Optoelectronic module assembly and manufacturing method
An optoelectronic module assembly includes an optoelectronic module. The module includes: an active optoelectronic component in or on a mounting substrate, an optical sub-assembly, and a spacer disposed between the mounting substrate and the optical sub-assembly so as to establish a particular distance between the active optoelectronic component and the optical sub-assembly. The optoelectronic module assembly also includes a recessed substrate including first and second surfaces, wherein the second surface is in a plane closer to the optical sub-assembly than is the first surface. The optoelectronic module is mounted on the first surface. The second surface is for mounting other components.
1. An optoelectronic module comprising:
an active optoelectronic component in or on a mounting substrate, the mounting substrate having a first surface and having a second surface on an opposite side from the first surface;
an optical sub-assembly;
a spacer disposed between the mounting substrate and the optical sub-assembly so as to establish a particular distance between the active optoelectronic component and the optical sub-assembly;
first electrical contacts disposed on the first surface of the mounting substrate; and
second electrical contacts disposed on the second surface of the mounting substrate;
wherein the first and second electrical contacts are configured to permit active alignment of the active optoelectronic component and the optical sub-assembly.
2. The optoelectronic module of claim 1 , wherein the spacer comprises electrically insulating protrusions that project beyond the second surface of the mounting substrate in a direction away from the optical sub-assembly.
3. The optoelectronic module of claim 1 wherein the mounting substrate comprises a lead frame, printed circuit board or ceramic board having conductive wiring.