IP Library Granted Patent US 10,854,745
Granted Patent B2
US 10,854,745 · App. 16/682,259 · Granted Dec 1, 2020

Memory device comprising an electrically floating body transistor and methods of using

Inventors: Jin-Woo Han (San Jose, CA); Dinesh Maheshwari (Fremont, CA); Yuniarto Widjaja (Cupertino, CA)
Assignee: Zeno Semiconductor, Inc.
H01L29/7841H01L27/10802H01L27/1211G06F11/1068G11C7/02G11C11/4082G11C11/4087G11C11/4096G11C29/12G11C29/52H01L29/785
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Quick Facts
Patent No.
US 10,854,745
App. No.
16/682,259
Granted
Dec 1, 2020
Kind
B2
Abstract

A semiconductor memory cell comprising an electrically floating body having two stable states is disclosed. A method of operating the memory cell is disclosed.

Claims (41)

1. A semiconductor memory array comprising:

a plurality of semiconductor memory cells arranged in a matrix of rows and columns, wherein at least two of said semiconductor memory cells include:

a memory transistor comprising a bi-stable floating body transistor having a first floating body region and a back-bias region configured to generate impact ionization when said memory cell is in one of first and second states, and wherein said back-bias region is configured so as not to generate impact ionization when the memory cell is in the other of said first and second states; and

an access device;

wherein said access device comprises a second floating body region;

wherein said bi-stable floating body transistor and said access device are electrically connected in series; and

wherein said back-bias region is commonly connected to at least two of said semiconductor memory cells.

2. The semiconductor memory array of claim 1 , wherein a capacitance of said first floating body region is different from a capacitance of said second floating body region.

3. The semiconductor memory array of claim 1 , wherein said memory transistor further comprises a first gate region, and said access device further comprises a second gate region.

4. The semiconductor memory array of claim 3 , wherein a length of the first gate region is less than a length of the second gate region.

5. The semiconductor memory array of claim 3 , wherein a length of the first gate region is greater than a length of the second gate region.

6. The semiconductor memory array of claim 3 , wherein a capacitance of the first gate region is different from a capacitance of the second gate region.

7. The semiconductor memory array of claim 1 , wherein a volume of the first floating body region is smaller than a volume of the second floating body region.

8. The semiconductor memory array of claim 1 , further comprising at least one dummy gate region between said memory transistor and said access device.

9. The semiconductor memory array of claim 8 , wherein said memory transistor comprises a first gate region; and

wherein a work function of said dummy gate region is higher than a work function of said first gate region.

10. The semiconductor memory array of claim 1 , wherein said semiconductor memory cell is a multi-port memory cell.

11. The semiconductor memory array of claim 1 comprising a fin structure.

12. A semiconductor memory array comprising:

a plurality of semiconductor memory cells arranged in a matrix of rows and columns, wherein at least two of said semiconductor memory cells include:

a first transistor having a first floating body;

a second transistor having a second floating body;

a buried layer underlying both of said first and second floating bodies;

a first source line region contacting said first floating body;

a first drain region separated from said first source line region and contacting said first floating body;

a first gate insulated from said first floating body;

an insulating member insulating said first floating body from said second floating body;

a second source line region contacting said second floating body;

a second drain region separated from said second source line region and contacting said second floating body; and

a second gate insulated from said second floating body;

wherein said first drain region is electrically connected to said second source line region;

wherein a capacitance of said first floating body is different from a capacitance of said second floating body; and

wherein said back-bias region is commonly connected to at least two of said semiconductor memory cells.

13. The semiconductor memory array of claim 12 , wherein a volume of said first floating body is less than a volume of said second floating body.

14. The semiconductor memory array of claim 12 , wherein a length of said first gate is less than a length of said second gate.

15. The semiconductor memory array of claim 12 , wherein a length of said first gate is greater than a length of said second gate.

16. The semiconductor memory array of claim 12 , further comprising at least one dummy gate region between said first transistor and said second transistor.

17. The semiconductor memory array of claim 16 , wherein a work function of said dummy gate region is greater than a work function of said first gate.

18. The semiconductor memory array of claim 12 , wherein said first transistor and said second transistor have the same conductivity type.

19. The semiconductor memory array of claim 12 , wherein said semiconductor memory cell is a multi-port memory cell.

20. The semiconductor memory array of claim 12 comprising a fin structure.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 11, 2020
From: HAN, JIN-WOO; MAHESHWARI, DINESH; WIDJAJA, YUNIARTO
To: ZENO SEMICONDUCTOR, INC.
Reel/Frame 051897/0803 →
Continuity (7)
Continuation 16105579 · Aug 20, 2018
Continuation 15798342 · Oct 30, 2017
Provisional Application 62415511 · Nov 1, 2016
Provisional Application 62451439 · Jan 27, 2017
Provisional Application 62461160 · Feb 20, 2017
Provisional Application 62552048 · Aug 30, 2017
Related Publication 20200083373A1 · Mar 12, 2020
Cited By (2)
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