IP Library Granted Patent US 11,240,939
Granted Patent B2
US 11,240,939 · App. 16/727,299 · Granted Feb 1, 2022

Heat dissipation control method, apparatus, and device

Inventors: Jui-Chan Fan (Beijing, CN); Jeng-Meng Lai (Beijing, CN)
Assignee: LENOVO (BEIJING) CO., LTD.
H05K7/20836G05B19/4155G06F1/206H05K7/20736G05B2219/37211
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Quick Facts
Patent No.
US 11,240,939
App. No.
16/727,299
Granted
Feb 1, 2022
Kind
B2
Abstract

A heat dissipation control method includes determining a total power consumption of a heat generating component and a heat dissipating component, determining a heat dissipation parameter based on the total power consumption of the heat generating component and the heat dissipating component, and controlling an operating state of the heat dissipating component based on the heat dissipation parameter.

Claims (49)

1. A heat dissipation control method, comprising:

determining, by a processor of an electronic device, a total power consumption of a heat generating component and a plurality of heat dissipating components, the plurality of heat dissipating components including a number of fans and a heat conductive medium for cooling;

determining, by the processor, a heat dissipation parameter based on the total power consumption of the heat generating component and the plurality of heat dissipating components; and

controlling, by the processor, an operating state of one of the plurality of heat dissipating components based on the heat dissipation parameter, wherein the operating state of one of the plurality of heat dissipating components includes an operating state of one or more of the number of fans and an operating state of the heat conductive medium, the operating state of the one or more of the number of fans includes a quantity of fans being in an active state, and the operating state of the heat conductive medium includes a state of the heat conductive medium converted between a gaseous state and a liquid state by pressure adjustment.

2. The method according to claim 1 , wherein:

determining a heat dissipation parameter comprises determining one or more heat dissipation parameters, each heat dissipation parameter corresponding to a threshold range, and each threshold range corresponding to an operating state of the one of the plurality of heat dissipating components; and

controlling an operating state of the one of the plurality of heat dissipating components based on the heat dissipation parameter comprises in response to a specific parameter of the one of the plurality of heat generating components reaching a corresponding threshold range, controlling an operating state of the one of the plurality of heat dissipating components to operate in the corresponding threshold range.

3. The method according to claim 1 , wherein controlling an operating state of one or more of the number of fans further comprises:

controlling one or more operation parameters of the one or more of the number of fans in the active state.

4. The method according to claim 2 , wherein the heat dissipation parameter comprises a target temperature, and the specific parameter comprises a temperature of the one of the plurality of heat generating components.

5. The method according to claim 1 , wherein:

an operating state of the one or more of the number of fans comprises a rotational speed of a fan; and

controlling an operating state of the one or more of the number of fans based on the heat dissipation parameter comprises adjusting the fan to operate at a rotational speed corresponding to the heat dissipation parameter.

6. The method according to claim 1 , wherein:

controlling an operating state of the heat conductive medium based on the heat dissipation parameter comprises adjusting a pressure of the heat conductive medium based on the heat dissipation parameter, enabling an internal energy change caused by compressing the heat conductive medium to satisfy a cooling requirement.

7. A heat dissipation control apparatus, comprising:

one or more processors; and

a memory for storing one or more programs, the one or more processors executing instructions from the one or more programs to:

determine a total power consumption of a heat generating component and a plurality of heat dissipating components, the plurality of heat dissipating components including a number of fans and a heat conductive medium;

determine a heat dissipation parameter based on the total power consumption of the heat generating component and the plurality of heat dissipating components; and

control an operating state of one of the plurality of heat dissipating components based on the heat dissipation parameter, wherein the operating state of one of the plurality of heat dissipating components includes an operating state of one or more of the number of fans and an operating state of the heat conductive medium, the operating state of the one or more of the number of fans includes a quantity of fans being in an active state, and the operating state of the heat conductive medium includes a state of the heat conductive medium converted between a gaseous state and a liquid state by pressure adjustment.

8. The apparatus according to claim 7 , wherein:

the processor determines one or more heat dissipation parameters, each heat dissipation parameter corresponding to a threshold range, and each threshold range corresponding to an operating state of the one of the plurality of heat dissipating components; and

in response to a specific parameter of the heat generating component reaching a threshold range, the processor controls the one of the plurality of heat dissipating components to operate in an operating state corresponding to the threshold range.

9. The apparatus according to claim 7 , wherein the processor is further configured to:

control one or more operation parameters of the one or more of the number of fans in the active state.

10. The apparatus according to claim 8 , wherein the heat dissipation parameter comprises a target temperature, and the specific parameter comprises a temperature of the one of the plurality of heat generating components.

11. The apparatus according to claim 7 , wherein:

an operating state of the one or more of the number of fans comprises a rotational speed of a fan; and

the processor adjusts the one or more of the number of fans to operate at a rotational speed corresponding to the heat dissipation parameter.

12. The apparatus according to claim 7 , wherein:

the processor adjusts a pressure of the heat conductive medium based on the heat dissipation parameter, enabling an internal energy change caused by compressing the heat conductive medium to satisfy a cooling requirement.

13. An electronic device, comprising:

a processor;

a memory for storing one or more computer programs that, when executed by the processor, causing the processor to:

determine a total power consumption of the heat generating component and a plurality of heat dissipating components, the plurality of heat dissipating components including a number of fans and a heat conductive medium;

determine a heat dissipation parameter based on the total power consumption of the heat generating component and the plurality of heat dissipating components; and

control an operating state of one of the plurality of heat dissipating components based on the heat dissipation parameter, wherein the operating state of one of the plurality of heat dissipating components includes an operating state of one or more of the number of fans and an operating state of the heat conductive medium the operating state of the one or more of the number of fans includes a quantity of fans being in an active state, and the operating state of the heat conductive medium includes a state of the heat conductive medium converted between a gaseous state and a liquid state by pressure adjustment.

14. The electronic device according to claim 13 , wherein:

the processor determines one or more heat dissipation parameters, each heat dissipation parameter corresponding to a threshold range, and each threshold range corresponding to an operating state of the one of the plurality of heat dissipating components; and

in response to a specific parameter of the heat generating component reaching a threshold range, the processor controls the one of the plurality of heat dissipating components to operate in an operating state corresponding to the threshold range.

15. The electronic device according to claim 13 , wherein the processor is further configured to:

control one or more operation parameters of the one or more of the number of fans in the active state.

16. The electronic device according to claim 14 , wherein the heat dissipation parameter comprises a target temperature, and the specific parameter comprises a temperature of the one of the plurality of heat generating components.

17. The electronic device according to claim 13 , wherein:

an operating state of the one or more of the number of fans comprises a rotational speed of a fan; and

the processor adjusts the one or more of the number of fans to operate at a rotational speed corresponding to the heat dissipation parameter.

18. The electronic device according to claim 13 , wherein:

the processor adjusts a pressure of the heat conductive medium based on the heat dissipation parameter, enabling an internal energy change caused by compressing the heat conductive medium to satisfy a cooling requirement.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 26, 2019
From: FAN, JUI-CHAN; LAI, JENG-MENG
To: LENOVO (BEIJING) CO., LTD.
Reel/Frame 051369/0250 →
Priority Claims (1)
CN 201811608069.7 · Dec 26, 2018 · national
Continuity (1)
Related Publication 20200214179A1 · Jul 2, 2020