IP Library Granted Patent US 10,923,842
Granted Patent B1
US 10,923,842 · App. 16/679,867 · Granted Feb 16, 2021

Systems and methods for signal integrity insertion loss minimization in input/output backplanes

Inventors: William E. Lynn (Round Rock, TX); Kevin W. Mundt (Austin, TX)
Assignee: Dell Products L.P.
H01R12/75H01R12/57H01R12/58H01R12/721
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Quick Facts
Patent No.
US 10,923,842
App. No.
16/679,867
Granted
Feb 16, 2021
Kind
B1
Abstract

As cable assembly may include a cable comprising a plurality of electrically-conductive wires and a hybrid connector that terminates an end of the cable. The hybrid connector may include a receptacle comprising a plurality of receptacle pins and configured to mechanically couple to a printed circuit board and receive an electronic device in order to mechanically couple the electronic device to the receptacle and the printed circuit board and electrically couple each of a plurality of electronic device pins of the electronic device to respective ones of the plurality of receptacle pins. The hybrid connector may also include a first section that electrically couples each of the plurality of electrically-conductive wires to respective ones of the plurality of receptacle pins and a second section that electrically couples each of a plurality of electrical conduits integral to the printed circuit board to respective ones of the plurality of receptacle pins.

Claims (52)

1. A cable assembly comprising:

a cable comprising a plurality of electrically-conductive wires; and

a hybrid connector that terminates an end of the cable, the hybrid connector comprising:

a receptacle comprising a plurality of receptacle pins, and configured to:

mechanically couple to a printed circuit board; and

receive an electronic device in order to mechanically couple the electronic device to the receptacle and the printed circuit board and electrically couple each of a plurality of electronic device pins of the electronic device to respective ones of the plurality of receptacle pins;

a first section that electrically couples each of the plurality of electrically-conductive wires to respective ones of the plurality of receptacle pins; and

a second section that electrically couples each of a plurality of electrical conduits integral to the printed circuit board to respective ones of the plurality of receptacle pins;

wherein the hybrid connector is configured to mechanically couple to the printed circuit board at an opening formed in the printed circuit board.

2. The cable assembly of claim 1 , wherein the plurality of electrical conduits integral to the printed circuit board comprise at least one electrical conduit for transmitting power to the electronic device.

3. The cable assembly of claim 1 , wherein the plurality of electrical conduits integral to the printed circuit board comprise at least one electrical conduit for transmitting signals at a speed significantly lower than signals transmitted over the cable.

4. The cable assembly of claim 1 , wherein the electronic device comprises an input/output device.

5. The cable assembly of claim 1 , wherein the receptacle has a form factor in accordance with an industry standard for input/output communication.

6. A printed circuit board comprising:

a plurality of electrical conduits integral to the printed circuit board;

an opening through which a connector of a cable assembly can pass to expose a receptacle of the connector to an electronic device, wherein the receptacle comprises a first section that electrically couples each of a plurality of electrically-conductive wires of the cable assembly to respective ones of a plurality of receptacle pins of the cable assembly and a second section that electrically couples each of the plurality of electrical conduits integral to the printed circuit board to respective ones of the plurality of receptacle pins;

a mechanical retention feature configured to mechanically couple the connector to the printed circuit board to fix a position of the receptacle to allow it to receive the electronic device; and

an electrical interface that electrically couples the plurality of electrical conduits integral to the printed circuit board to respective ones of the plurality of receptacle pins.

7. The printed circuit board of claim 6 , wherein the plurality of electrical conduits integral to the printed circuit board comprise at least one electrical conduit for transmitting power to the electronic device.

8. The printed circuit board of claim 6 , wherein the plurality of electrical conduits integral to the printed circuit board comprise at least one electrical conduit for transmitting signals at a speed significantly lower than signals transmitted over the cable.

9. The printed circuit board of claim 6 , wherein the electronic device comprises an input/output device.

10. An information handling system comprising:

a printed circuit board comprising:

a plurality of electrical conduits integral to the printed circuit board; and

an opening formed in the printed circuit board;

a cable assembly comprising:

a cable comprising a plurality of electrically-conductive wires; and

a hybrid connector that terminates an end of the cable, the hybrid connector comprising:

a receptacle comprising a plurality of receptacle pins, and configured to:

mechanically couple to the printed circuit board; and

receive an electronic device in order to mechanically couple the electronic device to the receptacle and the printed circuit board and electrically couple each of a plurality of electronic device pins of the electronic device to respective ones of the plurality of receptacle pins;

a first section that electrically couples each of the plurality of electrically-conductive wires to respective ones of the plurality of receptacle pins; and

a second section that electrically couples each of the plurality of electrical conduits integral to the printed circuit board to respective ones of the plurality of receptacle pins;

wherein the hybrid connector is configured to mechanically couple to the printed circuit board at the opening.

