Evaporator device, consumable unit, inhaler and method for manufacturing electrically heatable heating bodies and seal carriers

1. An evaporator device for an inhaler, for an electronic cigarette product, comprising:

a heating body having at least one passage opening for evaporating liquid contained in the passage opening,

wherein the heating body is electrically heated:

a carrier for retaining the heating body; and

a sealing device,

wherein the sealing device is arranged between the heating body and the carrier and encloses the at least one passage opening in a sealing manner,

wherein a surface of the carrier contacting the sealing device has a recess corresponding to the geometry of the sealing device for inserting the sealing device.

2. The evaporator device according to claim 1 ,

wherein the sealing device completely encloses the at least one passage opening.

3. A method for manufacturing a plurality of seal carriers for sealing electrically heatable heating bodies for an evaporator device, each seal carrier having at least one liquid opening for conducting liquid, comprising:

providing a plate-like material;

incorporating a plurality of liquid openings extending through the plate-like material in the direction normal to a surface of the plate-like material;

separating the plate-like material along at least one separation line to provide a plurality of seal carriers each seal carrier having at least one liquid opening for conducting liquid; and

arranging a number of seal members corresponding to at least the number of seal carriers in such a manner that each liquid opening of the at least one liquid opening is circumferentially enclosed by a seal member of the number of sealing members.

4. The evaporator device according to claim 1 ,

wherein the sealing device and the heating body are interconnected in a material-tight manner.

5. The evaporator device according to claim 1 ,

wherein the sealing device comprises one or more sealing members.

6. The evaporator device according to claim 1 ,

wherein the sealing device has a lower modulus of elasticity than the heating body and/or the carrier.

7. The evaporator device according to claim 1 , further comprising:

a substrate arranged between the carrier and the heating body for the thermal decoupling of the heating body and the carrier.

8. The evaporator device according to claim 1 , further comprising:

a seal carrier arranged between the carrier and the heating body,

wherein the seal carrier comprises at least one seal member.

9. The evaporator device according to claim 1 ,

wherein the sealing device forms a labyrinth seal.

10. A consumable unit comprising an evaporator device according to claim 1 .

11. An inhaler comprising an evaporator device according to claim 1 .

12. A method for manufacturing a plurality of electrically heatable heating bodies for an evaporator device, each electrically heatable heating body having at least one passage opening for evaporating liquid contained in the at least one passage opening, comprising:

providing a semiconductor material,

wherein the semiconductor material is plate-like;

incorporating a plurality of passage openings extending in the direction normal to the surface of the semiconductor material through the semiconductor material;

separating the semiconductor material along at least one separation line to provide the plurality of electrically heatable heating bodies, each having at least one passage opening of the plurality of passage openings; and

arranging a number of sealing members corresponding to at least the number of electrically heatable heating bodies in such a manner that each passage opening of the at least one passage opening is circumferentially enclosed by a sealing member of the number of sealing members.

13. The method according to claim 12 ,

wherein the number of sealing members are arranged before the semiconductor material is separated.

14. The method according to claim 12 ,

wherein arranging the number of sealing members comprises arranging the number of sealing members in a liquid state.

15. The method according to claim 12 ,

wherein the number of sealing members are connected in a material-tight manner to the semiconductor material and/or the electrically heatable heating body during arranging the number of sealing members.