Getter technology for micromachined ultrasonic transducer cavities

1. A method of forming an ultrasonic transducer device, the method comprising:

patterning a bilayer stack compatible for use in damascene processing and forming a metal layer on a first portion of the bilayer stack; and

bonding a membrane to seal a transducer cavity with at least a portion of a getter material layer being exposed, the getter material layer corresponding to a second portion of the bilayer stack without the metal layer formed thereon.

2. The method of claim 1 , wherein the bilayer stack comprises a diffusion barrier layer and the getter material layer formed on the diffusion barrier layer.

3. The method of claim 2 , wherein the diffusion barrier layer comprises tantalum nitride (TaN), and the getter material layer comprises one of: tantalum (Ta) or titanium (Ti).

4. The method of claim 1 , further comprising exposing the exposed portion of the getter material layer by forming an opening through a bottom capping layer and a dielectric layer disposed over the second portion of the bilayer stack.

5. A method of forming an ultrasonic transducer device, the method comprising:

forming a diffusion barrier layer over a substrate;

forming a getter material layer over the diffusion barrier layer;

forming a metal electrode layer over a first portion of the getter material layer;

forming a transducer cavity over the metal electrode layer; and

bonding a membrane to seal the transducer cavity with at least a second portion of the getter material layer being exposed.

6. The method of claim 5 , wherein the diffusion barrier layer comprises tantalum nitride (TaN), and the getter material layer comprises one of: tantalum (Ta) or titanium (Ti).

7. The method of claim 5 , further comprising:

patterning the getter material layer and the diffusion barrier layer;

forming a dielectric layer over the getter material layer and diffusion barrier layer;

patterning the dielectric layer to expose the first portion of the getter material layer; and

forming the metal electrode layer over the first portion of the getter material layer.

8. The method of claim 7 , wherein forming the metal electrode layer further comprises:

plating the metal electrode layer over the first portion of the getter material layer and the patterned dielectric layer; and

planarizing the plated metal electrode layer and patterned dielectric layer such that the metal electrode layer covers the first portion of the getter material layer and the patterned dielectric layer covers the second portion of the getter material layer.

9. The method of claim 8 , further comprising:

forming a bottom capping layer over the planarized metal electrode layer and patterned dielectric layer;

forming a transducer cavity sidewall layer over the bottom capping layer;

patterning the transducer cavity sidewall layer to define the transducer cavity; and

removing a portion of the bottom capping layer and portions of the patterned dielectric layer to expose the second portion of the getter material layer.

10. A method of forming an ultrasonic transducer device, the method comprising:

forming a bilayer stack over a substrate having a first metal layer therein, the bilayer stack comprising a diffusion barrier layer and a getter material layer formed on the diffusion barrier layer;

patterning the bilayer stack;

forming a first dielectric layer over the patterned bilayer stack;

patterning the first dielectric layer so as to expose first portions of the patterned bilayer stack and a portion of the first metal layer, with second portions of the patterned bilayer stack being protected by the patterned first dielectric layer;

forming a second metal layer over the first portions of the patterned bilayer stack, the portion of the first metal layer and the patterned first dielectric layer, and planarizing the second metal layer and patterned first dielectric layer;

forming a bottom capping layer over the planarized second metal layer and patterned first dielectric layer, and forming a transducer cavity sidewall layer over the bottom capping layer;

patterning the transducer cavity sidewall layer to define a transducer cavity;

removing a portion of the bottom capping layer and second portions of the patterned first dielectric layer to expose the getter material layer; and

bonding a membrane to seal the transducer cavity.

11. The method of claim 10 , wherein the bilayer stack comprises a diffusion barrier layer and the getter material layer formed on the diffusion barrier layer.

12. The method of claim 11 , wherein the diffusion barrier layer comprises tantalum nitride (TaN), and the getter material layer comprises one of: tantalum (Ta) or titanium (Ti).

13. The method of claim 11 , wherein the diffusion barrier layer is formed at a thickness of about 8-10 nanometers (nm), and the getter material layer at a thickness of about 50-100 nm.

14. The method of claim 10 , wherein the bottom capping layer comprises aluminum oxide (Al 2 O 3 ) formed by atomic layer deposition (ALD).

15. The method of claim 14 , wherein the bottom capping layer is formed at thickness of about 20-30 nm.