Semiconductor device and manufacturing method thereof
A method for manufacturing a semiconductor device and a semiconductor device produced thereby. For example and without limitation, various aspects of this disclosure provide methods for manufacturing a semiconductor device, and semiconductor devices produced thereby, that comprise forming an interposer including a reinforcement layer.
1. An electronic device comprising:
a substrate reinforcement layer comprising a top side, a bottom side, and an aperture that extends between the top and bottom sides of the substrate reinforcement layer, where the substrate reinforcement layer is a remnant of a thinned substrate and comprises a non-conductor material and/or a semiconductor material;
a substrate dielectric layer comprising a top side and a bottom side, where the bottom side of the substrate dielectric layer is coupled to the top side of the substrate reinforcement layer; and
a substrate conductive layer comprising a top side and a bottom side, where the bottom side of the substrate conductive layer is coplanar with the bottom side of the substrate dielectric layer, and where at least a portion of the bottom side of the substrate conductive layer is exposed through the substrate reinforcement layer by the aperture;
an upper dielectric layer on the top side of the substrate dielectric layer;
an upper conductive layer on the top side of the substrate conductive layer; and
a lower signal distribution structure on the bottom side of the substrate reinforcement layer and configured to couple an interconnection structure to the bottom side of the substrate conductive layer through the aperture in the substrate reinforcement layer,
wherein the lower signal distribution structure comprises a second dielectric layer that directly contacts and covers the bottom side of the substrate reinforcement layer and that directly contacts and covers a lateral surface of the substrate reinforcement layer inside the aperture.
2. The electronic device of claim 1 , wherein the non-conductor material of the substrate reinforcement layer comprises a glass material or a ceramic material.
3. The electronic device of claim 1 , wherein the interconnection structure comprises a conductive ball or bump.
4. The electronic device of claim 1 , wherein the interconnection structure comprises a conductive post or pillar.
5. The electronic device of claim 1 , wherein the bottom side of the substrate conductive layer comprises a seed layer.
6. The electronic device of claim 1 , wherein the lower signal distribution structure comprises an under bump metal structure configured to attach to the interconnection structure.
7. The electronic device of claim 6 , wherein the under bump metal structure directly contacts the substrate conductive layer.
8. An electronic device comprising:
a substrate reinforcement layer comprising a top side, a bottom side, and an aperture that extends between the top and bottom sides of the substrate reinforcement layer, where the substrate reinforcement layer is a remnant of a thinned substrate and comprises silicon;
a substrate dielectric layer comprising a top side and a bottom side, where the bottom side of the substrate dielectric layer is coupled to the top side of the substrate reinforcement layer; and
a substrate conductive layer comprising a top side and a bottom side, where the bottom side of the substrate conductive layer is coplanar with the bottom side of the substrate dielectric layer, and where at least a portion of the bottom side of the substrate conductive layer is exposed through the substrate reinforcement layer by the aperture;
an upper dielectric layer on the top side of the substrate dielectric layer;
an upper conductive layer on the top side of the substrate conductive layer; and
a lower signal distribution structure on the bottom side of the substrate reinforcement layer and configured to couple an interconnection structure to the bottom side of the substrate conductive layer through the aperture in the substrate reinforcement layer.
9. An electronic device comprising:
a substrate reinforcement layer comprising a top side, a bottom side, and an aperture that extends between the top and bottom sides of the substrate reinforcement layer, where the substrate reinforcement layer is a remnant of a thinned substrate and comprises a non-conductor material and/or a semiconductor material, and wherein the substrate reinforcement layer comprises a grinded surface;
a substrate dielectric layer comprising a top side and a bottom side, where the bottom side of the substrate dielectric layer is coupled to the top side of the substrate reinforcement layer; and
a substrate conductive layer comprising a top side and a bottom side, where the bottom side of the substrate conductive layer is coplanar with the bottom side of the substrate dielectric layer, and where at least a portion of the bottom side of the substrate conductive layer is exposed through the substrate reinforcement layer by the aperture;
an upper dielectric layer on the top side of the substrate dielectric layer;
an upper conductive layer on the top side of the substrate conductive layer; and
a lower signal distribution structure on the bottom side of the substrate reinforcement layer and configured to couple an interconnection structure to the bottom side of the substrate conductive layer through the aperture in the substrate reinforcement layer.
