Power semiconductor module
A power semiconductor module includes a housing accommodating a power circuit with at least one power semiconductor chip, the housing providing at least two power terminals; a printed circuit board mounted to the housing and electrically connected to the power circuit for distributing auxiliary signals; and at least one auxiliary terminal mounted to the printed circuit board with a press-fit connection provided by a body of the auxiliary terminal.
1. A power semiconductor module, comprising:
a housing accommodating a power circuit with at least one power semiconductor chip, the housing providing at least two power terminals;
a printed circuit board mounted to the housing and electrically connected to the power circuit for distributing auxiliary signals;
at least one auxiliary terminal mounted to the printed circuit board with a press-fit connection provided by a body of the auxiliary terminal;
at least one terminal support mounted to the printed circuit board, the terminal support having a support channel through which the auxiliary terminal is guided with its body;
wherein the terminal support has at least one pin, which is plugged into at least one hole in the printed circuit board.
2. The power semiconductor module of claim 1 ,
wherein the terminal support has an opening accommodating a nut;
wherein the auxiliary terminal is bent, such that a head of the auxiliary terminal protrudes over the nut.
3. The power semiconductor module of claim 2 , wherein the body of the auxiliary terminal has a barbed structure for anchoring the auxiliary terminal in the terminal support.
4. The power semiconductor module of claim 1 ,
wherein the body of the auxiliary terminal has a barbed structure for anchoring the auxiliary terminal in the terminal support.
5. The power semiconductor module of claim 1 ,
wherein the auxiliary terminal is insert moulded into the terminal support.
6. The power semiconductor module of claim 1 ,
wherein a pin of the terminal support is deformed to fix the terminal support on the printed circuit board.
7. The power semiconductor module of claim 1 ,
wherein the body of the auxiliary terminal has two press-fit pins aligned parallel with the body.
8. The power semiconductor module of claim 1 ,
wherein the auxiliary terminal comprises a head with a second press-fit connection for a further printed circuit board.
9. The power semiconductor module of claim 1 ,
wherein the printed circuit board is Sn coated at the press-fit connection.
10. The power semiconductor module of claim 1 ,
wherein the housing of the power semiconductor module is filled with a filling material into which the press-fit connection of the auxiliary terminal is embedded.
11. The power semiconductor module of claim 1 , further comprising:
a module cover attached to the housing above the printed circuit board, wherein the module cover has an opening for guiding the terminal support.
12. The power semiconductor module of claim 1 ,
wherein the printed circuit board is connected via wire bonds with the power circuit;
wherein the printed circuit board is coated with at least one of Ni or Au, where a wire bond is attached to the printed circuit board.
13. The power semiconductor module of claim 1 ,
wherein a rubber element is provided between the printed circuit board and the housing of the power semiconductor module;
wherein the rubber element is provided below wire bonds attached to the printed circuit board.
14. The power semiconductor module of claim 13 ,
wherein the printed circuit board comprises holes for receiving bolts protruding from the housing of the power semiconductor module;
wherein the rubber element comprises openings through which the bolts are guided.
15. The power semiconductor module of claim 14 ,
wherein at least one of the bolts comprises a stop with a diameter larger than the corresponding opening in the circuit board;
wherein the rubber element is compressed by the printed circuit board pressed against the stop.
16. The power semiconductor module claim 15 , wherein at least one bolt is deformed to form a cap to fix the printed circuit board to the housing.
17. The power semiconductor module claim 14 , wherein at least one bolt is deformed to form a cap to fix the printed circuit board to the housing.
18. The power semiconductor module of claim 13 ,
wherein at least one of the bolts comprises a stop with a diameter larger than the corresponding opening in the circuit board;
wherein the rubber element is compressed by the printed circuit board pressed against the stop.
19. The power semiconductor module claim 18 , wherein at least one bolt is deformed to form a cap to fix the printed circuit board to the housing.
20. The power semiconductor module of claim 13 ,
wherein at least one bolt is deformed to form a cap to fix the printed circuit board to the housing.