Method for evaluating binder
A method for evaluating a binder includes disposing the binder on a first plate, bringing a second plate, which faces the first plate, into contact with one surface of the binder, applying a stress to the binder through the second plate, measuring a strain of the binder due to the applied stress, and calculating a curing rate of the binder based on the strain of the binder.
1. A method for evaluating a binder, the method comprising:
disposing the binder on a first plate;
bringing a second plate, which faces the first plate, into contact with one surface of the binder;
applying a stress to the binder through the second plate;
measuring a strain of the binder due to the applied stress; and
calculating a curing rate of the binder based on the strain of the binder,
wherein the applying the stress to the binder comprises applying at least one of a shear stress to the binder by rotating the second plate and a compressive stress to the binder by moving the second plate.
2. The method of claim 1 , wherein the binder includes at least one of an adhesive and a tackifier.
3. The method of claim 2 , wherein the adhesive includes at least one of optically clear resin and liquid optically clear adhesive, and
the tackifier includes an optically clear adhesive.
4. The method of claim 1 , wherein the applying the stress to the binder comprises applying the shear stress to the binder by rotating the second plate.
5. The method of claim 1 , wherein the applying the stress to the binder comprises applying the compressive stress to the binder by moving the second plate.
6. The method of claim 1 , wherein the applying the stress to the binder through the second plate is performed using a measurement apparatus, and
the measurement apparatus is a rheometer including the first plate and the second plate.
7. The method of claim 1 , wherein the measuring the strain of the binder is performed for a period of about 60 seconds to about 3600 seconds.
8. The method of claim 1 , wherein the measuring the strain of the binder is performed in a temperature range of about 0 degree Celsius to about 90 degrees Celsius.
9. The method of claim 1 , wherein the calculating the curing rate of the binder comprises calculating further based on a strain of an uncured binder and a strain of a fully cured binder, which are previously stored.
10. The method of claim 9 , wherein the calculating the curing rate of the binder comprises calculating using a following conversion equation:
CR
(
Curing
Rate
(
%
)
)
=
{
(
Cuc
-
Cfc
)
-
(
Cms
-
Cfc
)
}
×
100
(
Cuc
-
Cfc
)
,
where Cuc is the strain of the uncured binder, Cfc is the strain of the fully cured binder, and Cms is the strain of the binder.
11. The method of claim 10 , wherein the strain of the uncured binder, the strain of the fully cured binder and the strain of the binder are measured at a same temperature.
12. The method of claim 11 , wherein the strain of the uncured binder, the strain of the fully cured binder and the strain of the binder are measured at a same shear stress.
13. The method of claim 9 , further comprising, after calculating the curing rate of the binder, determining whether the binder is defective by comparing the curing rate of the binder with a standard curing rate which is previously stored.
14. A method for evaluating a binder, the method comprising:
disposing the binder on a first plate;
bringing a second plate, which faces the first plate, into contact with one surface of the binder;
applying a stress to the binder through the second plate;
measuring a strain of the binder due to the applied stress; and
determining whether the binder is defective by comparing the measured strain of the binder with a previously stored strain of a non-defective binder.
15. The method of claim 14 , wherein the binder includes at least one of an adhesive and a tackifier, and
wherein the adhesive includes at least one of optically clear resin and liquid optically clear adhesive, and the tackifier includes an optically clear adhesive.
16. The method of claim 14 , wherein the applying the stress to the binder comprises applying a shear stress to the binder by rotating the second plate.
17. The method of claim 14 , wherein the applying the stress to the binder comprises applying a compressive stress to the binder by moving the second plate.
18. The method of claim 14 , wherein when applying the stress to the binder, a measurement apparatus increases the applied stress according to measurement time.
19. The method of claim 18 , wherein the applied stress is increased from 1000 pascals to 5000 pascals according to the measurement time.
20. The method of claim 14 , wherein the determining whether the binder is defective by comparing the strain of the binder with a previously stored strain of the non-defective binder comprises determining that the binder is non-defective when the strain of the binder is within a reference range of the strain of the non-defective binder.