SEMICONDUCTOR CLIP AND RELATED METHODS
Implementations of semiconductor clips may include a die attach portion coupled to a step portion, a lead attach portion directly coupled to the step portion, a first alignment feature directly coupled to a first side of the lead attach portion, and a second alignment feature directly coupled to a second side of the lead attach portion. The second side may be opposite the first side. The lead attach portion may be in a plane substantially parallel with a plane formed by the die attach portion.
1 . A semiconductor clip comprising:
a die attach portion coupled to a step portion;
a lead attach portion directly coupled to the step portion;
a first alignment feature directly coupled to a first side of the lead attach portion; and
a second alignment feature directly coupled to a second side of the lead attach portion, wherein the second side is opposite the first side;
wherein the lead attach portion is in a plane substantially parallel with a plane formed by the die attach portion.
2 . The semiconductor clip of claim 1 , wherein an entirety of the lead attach portion is planar.
3 . The semiconductor clip of claim 1 , wherein the die attach portion includes one or more openings therethrough.
4 . The semiconductor clip of claim 1 , wherein the first alignment feature and the second alignment feature extend substantially perpendicularly from the lead attach portion.
5 . A semiconductor package comprising:
a die coupled over a lead frame;
a lead comprising one of two openings or two notches; and
a clip comprising;
a die attach portion coupled to a lead attach portion;
a first alignment feature coupled to a first side of the lead attach portion; and
a second alignment feature coupled to a second side of the lead attach portion, the second side opposite the first side;
wherein the die attach portion is coupled over the die;
wherein the lead attach portion is coupled over the lead;
wherein the first alignment feature and the second alignment feature are coupled within one of the two openings or the two notches.
6 . The semiconductor package of claim 5 , wherein the lead attach portion is planar.
7 . The semiconductor package of claim 5 , further comprising a mold compound coupled over the clip and the lead frame.
8 . The semiconductor package of claim 5 , wherein the lead comprises a plurality of grooves in the side of the lead configured to be coupled to the clip.
9 . The semiconductor package of claim 5 , wherein the lead comprises one or more recesses therein.
10 . The semiconductor package of claim 5 , wherein the lead attach portion is in a first plane substantially parallel with a second plane formed by the die attach portion.
11 . The semiconductor package of claim 5 , wherein the first alignment feature and the second alignment feature extend substantially perpendicularly from the lead attach portion.
12 . The semiconductor package of claim 5 , wherein the die comprises silicon carbide.
13 . The semiconductor package of claim 5 , wherein the lead attach portion is welded to the lead through ultrasonic clip welding.
14 . The semiconductor package of claim 5 , further comprising a bond wire bonded to the die and to a second lead.
15 - 20 . (canceled)