Solid-state miniature atomic clock and methods of use
Solid-state miniature atomic clock (SMAC) within the form factor of an integrated circuit chip (aka microchip) or flexible device. The present invention includes architectures and methods of manufacture of SMACs. SMACs may include one or more vias, with some or all of the vias containing or other material suitable for an antenna. In addition, the SMAC may include a heating device for temperature stabilization.
1. A flexible circuit electronic solid-state miniature atomic clock, comprising:
a first flexible circuit layer, comprising a first electron paramagnetic resonance sensor;
a second flexible circuit layer adhesively attached to the first flexible circuit layer, wherein the second flexible circuit layer comprises a cavity;
a third flexible circuit layer adhesively attached to the second flexible circuit layer, wherein the third flexible circuit layer comprises a second electron paramagnetic resonance sensor;
one or more single atom-doped fullerene molecules within the cavity;
a first magnet attached to the first flexible circuit layer; and
a second magnet attached to the third flexible circuit layer.
2. The flexible circuit electronic solid-state miniature atomic clock of claim 1 , wherein one or both of the first electron paramagnetic resonance sensor and second electron paramagnetic resonance sensor comprises a magnetic sensor.
3. The flexible circuit electronic solid-state miniature atomic clock of claim 1 , wherein one or both of the first and second electron paramagnetic resonance sensors comprises a copper coil.
4. The flexible circuit electronic solid-state miniature atomic clock of claim 1 additionally comprising a temperature stabilization device.
5. The flexible circuit electronic solid-state miniature atomic clock of claim 4 wherein the temperature stabilization device comprises a vacuum chamber.
6. The flexible circuit electronic solid-state miniature atomic clock of claim 4 wherein the temperature stabilization device comprises a heating coil.
7. The flexible circuit electronic solid-state miniature atomic clock of claim 4 wherein the temperature stabilization device comprises a thermoelectric material.
8. A method of manufacturing a flexible circuit printed electronics solid-state miniature atomic clock, the method comprising the steps of:
forming a cavity between a top flexible circuit layer and a bottom flexible circuit layer, wherein the flexible circuit layers comprise one or more electron paramagnetic resonance sensors;
depositing one or more molecules into the cavity;
laminating the top flexible circuit layer to seal the cavity;
placing a first magnet on a top of the top flexible circuit layer; and
placing a second magnet on a bottom of the bottom flexible circuit layer.
9. The method of claim 8 , wherein the one or more molecules comprise single atom-doped fullerene.
10. The method of claim 9 , wherein the one or more molecules comprise nitrogen.
11. The method of claim 10 additionally comprising the step of placing an temperature stabilization item proximate to the cavity.
12. The method of claim 11 wherein the temperature stabilization item proximate to the cavity comprises a coil.
13. The method of claim 11 wherein the temperature stabilization item proximate to the cavity comprises a thermoelectric material.
14. The method of claim 13 , wherein the step of forming the cavity between a top flexible circuit layer and the bottom flexible circuit layer comprises placing a middle flexible circuit layer between the top flexible circuit layer and the bottom flexible circuit layer, and obliterating a horizontally middle portion of the middle flexible circuit layer.
15. A silicon chip solid-state miniature atomic clock, comprising:
a silicon substrate, wherein the silicon substrate comprises a cavity;
one or more vias formed within the silicon substrate;
copper contained by the silicon substrate at least one of the one or more vias;
a first magnet attached to a bottom of the silicon substrate; and
a second magnet attached to a top of the silicon substrate.
16. The silicon chip solid-state miniature atomic clock of claim 15 , further comprising one or more vacuum insulation chambers within the silicon substrate.
17. The silicon chip solid-state miniature atomic clock of claim 16 , wherein the copper forms an antenna.
18. The silicon chip solid-state miniature atomic clock of claim 16 , wherein the copper forms a coil.
19. The silicon chip solid-state miniature atomic clock of claim 16 additionally comprising a thermoelectric material.
20. The silicon chip solid-state miniature atomic clock of claim 16 additionally comprising a heating element.