Sound damping wallboard and method of forming a sound damping wallboard

1. A method forming a sound damping wallboard, the method comprising:

providing a first gypsum layer having a first side with a first gypsum surface and a second side with a second gypsum surface opposite the first gypsum surface, wherein a first paper encasing layer covers the first gypsum surface and a second paper encasing layer covers the second gypsum surface;

removing part of the first encasing layer to expose the first gypsum surface and form a first paper encasing layer portion and a first gypsum surface portion on the first side wherein the first gypsum layer has an edge and wherein at least part of the first paper encasing layer portion is positioned adjacent to the edge;

providing a second gypsum layer having a third side with a third gypsum surface and a fourth side with a fourth gypsum surface opposite the third gypsum surface, wherein a third paper encasing layer covers the third gypsum surface and a fourth paper encasing layer covers the fourth gypsum surface;

removing part of the third encasing layer to expose the third gypsum surface and form a third paper encasing layer portion and a third gypsum surface portion on the third side wherein the second gypsum layer has an edge and wherein at least part of the third paper encasing layer portion is positioned adjacent to the edge;

applying a sound damping layer on the first side and covering at least part of the first paper encasing layer portion and the first gypsum surface portion wherein the sound damping layer is formed from a viscoelastic polymer; and

positioning the third side of the second gypsum layer to the sound damping layer.

2. The method of claim 1 , wherein the first paper encasing layer portion and the third paper encasing layer portion are formed in the same pattern.

3. The method of claim 1 , wherein the sound damping layer covers at least part of the first paper encasing layer portion, the third paper encasing layer portion, the first gypsum surface portion, and the third gypsum surface portion.

4. The method of claim 1 , wherein the viscoelastic polymer includes an acrylic polymer or copolymer.

5. The method of claim 1 , wherein removing part of the first encasing layer includes removing by abrasion.

6. The method of claim 2 , wherein removing by abrasion includes removing by a moving surface.

7. The method of claim 3 , wherein the moving surface includes an abrasive material.

8. The method of claim 1 , wherein removing part of the first encasing layer includes removing by planning.

9. The method of claim 5 , wherein removing by planning includes removing by at least one blade.

10. The method of claim 1 , wherein removing part of the first encasing layer includes removing by peeling.

11. The method of claim 7 , wherein removing by peeling includes removing with a pulling member.

12. The method of claim 1 , wherein the first gypsum layer has a thickness of about ¼ inches.

13. The method of claim 1 , wherein the first gypsum layer has a thickness of about 5/16 inches.

14. The method of claim 1 , wherein the wallboard has a thickness of about ½ inches.

15. The method of claim 1 , wherein the wallboard has a thickness of about ⅝ inches.

16. A sound damping wallboard consisting of:

a first gypsum layer having a first side with a first gypsum surface and a second side opposite the first side with a second gypsum surface;

a first paper encasing layer partially covering the first gypsum surface to form a first paper encasing layer portion and a first gypsum surface portion on the first side wherein the first gypsum layer has an edge and wherein at least part of the first paper encasing layer portion is positioned adjacent to the edge;

a second paper encasing layer covering the second gypsum surface;

a sound damping layer on the first side and covering at least part of the first paper encasing layer portion and the first gypsum surface portion wherein the sound damping layer is formed from a viscoelastic polymer;

a second gypsum layer having a third side with a third gypsum surface and a fourth side opposite the third side with a fourth gypsum surface;

a third paper encasing layer partially covering the third gypsum surface to form a third paper encasing layer portion and a third gypsum surface portion on the third side; and

a fourth paper encasing layer covering the fourth gypsum surface;

wherein the sound damping layer is positioned between the first side of the first gypsum layer and the third side of the third gypsum layer.

17. A sound damping wallboard consisting essentially of:

a first gypsum layer having a first side with a first gypsum surface and a second side opposite the first side with a second gypsum surface;

a first paper encasing layer partially covering the first gypsum surface to form a first paper encasing layer portion and a first gypsum surface portion on the first side wherein the first gypsum layer has an edge and wherein at least part of the first paper encasing layer portion is positioned adjacent to the edge;

a second paper encasing layer covering the second gypsum surface;

a sound damping layer on the first side and covering at least part of the first paper encasing layer portion and the first gypsum surface portion wherein the sound damping layer is formed from a viscoelastic polymer;

a second gypsum layer having a third side with a third gypsum surface and a fourth side opposite the third side with a fourth gypsum surface;

a third paper encasing layer partially covering the third gypsum surface to form a third paper encasing layer portion and a third gypsum surface portion on the third side; and

a fourth paper encasing layer covering the fourth gypsum surface;

wherein the sound damping layer is positioned between the first side of the first gypsum layer and the third side of the third gypsum layer.