10. An electronic device comprising:
a substrate reinforcement layer comprising a top side, a bottom side, and an aperture that extends between the top and bottom sides of the substrate reinforcement layer;
a substrate dielectric layer comprising a top side and a bottom side, where the bottom side of the substrate dielectric layer is coupled to the top side of the substrate reinforcement layer; and
a substrate conductive layer comprising a top side and a bottom side, where:
the bottom side of the substrate conductive layer comprises a substrate seed layer comprising a top side, and a bottom side that is coplanar with the bottom side of the substrate dielectric layer; and
at least a portion of the bottom side of the substrate seed layer is exposed through the substrate reinforcement layer by the aperture in the reinforcement layer;
a first signal distribution structure comprising:
an upper dielectric layer on the top side of the substrate dielectric layer; and
an upper conductive layer on the top side of the substrate conductive layer; and
a lower signal distribution structure on the bottom side of the substrate reinforcement layer and configured to couple an interconnection structure to the bottom side of the substrate seed layer through the aperture in the reinforcement layer.
11. The electronic device of claim 10 , wherein the substrate reinforcement layer comprises no conductor material.
12. The electronic device of claim 10 , wherein the lower signal distribution structure comprises an under bump metal structure configured to attach to the interconnection structure.
13. The electronic device of claim 10 , wherein the lower signal distribution structure comprises a metal layer that is plated on the bottom side of the substrate seed layer.
14. The electronic device of claim 10 , wherein the lower signal distribution structure comprises a plurality of metal layers that extend into the aperture in the reinforcement layer.
15. The electronic device of claim 10 , wherein the lower signal distribution structure comprises a second dielectric layer that directly contacts and covers a portion of the bottom side of the substrate seed layer.
16. A method of manufacturing an electronic device, the method comprising:
providing a structure comprising a top side and a bottom side, the structure comprising:
a substrate reinforcement layer comprising a top side, a bottom side, and an aperture that extends between the top and bottom sides of the substrate reinforcement layer, where the substrate reinforcement layer is a remnant of a thinned substrate and comprises a non-conductor material and/or a semiconductor material;
a substrate dielectric layer comprising a top side and a bottom side, where the bottom side of the substrate dielectric layer is coupled to the top side of the substrate reinforcement layer; and
a substrate conductive layer comprising a top side and a bottom side, where the bottom side of the substrate conductive layer is coplanar with the bottom side of the substrate dielectric layer, and where at least a portion of the bottom side of the substrate conductive layer is exposed through the substrate reinforcement layer by the aperture;
an upper dielectric layer on the top side of the substrate dielectric layer; and
an upper conductive layer on the top side of the substrate conductive layer; and
forming a lower signal distribution structure on the bottom side of the substrate reinforcement layer and configured to couple an interconnection structure to the bottom side of the substrate conductive layer through the aperture in the substrate reinforcement layer,
wherein:
the substrate reinforcement layer comprises silicon;
the substrate reinforcement layer comprises a grinded surface; and/or
the lower signal distribution structure comprises a second dielectric layer that directly contacts and covers the bottom side of the substrate reinforcement layer and that directly contacts and covers a lateral surface of the substrate reinforcement layer inside the aperture.
17. The method of claim 16 , wherein the non-conductor material and/or the semiconductor material of the substrate reinforcement layer comprises silicon, a glass material, or a ceramic material.
18. The method of claim 16 , wherein the bottom side of the substrate conductive layer comprises a seed layer.
19. The method of claim 16 , wherein the lower signal distribution structure comprises the second dielectric layer that directly contacts and covers the bottom side of the substrate reinforcement layer and that directly contacts and covers the lateral surface of the substrate reinforcement layer inside the aperture.
20. The method of claim 16 , wherein the substrate reinforcement layer comprises the silicon.
21. The method of claim 16 , wherein the substrate reinforcement layer comprises the grinded surface.