Memory device comprising an electrically floating body transistor

1. An integrated circuit comprising:

a semiconductor memory array comprising a plurality of semiconductor memory cells arranged in a matrix of rows and columns, wherein at least two of said semiconductor memory cells each include:

an electrically floating body region comprising a first conductivity type selected from p-type conductivity type and n-type conductivity type;

a source line region comprising a second conductivity type selected from said p-type conductivity type and said n-type conductivity type and being different from said first conductivity type, said source line region in physical contact with said electrically floating body region;

a drain region comprising said second conductivity type in physical contact with said electrically floating body region and spaced apart from said source line region;

a charge injector region, wherein said charge injector region comprises said second conductivity type and is in physical contact with said electrically floating body region and spaced apart from said source line region and said drain region; and

a gate region positioned in between said source line region and said drain region, the gate region being positioned between said source line region and said charge injector region, and the gate region being positioned between said drain region and said charge injector region;

wherein said electrically floating body region is configured to have more than one stable state through an application of a bias on said charge injector region;

wherein said charge injector region is commonly connected to at least two of said semiconductor memory cells; and

a control circuit configured to apply a bias to said charge injector region.

2. The integrated circuit of claim 1 configured such that a holding operation on said memory cells does not require any interruption of access to said memory cells.

3. The integrated circuit of claim 1 , wherein said charge injector region is configured to perform a holding operation on all of said memory cells connected to said charge injector region.

4. The integrated circuit of claim 1 , wherein application of a bias to said charge injector region in performance of a holding operation also increases a size of a memory window of said electrically floating body region.

5. The integrated circuit of claim 1 , wherein a depth of said charge injector region is less than a depth of said drain region or said source line region.

6. The integrated circuit of claim 1 , wherein a depth of said charge injector region is less than a depth of said electrically floating body region.

7. The integrated circuit of claim 1 fabricated in a silicon-on-insulator (SOI) substrate.

8. The integrated circuit of claim 1 fabricated in a bulk silicon substrate and further comprising a buried well region comprising said second conductivity type.

9. The integrated circuit of claim 1 formed in a fin structure fabricated in a bulk silicon substrate.

10. The integrated circuit of claim 1 formed in a fin structure fabricated in a silicon-on-insulator (SOI) substrate.

11. An integrated circuit comprising:

a semiconductor memory array comprising a plurality of semiconductor memory cells arranged in a matrix of rows and columns, wherein each of said memory cells is connected in series with an access device, respectively, and wherein each said memory cell includes:

an electrically floating body region comprising a first conductivity type selected from p-type conductivity type and n-type conductivity type;

a source line region comprising a second conductivity type selected from said p-type conductivity type and said n-type conductivity type and being different from said first conductivity type, said source line region in physical contact with said electrically floating body transistor;

a drain region comprising said second conductivity type in physical contact with said electrically floating body region and spaced apart from said source line region; and

a charge injector region, wherein said charge injector region comprises said second conductivity type and is in physical contact with said electrically floating body region and spaced apart from said source line region and said drain region;

a gate region positioned in between said source line region and said drain region, the gate region being positioned between said source line region and said charge injector region, and the gate region being positioned between said drain region and said charge injector region;

wherein said electrically floating body region is configured to have more than one stable state through an application of a bias on said charge injector region;

wherein said charge injector region is commonly connected to at least two of said semiconductor memory cells; and

a control circuit configured to apply a bias to said charge injector region.

12. The integrated circuit of claim 11 configured such that a holding operation on said memory cells does not require any interruption of access to said memory cells.

13. The integrated circuit of claim 11 , wherein said charge injector region is configured to perform a holding operation on all of said memory cells connected to said charge injector region.

14. The integrated circuit of claim 11 , wherein application of a bias to said charge injector region in performance of a holding operation also increases a size of a memory window of said electrically floating body region.

15. The integrated circuit of claim 11 , wherein a depth of said charge injector region is less than a depth of said drain region or said source line region.

16. The integrated circuit of claim 11 , wherein a depth of said charge injector region is less than a depth of said electrically floating body region.

17. The integrated circuit of claim 11 fabricated in a silicon-on-insulator (SOI) substrate.

18. The integrated circuit of claim 11 fabricated in a bulk silicon substrate and further comprising a buried well region comprising said second conductivity type.

19. The integrated circuit of claim 11 formed in a fin structure fabricated in a bulk silicon substrate.

20. The integrated circuit of claim 11 formed in a fin structure fabricated in a silicon-on-insulator (SOI) substrate.