Comolded non-destructive inspection standard functioning as a bond bump

1. An inspection feature for an adhesive bond portion between parts of a component comprising:

said inspection feature extending from a surface of the part of the component a predetermined bond line thickness, said inspection feature having a density configured to imitate a defect of the adhesive bond portion responsive to a non-destructive inspection scan.

2. The inspection feature for an adhesive bond portion between parts of a component according to claim 1 , wherein said inspection feature defines the predetermined bond line thickness which is a minimum thickness of the bond line.

3. The inspection feature for an adhesive bond portion between parts of a component according to claim 1 , wherein said inspection feature is co-molded with the part.

4. The inspection feature for an adhesive bond portion between parts of a component according to claim 1 , wherein said inspection feature is adhered to the surface of the part.

5. The inspection feature for an adhesive bond portion between parts of a component according to claim 1 , wherein said inspection feature comprises a density such that the shade in a non-destructive inspection scan image of the inspection feature is similar in shade to the image of the defect.

6. The inspection feature for an adhesive bond portion between parts of a component according to claim 1 , wherein said inspection feature has a non-naturally occurring shape.

7. The inspection feature for an adhesive bond portion between parts of a component according to claim 1 , wherein said inspection feature comprises a density from about 0.0013 g/cm 3 to about 0.5 g/cm 3 .

8. A component having parts bonded together by an adhesive bond portion comprising:

a first part attachable to a second part;

a bond line thickness defined by the adhesive bond portion coupling said first part to said second part;

an inspection feature extending a predetermined bond line thickness from a surface of at least one of the first part and the second part, said inspection feature having a density configured to imitate a defect of the adhesive bond portion responsive to a non-destructive inspection scan.

9. The component having parts bonded together by an adhesive bond portion according to claim 8 , wherein said inspection feature is configured to produce an image produced from the non-destructive inspection scan having a shade that distinguishes from the shade of the adhesive bond portion.

10. The component having parts bonded together by an adhesive bond portion according to claim 8 , wherein said inspection feature is configured to produce an image produced from the non-destructive inspection scan having a shade of the defect.

11. The component having parts bonded together by an adhesive bond portion according to claim 8 , wherein said inspection feature is configured to produce an image from the non-destructive inspection scan having a non-naturally occurring shape.

12. The component having parts bonded together by an adhesive bond portion according to claim 8 , wherein said defect comprises at least one of a void, gap, and crack.

13. The component having parts bonded together by an adhesive bond portion according to claim 8 , wherein said inspection feature is configured to set a non-destructive examination standard configured to determine said defect being present in the adhesive bond portion.

14. A process for use of an inspection feature for an adhesive bond portion between a first part and a second part of a component comprising:

forming an inspection feature extending a predetermined bond line thickness from a surface of at least one of the first part and the second part,

forming the adhesive bond portion coupling said first part to said second part to form the component;

scanning said inspection feature and said adhesive bond portion with a non-destructive inspection scan; and

creating an image from the non-destructive inspection scan, wherein said inspection feature comprises a density configured to imitate a defect within the adhesive bond portion responsive to the non-destructive inspection scan.

15. The process of claim 14 , further comprising:

producing the image of the inspection feature from the non-destructive inspection scan having a shade of the defect.

16. The process of claim 14 , further comprising:

producing an image of the inspection feature from the non-destructive inspection scan having a non-naturally occurring shape.

17. The process of claim 14 , further comprising:

setting a non-destructive examination standard utilizing the inspection feature, said standard configured to determine the defect being present in the adhesive bond portion.

18. The process of claim 17 , further comprising

utilizing said non-destructive examination standard to form an image to compare with the image of the defect in the adhesive bond portion.

19. The process of claim 14 , wherein said inspection feature defines the predetermined bond line thickness which is a minimum thickness of the bond line.

20. The process of claim 14 , wherein said defect comprises at least one of a void, gap, and crack.