Semiconductor light emitting element with magnetic layer, manufacturing method thereof, and display device including the same

1. A semiconductor light emitting element comprising:

a n-type semiconductor layer;

a p-type semiconductor layer formed in a first region on the n-type semiconductor layer;

a p-type electrode formed on the p-type semiconductor layer;

a n-type electrode formed in a second region different from the first region on the n-type semiconductor layer;

a magnetic layer formed under the n-type semiconductor layer;

a reflective layer formed between the n-type semiconductor layer and the magnetic layer;

a first adhesive member between the n-type semiconductor layer and the reflective layer; and

a second adhesive member between the reflective layer and the magnetic layer,

wherein the first adhesive member and the second adhesive member are made of at least one of chromium or titanium, and

wherein contact surfaces of the n-type semiconductor layer and the reflective layer are formed as non-planar surfaces.

2. The semiconductor light emitting element of claim 1 , further comprising a passivation layer surrounding the n-type semiconductor layer, the p-type semiconductor layer, the p-type electrode, the n-type electrode, and the magnetic layer.

3. A display device comprising the semiconductor light emitting element of claim 1 .

4. A semiconductor light emitting element comprising:

a n-type semiconductor layer;

a p-type semiconductor layer formed in a first region on the n-type semiconductor layer;

a p-type electrode formed on the p-type semiconductor layer;

a n-type electrode formed in a second region different from the first region on the n-type semiconductor layer;

a magnetic layer formed under the n-type semiconductor layer;

a reflective layer formed between the n-type semiconductor layer and the magnetic layer;

a first adhesive member between the n-type semiconductor layer and the reflective layer; and

a second adhesive member between the reflective layer and the magnetic layer,

wherein the first adhesive member and the second adhesive member are made of at least one of chromium or titanium.

wherein the p-type electrode is implemented as a transparent electrode, and

wherein the n-type electrode is made of metal.

5. The semiconductor light emitting element of claim 4 , further comprising an assistant reflective layer formed between the n-type electrode and the n-type semiconductor layer.

6. A method of manufacturing semiconductor light emitting element, the method comprising:

forming a semiconductor light emitting element, which includes a n-type semiconductor layer having one surface being in contact with a growth substrate, a p-type semiconductor layer grown on the n-type semiconductor layer, a p-type electrode electrically connected with the p-type semiconductor layer, and a n-type electrode electrically connected with the n-type semiconductor layer, on the growth substrate;

separating the semiconductor light emitting element from the growth substrate, and fixing the semiconductor light emitting element to a temporary substrate in a flipped state such that the one surface of the n-type semiconductor layer faces up; and

forming a magnetic layer on the one surface of the n-type semiconductor layer, wherein the forming of the magnetic layer on the one surface of the n-type semiconductor layer includes:

forming a first adhesive member on the n-type semiconductor layer;

forming a reflective layer on the first adhesive member;

forming a second adhesive member on the reflective layer; and

forming the magnetic layer on the second adhesive member,

wherein the first adhesive member and the second adhesive member are made of at least one of chromium or titanium.

7. The method of claim 6 , wherein the forming of the reflective layer includes:

etching the n-type semiconductor layer at a predetermined height; and

forming the reflective layer on the etched n-type semiconductor layer, and contact surfaces of the n-type semiconductor layer and the reflective layer are formed as non-planar surfaces.

8. The method of claim 7 , wherein the etching of the n-type semiconductor layer at a predetermined height includes:

applying a photoresist to the semiconductor light emitting element;

exposing the n-type semiconductor layer by removing the photoresist in a region corresponding to the n-type semiconductor layer; and

etching the exposed n-type semiconductor layer at a predetermined height.

9. The method of claim 6 , wherein the forming of the semiconductor light emitting element further includes forming a passivation layer surrounding the semiconductor light emitting element except for the one surface of the n-type semiconductor layer.

10. The method of claim 6 , further comprising forming a passivation layer on the magnetic layer.

11. The method of claim 6 , wherein the first adhesive member comprises a first roughness pattern.

12. The method of claim 6 , wherein the reflective layer comprises a second roughness pattern.

13. A semiconductor light emitting element comprising:

a n-type semiconductor layer;

a p-type semiconductor layer formed in a first region on the n-type semiconductor layer;

a p-type electrode formed on the p-type semiconductor layer;

a n-type electrode formed in a second region different from the first region on the n-type semiconductor laver;

a magnetic layer formed under the n-type semiconductor layer;

a reflective layer formed between the n-type semiconductor layer and the magnetic layer;

a first adhesive member between the n-type semiconductor layer and the reflective layer; and

a second adhesive member between the reflective layer and the magnetic layer,

wherein the first adhesive member and the second adhesive member are made of at least one of chromium or titanium, and

wherein the first adhesive member comprises a first roughness pattern.

14. The semiconductor light emitting element of claim 13 , wherein the reflective layer comprises a second roughness pattern.