IP Library Patent Application 16702832
Patent Application
App. No. 16/702,832

COMPOSITE CONTAINING POLY(GLYCEROL SEBACATE) FILLER

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Quick Facts
Patent No.
US None
App. No.
16/702,832
Abstract

A filler material of a thermoset resin of a diacid/polyol, such as PGS is provided. The filler useful in forming composites, such as those in which the filler and a resin matrix are of the same material to provide a homogenous polymeric composition. Composites in which at least one of the matrix, the filler or both are PGS are also provided. Methods of forming such filler materials and composites are also disclosed. The composites allow extrusion process to form articles from materials that would not otherwise be capable of being extruded.

Claims (20)

1 . A filler material comprising particles of a thermoset resin of a polymer that comprises a condensation reaction product of a diacid and a polyol and having a particle size between 0.5 and 1000 microns.

2 . The filler material of claim 1 , having a particle size between 0.5 and 300 microns.

3 . The filler material of claim 1 , wherein the filler material is a thermoset resin of polymer of glycerol/sebacic acid (PGS).

4 . The filler material of claim 3 , wherein the PGS has a molar ratio of glycerol to sebacic acid in the range of 0.7:1 to 1.3:1.

5 . The filler material of claim 4 , wherein the PGS has a molar ratio of glycerol to sebacic acid of 1:1.

6 . The filler material of claim 3 , wherein the PGS has a cross-link density of about 0.07 mol/L or greater.

7 . The filler material of claim 1 , wherein the thermoset resin is doped with an active ingredient.

8 . A method of forming a filler material, the method comprising:

providing a thermoset material comprising polymer of glycerol/sebacic acid (PGS); and

forming particles of the thermoset material having a particle size between 0.5 and 1000 microns.

9 . The method of claim 8 , wherein the step of forming comprises cryogrinding the thermoset material.

10 . The method of claim 9 , wherein the particles of the thermoset material have a particle size between 0.5 and 300 microns.

11 . The method of claim 8 , wherein the step of forming comprises soaking the thermoset material in a solvent to dissolve low molecular weight fractions and thereafter milling the thermoset material.

12 . The method of claim 11 , wherein the solvent is an organic solvent selected from the group consisting of ethyl acetate and tetrahydrofuran.

13 . The method of claim 8 further comprising sizing the particles of the thermoset material.

14 . The method of claim 13 , wherein the sizing comprises sieving.

15 . The method of claim 8 , wherein the step of forming particles comprises soaking the thermoset material in a solvent to dissolve low molecular weight fractions and thereafter agitating the thermoset material to crumble the thermoset material into the particles.

16 . The method of claim 8 , wherein the thermoset material is doped with an active ingredient.

17 . The method of claim 8 further comprising curing a resin of PGS to form the thermoset material.

18 . The method of claim 17 further comprising loading the resin of PGS with an active ingredient prior to curing the resin of PGS.

Assignments (2)
SECURITY INTEREST Recorded May 28, 2021
From: THE SECANT GROUP, LLC
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 056421/0952 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 4, 2019
From: WROBLESKY, KAYLA; SMOOT, CARISSA; GABRIELE, PETER D.; HARRIS, JEREMY J.; NICHOLSON, CHARLES BRENDAN; LU, STEVEN
To: THE SECANT GROUP, LLC
Reel/Frame 051174/0178 →