11. The information handling system of claim 10 , wherein the plurality of electrical conduits integral to the printed circuit board comprise at least one electrical conduit for transmitting power to the electronic device.

12. The information handling system of claim 10 , wherein the plurality of electrical conduits integral to the printed circuit board comprise at least one electrical conduit for transmitting signals at a speed significantly lower than signals transmitted over the cable.

13. The information handling system of claim 10 , wherein the electronic device comprises an input/output device.

14. The information handling system of claim 10 , wherein the receptacle has a form factor in accordance with an industry standard for input/output communication.

15. The information handling system of claim 10 , the printed circuit board further comprising an electrical interface that electrically couples the plurality of electrical conduits integral to the printed circuit board to respective ones of the plurality of receptacle pins.

16. An information handling system comprising:

a printed circuit board comprising:

a plurality of electrical conduits integral to the printed circuit board; and

a mechanical retention feature;

a cable assembly comprising:

a cable comprising a plurality of electrically-conductive wires; and

a hybrid connector that terminates an end of the cable, the hybrid connector comprising:

a receptacle comprising a plurality of receptacle pins, and configured to:

mechanically couple to the printed circuit board; and

receive an electronic device in order to mechanically couple the electronic device to the receptacle and the printed circuit board and electrically couple each of a plurality of electronic device pins of the electronic device to respective ones of the plurality of receptacle pins;

a first section that electrically couples each of the plurality of electrically-conductive wires to respective ones of the plurality of receptacle pins; and

a second section that electrically couples each of the plurality of electrical conduits integral to the printed circuit board to respective ones of the plurality of receptacle pins;

wherein the mechanical retention feature is configured to mechanically couple the hybrid connector to the printed circuit board to fix a position of the receptacle to allow it to receive the electronic device.

Assignments (9)
RELEASE OF SECURITY INTEREST IN PATENTS PREVIOUSLY RECORDED AT REEL/FRAME (053311/0169) Recorded Jun 23, 2022
From: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
To: DELL PRODUCTS L.P.; EMC CORPORATION; EMC IP HOLDING COMPANY LLC
Reel/Frame 060438/0742 →
RELEASE OF SECURITY INTEREST IN PATENTS PREVIOUSLY RECORDED AT REEL/FRAME (053546/0001) Recorded Jun 23, 2022
From: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
To: DELL MARKETING L.P. (ON BEHALF OF ITSELF AND AS SUCCESSOR-IN-INTEREST TO CREDANT TECHNOLOGIES, INC.); DELL INTERNATIONAL L.L.C.; DELL PRODUCTS L.P.; DELL USA L.P.; EMC CORPORATION; DELL MARKETING CORPORATION (SUCCESSOR-IN-INTEREST TO FORCE10 NETWORKS, INC. AND WYSE TECHNOLOGY L.L.C.); EMC IP HOLDING COMPANY LLC
Reel/Frame 071642/0001 →
RELEASE OF SECURITY INTEREST IN PATENTS PREVIOUSLY RECORDED AT REEL/FRAME (052216/0758) Recorded Jun 23, 2022
From: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
To: DELL PRODUCTS L.P.; EMC IP HOLDING COMPANY LLC
Reel/Frame 060438/0680 →
RELEASE OF SECURITY INTEREST AF REEL 052243 FRAME 0773 Recorded Nov 2, 2021
From: CREDIT SUISSE AG, CAYMAN ISLANDS BRANCH
To: DELL PRODUCTS L.P.; EMC IP HOLDING COMPANY LLC
Reel/Frame 058001/0152 →
SECURITY INTEREST Recorded Jun 5, 2020
From: DELL PRODUCTS L.P.; EMC CORPORATION; EMC IP HOLDING COMPANY LLC
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS COLLATERAL AGENT
Reel/Frame 053311/0169 →
SECURITY AGREEMENT Recorded Apr 22, 2020
From: CREDANT TECHNOLOGIES INC.; DELL INTERNATIONAL L.L.C.; DELL MARKETING L.P.; DELL PRODUCTS L.P.; DELL USA L.P.; EMC CORPORATION; FORCE10 NETWORKS, INC.; WYSE TECHNOLOGY L.L.C.; EMC IP HOLDING COMPANY LLC
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A.
Reel/Frame 053546/0001 →
SECURITY AGREEMENT Recorded Mar 26, 2020
From: DELL PRODUCTS L.P.; EMC IP HOLDING COMPANY LLC
To: CREDIT SUISSE AG, CAYMAN ISLANDS BRANCH
Reel/Frame 052243/0773 →
PATENT SECURITY AGREEMENT (NOTES) Recorded Mar 24, 2020
From: DELL PRODUCTS L.P.; EMC IP HOLDING COMPANY LLC
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS COLLATERAL AGENT
Reel/Frame 052216/0758 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 11, 2019
From: LYNN, WILLIAM E.; MUNDT, KEVIN W.
To: DELL PRODUCTS L.P.
Reel/Frame 050972/0683 →