IP Library Granted Patent US 11,421,485
Granted Patent B1
US 11,421,485 · App. 16/708,411 · Granted Aug 23, 2022

Polycrystalline diamond compacts and applications therefor

Inventors: Brandon Paul Linford (Draper, UT); Cody William Knuteson (Salem, UT); Jason Dean Blackburn (Orem, UT); Daniel Call Mortensen (Provo, UT); Steven Swan (North Salt Lake, UT)
Assignee: US Synthetic Corporation
E21B10/55B01J3/06B01J3/062B24D18/0009B24D99/005E21B10/567B01J2203/062B01J2203/0655B23B27/20
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Quick Facts
Patent No.
US 11,421,485
App. No.
16/708,411
Granted
Aug 23, 2022
Kind
B1
Abstract

Embodiments relate to polycrystalline diamond compacts (“PDCs”) including a polycrystalline diamond (“PCD”) table having a diamond grain size distribution selected for improving performance and/or leachability. In an embodiment, a PDC includes a PCD table bonded to a substrate. The PCD table includes a plurality of diamond grains exhibiting diamond-to-diamond bonding therebetween. The plurality of diamond grains includes a first amount being about 5 weight % to about 65 weight % of the plurality of diamond grains and a second amount being about 18 weight % to about 95 weight % of the plurality of diamond grains. The first amount exhibits a first average grain size of about 0.5 μm to about 30 μm. The second amount exhibits a second average grain size that is greater than the first average grain size and is about 10 μm to about 65 μm. Other embodiments are directed to methods of forming PDCs, and various applications for such PDCs in rotary drill bits, bearing apparatuses, and wire-drawing dies.

Claims (30)

1. A method of fabricating a polycrystalline diamond compact, comprising:

mixing a plurality of diamond particles having at least a trimodal distribution including a first amount being about 5 weight % to about 65 weight % of the plurality of diamond particles that exhibits a first average particle size of about 0.5 μm to about 30 μm, a second amount being about 18 weight % to about 65 weight % of the plurality of diamond particles that exhibits a second average particle size that is greater than the first average particle size and is about 10 μm to about 65 μm, and a third amount comprising about 5 weight % to about 35 weight % of the plurality of diamond particles that exhibits a third average particle size of about 20 μm to about 45 μm;

enclosing the plurality of diamond particles in a pressure transmitting medium to form a cell assembly; and

subjecting the cell assembly to a high-pressure/high-temperature process to form a polycrystalline diamond body.

2. The method of claim 1 , wherein the first amount is about 15 weight % to about 45 weight %.

3. The method of claim 2 , wherein the first average particle size is about 0.5 μm to about 14 μm and the second average particle size is about 15 μm to about 24 μm.

4. The method of claim 3 , wherein the first amount is about 38 weight % to about 42 weight %, the first average particle size is about 12 μm, the second amount is about 58 weight % to about 62 weight %, and the second average particle size is about 20 μm.

5. The method of claim 1 , wherein the first average particle size is about 0.5 μm to about 5 μm and the second average particle size is about 14 μm to about 18 μm.

6. The method of claim 1 , wherein the first amount is about 20 weight % to about 45 weight %, the second amount is about 55 weight % to about 65 weight %, the first average particle size is about 0.5 μm to about 5 μm, and the second average particle size is about 12 μm to about 30 μm.

7. The method of claim 6 , wherein the first amount is about 20 weight % to about 30 weight % and the second average particle size is about 15 μm to about 20 μm.

8. The method of claim 7 , wherein the first average particle size is about 0.5 μm to about 5 μm and the second average particle size is about 14 μm to about 18 μm.

9. The method of claim 1 , wherein the first amount is about 35 weight % to about 45 weight %, second amount is about 55 weight % to about 65 weight %, the first average particle size is about 0.5 μm to about 5 μm, and the second average particle size is about 30 μm to about 32 μm.

10. The method of claim 6 , wherein the first average particle size is about 2 μm and the second average particle size is about 16 μm.

11. The method of claim 1 , wherein the first amount is greater than about 20 weight % and less than about 65 weight %, the first average particle size is about 0.5 μm to about 5 μm, and the second average particle size is about 12 μm to about 30 μm.

12. The method of claim 1 , wherein the first amount is about 25 weight % to about 40 weight %, the first average particle size is about 0.5 μm to about 14 μm, and the second average particle size is about 16 μm to about 30 μm.

13. The method of claim 1 , wherein the first amount is about 35 weight % to about 45 weight %, the second amount is about 55 weight % to about 65 weight %, the first average particle size is about 10 μm to about 14 μm, and the second average particle size is about 18 μm to about 22 μm.

