Semiconductor laser device and manufacturing method therefor

1. A semiconductor laser device equipped with a semiconductor laser element, the semiconductor laser device comprising:

the semiconductor laser element;

a sub mount member;

a mount section having an upper surface on which the semiconductor laser element is mounted with the sub mount member interposed therebetween;

a lead pin disposed at left and right sides of the mount section and extending in a front-rear direction, wherein an output direction in which a main beam is output from the semiconductor laser element is defined as a front direction, a direction parallel to the output direction is defined as the front-rear direction, and a direction orthogonal to the front-rear direction is defined as a left-right direction;

a retainer that retains the mount section and the lead pin together and that is composed of an insulative material; and

a protrusion protruding toward the left and right sides of the mount section and constituted by a part of a tie bar,

wherein a lower surface of the mount section is parallel to an upper surface of the mount section and protrudes from a lower surface of the retainer, and

wherein each of the retainer and the lead pin has a copper core.

2. The semiconductor laser device according to claim 1 ,

wherein the mount section has various thicknesses in the front-rear direction and the left-right direction of the mount section such that a thickness in a peripheral area surrounding a central area is smaller than a thickness in the central area.

3. The semiconductor laser device according to claim 2 ,

wherein a thickness of the lead pin in an up-down direction is equal to the thickness of the peripheral area of the mount section.

4. The semiconductor laser device according to claim 1 ,

wherein the retainer is open in the front direction and allows a part of the protrusion to protrude in the left-right direction, and

wherein a peripheral area of the mount section is clamped by the retainer in an up-down direction and the left-right direction.

5. The semiconductor laser device according to claim 1 ,

wherein the lead pin extends through the retainer and has a bent section bent in an up-down direction in an area provided inside the retainer.

6. The semiconductor laser device according to claim 1 ,

wherein the lead pin has an area clamped by the retainer from two directions including an up-down direction and the left-right direction.

7. The semiconductor laser device according to claim 1 ,

wherein an outermost surface of each of the retainer and the lead pin is plated with metal having high solder wettability.

8. The semiconductor laser device according to claim 1 ,

wherein the lead pin is disposed at left and right sides of the semiconductor laser element.

9. The semiconductor laser device according to claim 1 ,

wherein the semiconductor laser element is configured to radiate a plurality of laser beams having identical or different oscillation wavelengths.

10. A semiconductor laser device equipped with a semiconductor laser element, the semiconductor laser device comprising:

the semiconductor laser element;

a sub mount member;

a mount section having an upper surface on which the semiconductor laser element is mounted with the sub mount member interposed therebetween;

a lead pin disposed at left and right sides of the mount section and extending in a front-rear direction, wherein an output direction in which a main beam is output from the semiconductor laser element is defined as a front direction, a direction parallel to the output direction is defined as the front-rear direction, and a direction orthogonal to the front-rear direction is defined as a left-right direction;

a retainer that retains the mount section and the lead pin together and that is composed of an insulative material; and

a protrusion protruding toward the left and right sides of the mount section and constituted by a part of a tie bar,

wherein a lower surface of the mount section is parallel to an upper surface of the mount section and protrudes from a lower surface of the retainer,

wherein the retainer has a frame section disposed around the semiconductor laser element,

wherein the frame section includes a window that is open in the front direction and that is for outputting the main beam from the semiconductor laser element, and also includes an opening through which an upper surface of the lead pin is exposed, and

wherein an upper surface of the semiconductor laser element and the upper surface of the lead pin are connected by a wire via the opening.

11. A semiconductor laser device equipped with a semiconductor laser element, the semiconductor laser device comprising:

the semiconductor laser element;

a sub mount member;

a mount section having an upper surface on which the semiconductor laser element is mounted with the sub mount member interposed therebetween;

a lead pin disposed at left and right sides of the mount section and extending in a front-rear direction, wherein an output direction in which a main beam is output from the semiconductor laser element is defined as a front direction, a direction parallel to the output direction is defined as the front-rear direction, and a direction orthogonal to the front-rear direction is defined as a left-right direction;

a retainer that retains the mount section and the lead pin together and that is composed of an insulative material; and

a protrusion protruding toward the left and right sides of the mount section and constituted by a part of a tie bar,

wherein a lower surface of the mount section is parallel to an upper surface of the mount section and protrudes from a lower surface of the retainer,

wherein the retainer has a frame section disposed surrounding the sub mount member,

wherein the frame section includes an opening through which an upper surface of the lead pin is exposed, and

wherein an upper surface of the sub mount member and the upper surface of the lead pin are connected by a wire via the opening.