IP Library Granted Patent US 10,853,280
Granted Patent B1
US 10,853,280 · App. 16/691,842 · Granted Dec 1, 2020

Storage engine having compute nodes with redundant fabric access

Inventors: James Guyer (Northboro, MA); Jason Duquette (Milford, MA); Alesia Tringale (Worcester, MA); Julie Zhivich (Westborough, MA)
Assignee: EMC IP Holding Company LLC
G06F13/1684G06F11/2002G06F11/2053G06F13/4022G06F13/4282G06F2213/0026
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Quick Facts
Patent No.
US 10,853,280
App. No.
16/691,842
Granted
Dec 1, 2020
Kind
B1
Abstract

A storage system includes a storage engine having a first compute node, a second compute node, a first fabric adapter, and a second fabric adapter, the first compute node having a first memory and the second compute node having a second memory. The first compute node is connected to both the first and second fabric adapters, and the second compute node is connected to both the second and first fabric adapters. Both fabric adapters are configured to perform atomic operations on a memory of its respective compute node, and each fabric adapter contains a multi-initiating module configured to enable both the first compute node and the second compute node to initiate memory access operations on its respective memory.

Claims (30)

1. A storage system, comprising:

a first storage engine having a first compute node, a second compute node, a first fabric access module, and a second fabric access module, the first compute node having a first CPU and associated first memory and the second compute node having a second CPU and associated second memory;

a first connection within the first storage engine between the first compute node and the first fabric access module;

a second connection within the first storage engine between the first compute node and the second fabric access module;

a third connection within the first storage engine between the second compute node and the first fabric access module; and

a fourth connection within the first storage engine between the second compute node and the second fabric access module;

wherein the first fabric access module contains a first multi-initiator module configured to enable both the first compute node and the second compute node to directly initiate atomic memory access operations on the first memory through the first fabric access module; and

wherein the second host adapter contains a second multi-initiator module configured to enable both the second compute node and the first compute node to directly initiate atomic memory access operations on the second memory through the second fabric access module.

2. The storage system of claim 1 , wherein the first fabric access module contains a first host adapter configured to perform atomic operations on the first memory and the second memory; and

wherein the second fabric access module contains a second host adapter configured to perform atomic operations on the second memory and the first memory.

3. The storage system of claim 1 , wherein the first fabric access module has a first upstream PCIe port connected to a first PCIe root complex associated with the first CPU and first memory of the first compute node;

wherein the first fabric access module has a second upstream PCIe port connected to a second PCIe root complex associated with the second CPU and second memory of the second compute node;

wherein the second fabric access module has a third upstream PCIe port connected to the second PCIe root complex associated with the second CPU and second memory of the second compute node; and

wherein the second fabric access module has a fourth upstream PCIe port connected to the first PCIe root complex associated with the first CPU and first memory of the first compute node.

4. The storage system of claim 1 , wherein the first fabric access module includes a first PCIe interface connected to the first connection, a third PCIe interface connected to the third connection, and a first host adapter configured to enable the fabric access module to interconnect with a second storage engine; and

wherein the second fabric access module includes a second PCIe interface connected to the second connection, a fourth PCIe interface connected to the fourth connection, and a second host adapter configured to enable the fabric access module to interconnect with a second storage engine.

5. The storage system of claim 1 , further comprising:

a second storage engine having a third compute node, a fourth compute node, a third fabric access module, and a fourth fabric access module, the third compute node having a third memory and the fourth compute node having a fourth memory;

a fifth connection between the third compute node and the third fabric access module;

a sixth connection between the third compute node and the fourth fabric access module;

a seventh connection between the fourth compute node and the fourth fabric access module; and

an eighth connection between the fourth compute node and the third fabric access module.

6. The storage system of claim 5 , wherein the first fabric access module contains a first multi-initiator module configured to enable both the first compute node and the second compute node to initiate memory access operations on the third memory of the third compute node and the fourth memory of the fourth compute node through the first fabric access module; and

wherein the second host adapter contains a second multi-initiator module configured to enable both the second compute node and the first compute node to initiate memory access operations on the third memory of the third compute node and the fourth memory of the fourth compute node through the second fabric access module.

