Quad small form-factor pluggable thermal test vehicle
A mechanism for performing thermal testing is described. The system for performing thermal testing may include a housing, a heating element and a processor. The housing is configured to be compatible with a plurality of different types of transceiver form factors. The heating element is configured to be at a location within the housing to approximate an integrated circuit chip heat source of the plurality of different types of transceiver form factors. The processor is configured to automatically conduct a thermal test and provide thermal test results.
1. A system, comprising:
a housing configured to be compatible with a plurality of different types of transceivers;
a heating element configured to be at a location within the housing to approximate an integrated circuit chip heat source of the plurality of different types of transceivers;
a thermal sensor; and
a processor configured to automatically conduct a thermal test including by being configured to receive temperature readings from the thermal sensor and provide thermal test results, wherein the thermal test results include a temperature of a thermal mass in an apparatus coupled to the system.
2. The system of claim 1 , wherein the processor is further configured to provide a test traffic load.
3. The system of claim 1 , wherein the thermal test results further include a steady-state temperature of the thermal mass based on the temperature readings.
4. The system of claim 3 , wherein the processor being configured to provide thermal test results includes the processor being configured to:
curve fit the temperature readings to calculate the steady-state temperature of the thermal mass before an actual steady-state temperature is reached by the thermal mass.
5. The system of claim 1 , wherein the housing is configured in a quad small form-factor pluggable configuration.
6. The system of claim 1 , wherein the processor being configured to automatically conduct a thermal test further includes the processor being configured to control the heating element to provide a heat profile of the integrated circuit chip heat source.
7. The system of claim 1 , wherein the processor being configured to automatically conduct a thermal test further includes the processor being configured to control the heating element to provide a plurality of amounts of energy per unit time.
8. The system of claim 1 , further comprising:
a light box for indicating status of the system.
9. The system of claim 1 , further comprising:
a pull handle coupled with the housing.
10. The system of claim 1 , further comprising:
a heat spreader coupled with the heating element.
11. A system, comprising:
a housing configured to be compatible with a plurality of different types of transceiver form factors;
a heating element configured to be at a location within the housing to approximate an integrated circuit chip heat source of the plurality of different types of transceiver form factors;
a heat spreader coupled with the heating element;
a thermal sensor; and
a processor configured to automatically conduct a thermal test and provide thermal test results including a steady-state temperature of a thermal mass, the processor being configured to provide the thermal test results including the processor being configured to
receive temperature readings from the thermal sensor; and
curve fit the temperature readings to calculate the steady-state temperature of the thermal mass before an actual steady-state temperature is reached by the thermal mass.
12. A method, comprising:
plugging a test vehicle into an apparatus having a thermal mass, the test vehicle including a housing, a heating element and a thermal sensor, the housing configured to be compatible with a plurality of different types of transceivers, the heating element configured to be at a location within the housing to approximate an integrated circuit chip heat source of the plurality of different types of transceivers;
controlling the heating element to provide a heat profile corresponding to the integrated circuit chip heat source;
receiving temperature readings from the thermal sensor, and
providing thermal test results based on the temperature readings, the thermal test results including a temperature of the thermal mass in the apparatus coupled to the test vehicle.
13. The method of claim 12 , wherein the test vehicle further includes a processor and wherein the controlling, receiving and providing steps are performed by the processor.
14. The method of claim 13 , further comprising:
utilizing the processor to provide a test traffic load to the apparatus corresponding to the thermal mass.
15. The method of claim 13 , wherein the providing the thermal test results further includes:
determining a steady-state temperature of the thermal mass based on the temperature readings received.
16. The method of claim 15 , wherein the determining the steady-state temperature further includes:
curve fitting the temperature readings to calculate the steady-state temperature of the thermal mass before an actual steady-state temperature is reached by the thermal mass.
17. The method of claim 13 , wherein the controlling the heating element further includes:
controlling the heating element to provide a plurality of amounts of energy per unit time.
18. The method of claim 13 , further comprising:
controlling the heating element based on the temperature readings.
19. The method of claim 18 , wherein the heating element is further configured to be shut off based on the temperatures readings reaching a threshold.