IP Library Granted Patent US 11,135,848
Granted Patent B2
US 11,135,848 · App. 16/702,351 · Granted Oct 5, 2021

Liquid ejecting head and liquid ejecting apparatus

Inventors: Mengfei Wong (Mishima Shizuoka, JP); Ryutaro Kusunoki (Mishima Shizuoka, JP); Shuhei Yokoyama (Mishima Shizuoka, JP)
Assignee: TOSHIBA TEC KABUSHIKI KAISHA
B41J2/1612B41J2/04581B41J2/14233B41J2/161B41J2/162B41J2/164B41J2/1606B41J2/1617B41J2/1626B41J2002/14258B41J2002/14491B41J2202/20B41J2202/22
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Quick Facts
Patent No.
US 11,135,848
App. No.
16/702,351
Granted
Oct 5, 2021
Kind
B2
Abstract

A liquid ejecting head includes a driving substrate including a driving element configured to, in response to a signal from an external controller, expand or contract so that a liquid is discharged from a pressure chamber through a nozzle, and a connection portion connecting the driving element to a wiring substrate connectable to the external controller; a sealing member that covers the connection portion and a part of the wiring substrate; and a mask plate partially covering a part of the driving substrate including the connection portion and contacting the sealing member.

Claims (68)

1. A liquid ejecting head comprising:

a driving substrate including:

a nozzle through which a liquid is to be discharged in a first direction,

a driving element configured to, in response to a signal from an external controller, expand or contract so that the liquid is discharged from a pressure chamber through the nozzle, and

a wiring line arranged below the driving element in the first direction and electrically connected to the driving element, the wiring line extending to a connection portion through which the driving element is electrically connected to a wiring substrate connectable to the external controller;

a sealing member that covers a part of the wiring substrate, wherein an upper part of the sealing member is located farther from the wiring line than an upper surface of the driving substrate in the first direction; and

a mask plate partially covering the sealing member, wherein the mask plate contacts the upper part of the sealing member from above in the first direction.

2. The liquid ejecting head according to the claim 1 , wherein

the driving element includes a piezoelectric film and an electrode which is laminated on the piezoelectric film and is electrically connected to the connection portion through the wiring line.

3. The liquid ejecting head according to claim 1 , wherein the driving substrate further includes:

a diaphragm above which the driving element is formed; and

a protection layer covering the driving element.

4. The liquid ejecting head according to claim 1 , wherein

the driving element has a ring shape, and

the nozzle is formed by a passage passing through the hole of the driving element and penetrating the driving substrate to the pressure chamber.

5. The liquid ejecting head according to the claim 4 , wherein

the driving substrate includes an ink repellent film covering the driving element.

6. The liquid ejecting head according to claim 5 , wherein

the ink repellent film extends from the nozzle to the sealing member.

7. The liquid ejecting head according to claim 1 , wherein

the mask plate comprises a first surface that contacts the upper part of the sealing member and a second surface that extends perpendicular to the first surface.

8. The liquid ejecting head according to claim 7 , further comprising:

a pressure chamber base arranged below the driving substrate and including the pressure chamber; and

a channel base arranged below the pressure chamber base and including a common chamber communicating with the pressure chamber, wherein

the second surface extends in a direction in which the driving substrate, the pressure chamber base, and the channel base are stacked.

9. The liquid ejecting head according to claim 7 , wherein

the mask plate has an L-shape.

10. The liquid ejecting head according to claim 7 , wherein

the second surface and a part of the wiring substrate extend in the same direction.

11. A liquid ejecting apparatus comprising:

a controller;

a liquid tank that stores liquid; and

a liquid ejecting head connected to the liquid tank and comprising:

a driving substrate including:

a nozzle through which a liquid is to be discharged in a first direction,

a driving element configured to, in response to a signal from the controller, expand or contract so that the liquid is discharged from a pressure chamber through the nozzle, and

a wiring line arranged below the driving element in the first direction and electrically connected to the driving element, the wiring line extending to a connection portion through which the driving element is electrically connected to a wiring substrate connectable to the controller,

a sealing member that covers a part of the wiring substrate, wherein an upper part of the sealing member is located farther from the wiring line than an upper surface of the driving substrate in the first direction, and

a mask plate partially covering the sealing member, wherein the mask plate contacts the upper part of the sealing member from above in the first direction.

12. The liquid ejecting apparatus according to claim 11 , wherein

the driving element includes a piezoelectric film and an electrode which is laminated on the piezoelectric film and is electrically connected to the connection portion through the wiring line.

13. The liquid ejecting apparatus according to claim 11 , wherein

the driving substrate includes a diaphragm above which the driving element is formed, and a protection layer covering the driving element.

14. The liquid ejecting apparatus according to claim 11 , wherein

the driving element has a ring shape, and

the nozzle is formed by a passage passing through the hole of the driving element and penetrating the driving substrate to the pressure chamber.

15. The liquid ejecting apparatus according to claim 14 , wherein

the driving substrate includes an ink repellent film covering the driving element.

16. The liquid ejecting apparatus according to claim 15 , wherein

the ink repellent film extends from the nozzle to the sealing member.

17. The liquid ejecting apparatus according to claim 11 , wherein

the mask plate comprises a first surface that contacts the upper part of the sealing member and a second surface that extends perpendicular to the first surface.

18. The liquid ejecting apparatus according to claim 17 , further comprising:

a pressure chamber base arranged below the driving substrate and including the pressure chamber; and

a channel base arranged below the pressure chamber base and including a common chamber communicating with the pressure chamber, wherein

the second surface extends in a direction in which the driving substrate, the pressure chamber base, and the channel base are stacked.

19. The liquid ejecting apparatus according to claim 17 , wherein

the mask plate has an L-shape.

20. An image forming apparatus comprising:

a controller configured to output a signal according to an image to be formed;

an ink tank that stores ink; and

an ink ejecting head connected to the ink tank and comprising:

a driving substrate including:

a nozzle through which the ink is to be discharged in a first direction, and

a driving element configured to, in response to a signal from the controller, expand or contract so that the liquid is discharged from a pressure chamber through the nozzle, and

a wiring line arranged below the driving element in the first direction and electrically connected to the driving element, the wiring line extending to a connection portion through which the driving element is electrically connected to a wiring substrate connectable to the controller,

a sealing member that covers a part of the wiring substrate, wherein an upper part of the sealing member is located farther from the wiring line than an upper surface of the driving substrate in the first direction, and

a mask plate partially covering the sealing member, wherein the mask plate contacts the upper part of the sealing member from above in the first direction.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 7, 2024
From: TOSHIBA TEC KABUSHIKI KAISHA
To: RISO TECHNOLOGIES CORPORATION
Reel/Frame 068493/0970 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 3, 2019
From: WONG, MENGFEI; KUSUNOKI, RYUTARO; YOKOYAMA, SHUHEI
To: TOSHIBA TEC KABUSHIKI KAISHA
Reel/Frame 051166/0939 →
Priority Claims (1)
JP JP2019-008498 · Jan 22, 2019 · national
Continuity (1)
Related Publication 20200230957A1 · Jul 23, 2020