Flexible connector for a display device
A flexible connector comprises a first plurality of pads disposed within an integrated circuit (IC) area, a second plurality of pads disposed in the IC area, and a plurality of through holes disposed in the IC area. The flexible connector further comprises first wiring coupled to the plurality of through holes and the first plurality of pads, and a rigidity element at least partially disposed between the plurality of through holes and the second plurality of pads.
1. A flexible connector, comprising:
a first plurality of pads disposed within an integrated circuit (IC) area;
a second plurality of pads disposed in the IC area;
a plurality of through holes disposed in the IC area;
first wiring coupled to the plurality of through holes and the first plurality of pads; and
a rigidity element at least partially disposed between the plurality of through holes and the second plurality of pads,
wherein the rigidity element is configured to increase a rigidity of the flexible connector, and
wherein the rigidity element comprises a plurality of wires arranged in a pattern of monotonically increasing length of the plurality of wires.
2. The flexible connector of claim 1 , wherein the plurality of wires is at least partially disposed between the plurality of through holes and the second plurality of pads.
3. The flexible connector of claim 2 , wherein the plurality of wires is isolated from the first wiring, the plurality of through holes, and the second plurality of pads.
4. The flexible connector of claim 2 , wherein the plurality of wires and the first wiring are comprised of a common material.
5. The flexible connector of claim 1 , wherein the rigidity element comprises solder resist.
6. The flexible connector of claim 5 , wherein the solder resist is at least partially disposed over at least one of the plurality of through holes and the first wiring.
7. The flexible connector of claim 1 further comprising two or more layers.
8. A display device, comprising:
a substrate;
a plurality of display electrodes disposed on the substrate;
a flexible connector connected to the substrate and comprising:
a first plurality of pads disposed within an integrated circuit (IC) area of the flexible connector;
a second plurality of pads disposed in the IC area;
a plurality of through holes disposed in the IC area;
first wiring coupled to the plurality of through holes and the first plurality of pads; and
a rigidity element at least partially disposed between the plurality of through holes and the second plurality of pads,
wherein the rigidity element is configured to increase a rigidity of the flexible connector, and
wherein the rigidity element comprises a plurality of wires arranged in a pattern of monotonically increasing length of the plurality of wires; and
an IC chip coupled to the plurality of through holes within the IC area, wherein the IC chip is configured to drive the plurality of display electrodes to update a display of the display device.
9. The display device of claim 8 , wherein the plurality of wires is at least partially disposed between the plurality of through holes and the second plurality of pads.
10. The display device of claim 9 , wherein the plurality of wires is isolated from the first wiring, the plurality of through holes, and the second plurality of pads.
11. The display device of claim 9 , wherein the plurality of wires and the first wiring are comprised of a common material.
12. The display device of claim 8 , wherein the rigidity element comprises solder resist.
13. The display device of claim 12 , wherein the solder resist is at least partially disposed over at least one of the plurality of through holes and the first wiring.
14. The display device of claim 8 , wherein the flexible connector further comprises two or more layers.
15. An input device, comprising:
a flexible connector comprising:
a first plurality of pads disposed within an integrated circuit (IC) area of the flexible connector;
a second plurality of pads disposed in the IC area;
a plurality of through holes disposed in the IC area;
first wiring coupled to the plurality of through holes and the first plurality of pads; and
a rigidity element at least partially disposed between the plurality of through holes and the second plurality of pads,
wherein the rigidity element is configured to increase a rigidity of the flexible connector, and
wherein the rigidity element comprises a plurality of wires arranged in a pattern of monotonically increasing length of the plurality of wires; and
an IC chip coupled to the through holes of the flexible connector within the IC area.
16. The input device of claim 15 , wherein the plurality of wires is at least partially disposed between the plurality of through holes and the second plurality of pads.
17. The input device of claim 16 , wherein the plurality of wires is isolated from the first wiring, the plurality of through holes, and the second plurality of pads.
18. The input device of claim 16 , wherein the plurality of wires the first wiring are comprised of a common material.
19. The input device of claim 18 , wherein the rigidity element comprises solder resist at least partially disposed over at least one of the plurality of through holes and the first wiring.
20. The input device of claim 15 , wherein the flexible connector further comprises two or more layers.