Methods of forming a liquid metal embrittlement resistant superabrasive compact, and superabrasive compacts and apparatuses using the same
Embodiments of the invention relate to liquid metal embrittlement (“LME”)-resistant superabrasive compacts, methods of making the same, and drill bits incorporating the same. The LME-resistant superabrasive compacts include a braze-resistant region on one or more portions of a substrate expected to be under residual tensile stress and susceptible to LME during brazing.
1. A polycrystalline diamond compact, comprising:
a polycrystalline diamond body having a plurality of bonded diamond grains, an upper surface, a bonding surface, and at least one lateral surface extending between the upper surface and the bonding surface; and
a substrate bonded to the polycrystalline diamond body, the substrate including:
a plurality of cemented carbide grains;
a base surface;
an interfacial surface bonded to the bonding surface; and
a peripheral surface extending between the base surface and the interfacial surface, at least a portion of the peripheral surface including a braze-resistant region that extends into one or more surfaces of the carbide substrate, the braze-resistant region exhibiting a phobic response to a liquefied braze material, and the braze-resistant region including a non-native oxide on the at least a portion of the peripheral surface, the non-native oxide having a thickness greater than a thickness of a native oxide on another portion of the peripheral surface.
2. The polycrystalline diamond compact of claim 1 , wherein the braze-resistant region includes one or more of niobium, molybdenum, zirconium, tantalum, red phosphorous, hexagonal boron nitride, cobalt oxide, cubic boron nitride, alumina, zirconia, or alloys including one or more of the foregoing.
3. The polycrystalline diamond compact of claim 1 , wherein the at least a portion of the peripheral surface having the braze-resistant region includes a portion of the peripheral surface extending about 2 mm or less from the interfacial surface.
4. The polycrystalline diamond compact of claim 1 , wherein the braze-resistant region includes a refractory metal coating on the at least a portion of the peripheral surface of the carbide substrate.
5. The polycrystalline diamond compact of claim 1 , wherein the cemented carbide grains include tungsten carbide, titanium carbide, chromium carbide, niobium carbide, tantalum carbide, vanadium carbide, or combinations thereof.
6. The polycrystalline diamond compact of claim 1 , wherein the cemented carbide grains include cobalt-cemented tungsten carbide grains.
7. The polycrystalline diamond compact of claim 1 , wherein the polycrystalline diamond body includes a leached region extending inwardly from the upper surface.
8. A polycrystalline diamond compact, comprising:
a polycrystalline diamond body having a plurality of bonded diamond grains, an upper surface, a bonding surface, and at least one lateral surface extending between the upper surface and the bonding surface; and
a substrate bonded to the polycrystalline diamond body, the substrate including:
a plurality of cemented carbide grains;
a base surface;
an interfacial surface bonded to the bonding surface; and
a peripheral surface extending between the base surface and the interfacial surface, at least a portion of the peripheral surface including a lased braze-resistant region that extends into one or more surfaces of the carbide substrate, and the lased braze-resistant region exhibiting a phobic response to a liquefied braze material, wherein the lased braze-resistant region includes a non-native oxide on the at least a portion of the peripheral surface, the non-native oxide having a thickness greater than a thickness of a native oxide on another portion of the peripheral surface.
9. The polycrystalline diamond compact of claim 8 , wherein the lased braze-resistant region exhibits less porosity than an adjacent non-lased region of the peripheral surface of the substrate.
10. The polycrystalline diamond compact of claim 8 , wherein the lased braze-resistant region includes an annealed region of the substrate adjacent to a non-annealed region of the substrate.
11. The polycrystalline diamond compact of claim 8 , wherein the lased braze-resistant region includes a surface texture that is different than the surface texture of a non-lased region of the peripheral surface of the substrate.
12. The polycrystalline diamond compact of claim 8 , wherein the at least a portion of the peripheral surface having the lased braze-resistant region includes a metallic material lased onto the at least a portion of the peripheral surface.
13. The polycrystalline diamond compact of claim 8 , wherein the braze-resistant region includes one or more of niobium, molybdenum, zirconium, tantalum, red phosphorous, hexagonal boron nitride, cobalt oxide, cubic boron nitride, alumina, zirconia, or alloys including one or more of the foregoing.
14. The polycrystalline diamond compact of claim 8 , wherein the at least a portion of the peripheral surface having the lased braze-resistant region includes a portion of the peripheral surface extending about 2 mm or less from the interfacial surface.
15. The polycrystalline diamond compact of claim 8 , wherein the cemented carbide grains include tungsten carbide, titanium carbide, chromium carbide, niobium carbide, tantalum carbide, vanadium carbide, or combinations thereof.
16. The polycrystalline diamond compact of claim 8 , wherein the cemented carbide grains include cobalt-cemented tungsten carbide grains.
17. A polycrystalline diamond compact, comprising:
a polycrystalline diamond body having a plurality of bonded diamond grains, an upper surface, a bonding surface, and at least one lateral surface extending between the upper surface and the bonding surface; and
a substrate bonded to the polycrystalline diamond body, the substrate including:
a plurality of cobalt-cemented tungsten carbide grains,
a base surface;
an interfacial surface bonded to the bonding surface; and
a peripheral surface extending between the base surface and the interfacial surface, at least a portion of the peripheral surface including a braze-resistant region that extends into one or more surfaces of the carbide substrate about 2 mm or less from the interfacial surface, the braze-resistant region exhibiting a phobic response to a liquefied braze material, and the braze-resistant region including a non-native oxide on the at least a portion of the peripheral surface, the non-native oxide having a thickness greater than a thickness of a native oxide on another portion of the peripheral surface.