolant pipe coupled to the thermal interface component, wherein the at least one coolant pipe comprises a plurality of portions of the at least one coolant pipe that form a local closed loop;
providing a local heat exchanger coupled to the at least one coolant pipe and comprising a plurality of stacked horizontal fins; and
providing a local coolant pump configured to pump a liquid coolant through the at least one coolant pipe in the local closed loop, wherein the plurality of portions of the at least one coolant pipe comprises one or more portions directing the liquid coolant upwards and away from the thermal interface component and the electronic component, and wherein the plurality of stacked horizontal fins is coupled to the one or more portions directing the liquid coolant upwards and away from the thermal interface component and the electronic component.
17. The method of claim 16 , wherein the plurality of portions of the at least one coolant pipe comprises one or more portions directing the liquid coolant downwards and back to the thermal interface component and the electronic component.
18. The method of claim 17 , wherein the plurality of stacked horizontal fins are coupled to the one or more portions directing the liquid coolant downwards and back to the thermal interface component and the electronic component.