7. The storage system of claim 6 , wherein the first multi-initiator module is further configured to enable both the third compute node and the fourth compute node to initiate memory access operations on the first memory of the first compute node and the second memory of the second compute node through the first fabric access module; and

wherein the second multi-initiator module is further configured to enable both the third compute node and the fourth compute node to initiate memory access operations on the second memory of the second compute node and the first memory of the first compute node through the second fabric access module.

8. The storage system of claim 6 , wherein the first multi-initiator module is further configured to enable both the third compute node and the fourth compute node to initiate atomic memory operations on the first memory of the first compute node and the second memory of the second compute node through the first fabric access module; and

wherein the second multi-initiator module is further configured to enable both the third compute node and the fourth compute node to initiate atomic memory operations on the second memory of the second compute node and the first memory of the first compute node through the second fabric access module.

9. The storage system of claim 5 , wherein the first fabric access module contains a first multi-initiator module configured to enable both the first compute node and the second compute node to initiate atomic memory operations on the third memory of the third compute node and the fourth memory of the fourth compute node through the first fabric access module; and

wherein the second host adapter contains a second multi-initiator module configured to enable both the second compute node and the first compute node to initiate atomic memory operations on the third memory of the third compute node and the fourth memory of the fourth compute node through the second fabric access module.

Assignments (9)
RELEASE OF SECURITY INTEREST IN PATENTS PREVIOUSLY RECORDED AT REEL/FRAME (053311/0169) Recorded Jun 23, 2022
From: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
To: DELL PRODUCTS L.P.; EMC CORPORATION; EMC IP HOLDING COMPANY LLC
Reel/Frame 060438/0742 →
RELEASE OF SECURITY INTEREST IN PATENTS PREVIOUSLY RECORDED AT REEL/FRAME (053546/0001) Recorded Jun 23, 2022
From: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
To: DELL MARKETING L.P. (ON BEHALF OF ITSELF AND AS SUCCESSOR-IN-INTEREST TO CREDANT TECHNOLOGIES, INC.); DELL INTERNATIONAL L.L.C.; DELL PRODUCTS L.P.; DELL USA L.P.; EMC CORPORATION; DELL MARKETING CORPORATION (SUCCESSOR-IN-INTEREST TO FORCE10 NETWORKS, INC. AND WYSE TECHNOLOGY L.L.C.); EMC IP HOLDING COMPANY LLC
Reel/Frame 071642/0001 →
RELEASE OF SECURITY INTEREST IN PATENTS PREVIOUSLY RECORDED AT REEL/FRAME (052216/0758) Recorded Jun 23, 2022
From: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
To: DELL PRODUCTS L.P.; EMC IP HOLDING COMPANY LLC
Reel/Frame 060438/0680 →
RELEASE OF SECURITY INTEREST AF REEL 052243 FRAME 0773 Recorded Nov 2, 2021
From: CREDIT SUISSE AG, CAYMAN ISLANDS BRANCH
To: DELL PRODUCTS L.P.; EMC IP HOLDING COMPANY LLC
Reel/Frame 058001/0152 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 9, 2020
From: GUYER, JAMES; DUQUETTE, JASON; TRINGALE, ALESIA; ZHIVICH, JULIE
To: EMC IP HOLDING COMPANY LLC
Reel/Frame 052874/0394 →
SECURITY INTEREST Recorded Jun 5, 2020
From: DELL PRODUCTS L.P.; EMC CORPORATION; EMC IP HOLDING COMPANY LLC
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS COLLATERAL AGENT
Reel/Frame 053311/0169 →
SECURITY AGREEMENT Recorded Apr 22, 2020
From: CREDANT TECHNOLOGIES INC.; DELL INTERNATIONAL L.L.C.; DELL MARKETING L.P.; DELL PRODUCTS L.P.; DELL USA L.P.; EMC CORPORATION; FORCE10 NETWORKS, INC.; WYSE TECHNOLOGY L.L.C.; EMC IP HOLDING COMPANY LLC
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A.
Reel/Frame 053546/0001 →
SECURITY AGREEMENT Recorded Mar 26, 2020
From: DELL PRODUCTS L.P.; EMC IP HOLDING COMPANY LLC
To: CREDIT SUISSE AG, CAYMAN ISLANDS BRANCH
Reel/Frame 052243/0773 →
PATENT SECURITY AGREEMENT (NOTES) Recorded Mar 24, 2020
From: DELL PRODUCTS L.P.; EMC IP HOLDING COMPANY LLC
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS COLLATERAL AGENT
Reel/Frame 052216/0758 →