Apparatus and method for transferring semiconductor devices from a substrate and stacking semiconductor devices on each other

1. A method of directly transferring a first semiconductor device die to a substrate from a wafer tape having a first side and a second side, the first semiconductor device die being disposed on the first side of the wafer tape, the substrate including a second semiconductor device die onto which the first semiconductor device die is to be transferred, the method comprising:

loading the wafer tape into a first frame;

loading the substrate into a second frame;

arranging at least one of the first frame or the second frame such that a surface of the substrate is adjacent to the first side of the wafer tape;

orienting a needle to a position adjacent to the second side of the wafer tape, the needle extending in a direction toward the wafer tape;

activating a needle actuator connected to the needle to move the needle to a die transfer position at which the needle contacts the second side of the wafer tape to press the first semiconductor device die into contact with the second semiconductor device die; and

inducing a bond between the first semiconductor device die and the second semiconductor device die such that the first semiconductor device die is released from the wafer tape and is attached to the second semiconductor device die.

2. The method of claim 1 , further comprising loading transfer process data into a controller communicatively coupled with the first frame, the second frame, and the needle actuator,

wherein the controller is configured to control the arranging, the orienting, and the activating, based at least in part on the transfer process data.

3. The method of claim 2 , further comprising determining a position of the first semiconductor device die relative to a die transfer location on the second semiconductor device die to provide the controller with alignment information.

4. The method of claim 1 , wherein the activating moves the needle to press on the second side of the wafer tape to cause a deflection of the wafer tape localized at the first semiconductor device die.

5. The method of claim 1 , wherein inducing the bond is executed via an energy-emitting device.

6. The method of claim 1 , further comprising determining whether additional semiconductor device dies are to be transferred from the wafer tape to the substrate,

wherein, when determined that additional semiconductor device dies are to be transferred, the method further comprises arranging the first frame and the second frame to a subsequent die transfer orientation.

7. The method of claim 1 , wherein the arranging includes:

determining, based at least in part on data input from a first optical sensor, a position of the first semiconductor device die with respect to a die transfer location on the second semiconductor device die; and

determining, based at least in part on a data input from a second optical sensor, a position of the die transfer location on the second semiconductor device die.

8. The method of claim 1 , wherein the activating includes moving the needle to cause a deflection of the wafer tape localized at a position of the first semiconductor device die.

9. A method of directly transferring semiconductor device die, comprising:

loading a wafer tape into a first frame, the wafer tape having a first side and a second side;

loading a substrate into a second frame, the substrate including a second semiconductor device die onto which a first semiconductor device die is to be transferred;

arranging at least one of the first frame or the second frame such that a surface of the substrate is adjacent to the first side of the wafer tape;

orienting a needle to a position adjacent to the second side of the wafer tape, the needle extending in a direction toward the wafer tape;

activating a needle actuator connected to the needle to move the needle to a die transfer position at which the needle contacts the second side of the wafer tape to press the first semiconductor device die into contact with the second semiconductor device die.

10. The method of claim 9 , further comprising:

loading transfer process data into a controller communicatively coupled with the first frame, the second frame, and the needle actuator,

wherein the controller is configured to control the arranging, the orienting, and the activating, based at least in part on the transfer process data.

11. The method of claim 10 , further comprising determining a position of the first semiconductor device die relative to a die transfer location on the second semiconductor device die to provide the controller with alignment information.

12. The method of claim 9 , wherein the arranging includes determining, based at least in part on data input from a first optical sensor, a position of the first semiconductor device die with respect to a die transfer location on the second semiconductor device die.

13. The method of claim 12 , wherein the arranging further includes determining, based at least in part on a data input from a second optical sensor, a position of the die transfer location on the second semiconductor device die.

14. The method of claim 9 , further comprising inducing a bond between the first semiconductor device die and the second semiconductor device die such that the first semiconductor device die is released from the wafer tape and is attached to the second semiconductor device die.

15. The method of claim 14 , wherein the inducing of the bond between the first semiconductor device die and the second semiconductor device die includes applying a vibratory pressure.

16. The method of claim 9 , wherein the activating moves the needle to press on the second side of the wafer tape to cause a deflection of the wafer tape localized at the first semiconductor device die.

17. The method of claim 9 , further comprising:

determining whether additional semiconductor device dies are to be transferred from the wafer tape to the substrate,

in response to a determination that the additional semiconductor device dies are to be transferred from the wafer tape to the substrate, arranging the first frame and the second frame to a subsequent die transfer orientation.