14. The method of claim 1 , wherein the third average particle size is greater than the first average particle size and the second average particle size.

15. The method of claim 1 , wherein the third amount is about 10 weight % to about 20 weight % of the plurality of diamond particles.

16. The method of claim 1 , wherein the third average particle size is about 27 μm to about 33 μm.

17. A method of fabricating a polycrystalline diamond compact, comprising:

mixing a plurality of diamond particles having at least a trimodal distribution including a first amount being about 20 weight % to about 30 weight % of the plurality of diamond particles that exhibits a first average particle size of about 0.5 μm to about 3 μm and a second amount being about 55 weight % to about 65 weight % of the plurality of diamond particles that exhibits a second average particle size that is greater than the first average particle size and is about 14 μm to about 18 μm;

enclosing the plurality of diamond particles in a pressure transmitting medium to form a cell assembly; and

subjecting the cell assembly to a high-pressure/high-temperature process to form a polycrystalline diamond body,

wherein the plurality of diamond particles further includes a third amount of about 5 weight % to about 35 weight % of the plurality of diamond particles that exhibits a third average particle size that is greater than the first average particle size and the second average particle size, and

wherein the third average particle size is about 27 μm to about 33 μm.

18. The method of claim 17 , wherein the first amount is about 26 weight %, the third amount is about 15 weight %, the first average particle size is about 2 μm, the second average particle size is about 16 μm, and the third average particle size is about 30 μm.

19. The method of claim 1 , further comprising mixing boron with the plurality of diamond particles in an amount greater than 0 weight % to about 5 weight %.

20. The method of claim 1 , wherein:

the cell assembly includes a substrate positioned at least proximate to the plurality of diamond particles; and

subjecting the cell assembly to a high-pressure/high-temperature process to form a polycrystalline diamond body includes forming the polycrystalline diamond body as a table bonded to the substrate.

Assignments (5)
RELEASE OF SECURITY INTEREST IN PATENTS Recorded Jul 17, 2025
From: JPMORGAN CHASE BANK, N.A.
To: CHAMPIONX LLC; APERGY ESP SYSTEMS, LLC; APERGY BMCS ACQUISITION CORP; HARBISON-FISCHER, INC.; NORRIS RODS, INC.,; NORRIS RODS, INC.,; NORRISEAL-WELLMARK, INC.; PCS FERGUSON, INC.; QUARTZDYNE, INC.; US SYNTHETIC CORPORATION
Reel/Frame 072004/0019 →
RELEASE OF SECURITY INTEREST Recorded Jun 7, 2022
From: BANK OF AMERICA, N.A.
To: ACE DOWNHOLE, LLC; HARBISON-FISCHER, INC.; NORRIS RODS, INC.; PCS FERGUSON, INC.; QUARTZDYNE, INC.; SPIRIT GLOBAL ENERGY SOLUTIONS, INC.; THETA OILFIELD SERVICES, INC.; APERGY BMCS ACQUISITION CORP.; NORRISEAL-WELLMARK, INC.; US SYNTHETIC CORPORATION; WINDROCK, INC.
Reel/Frame 060305/0001 →
SECURITY INTEREST Recorded Apr 30, 2021
From: APERGY ESP SYSTEMS, LLC; APERGY BMCS ACQUISITION CORPORATION; CHAMPIONX USA INC.; HARBISON-FISCHER, INC.; NORRIS RODS, INC.; NORRISEAL-WELLMARK, INC.; PCS FERGUSON, INC.; QUARTZDYNE, INC.; US SYNTHETIC CORPORATION; WINDROCK, INC.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 056106/0007 →
SECURITY INTEREST Recorded Jun 5, 2020
From: ACE DOWNHOLE, LLC; APERGY BMCS ACQUISITION CORP.; HARBISON-FISCHER, INC.; NORRIS RODS, INC.; NORRISEAL-WELLMARK, INC.; PCS FERGUSON, INC.; QUARTZDYNE, INC.; SPIRIT GLOBAL ENERGY SOLUTIONS, INC.; THETA OILFIELD SERVICES, INC.; US SYNTHETIC CORPORATION; WINDROCK, INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 053790/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 23, 2020
From: LINFORD, BRANDON PAUL; KNUTESON, CODY WILLIAM; BLACKBURN, JASON DEAN; MORTENSEN, DANIEL CALL; SWAN, STEVEN
To: US SYNTHETIC CORPORATION
Reel/Frame 051596/0936 →