Antenna array with independently rotated radiating elements technical field

1. A multi-layer printed circuit board (PCB) comprising:

a beam-forming network (BFN) positioned in a coordinate system of the multi-layered PCB, wherein the BFN comprises a plurality of beam forming stages, wherein a given beam forming stage of the plurality of beamforming stages has the same geometric shape as another beam forming stage of the plurality of beam forming stages; and

a plurality of antenna cells being positioned in the coordinate system of the multi-layered PCB to form a regular tiling pattern, wherein each of the plurality of antenna cells is interconnected with the BFN through a via extending between the BFN and a respective antenna cell and each of the plurality of antenna cells has a predetermined angle of rotation defined in the coordinate system, wherein at least two of the plurality of antenna cells have different predetermined angles of rotation.

2. The multi-layered PCB of claim 1 , wherein the given beam forming stage is rotated in the coordinate system relative to the other beam forming stage.

3. The multi-layered PCB of claim 2 , wherein the given beam forming stage is rotated by 180 degrees relative to the other beam forming stage.

4. The multi-layered PCB of claim 2 , wherein each of the plurality of beam forming stages of the BFN are arranged in a hierarchical relationship.

5. The multi-layered PCB of claim 4 , wherein the given beam forming stage and the other beam forming stage are on the same level within the hierarchical relationship of the BFN.

6. The multi-layered PCB of claim 4 , wherein the given beam forming stage and the other beam forming stage are both connected to a given combiner/divider.

7. The multi-layered PCB of claim 6 , wherein the given beam forming stage is a first beam forming stage and the other beam forming stage is a second beam forming stage, and the given combiner/divider is a first combiner/divider, the BFN comprising a third beam forming stage, wherein the third beam forming stage comprises:

a second combiner/divider coupled to the first/combiner divider and a third combiner/divider, wherein the third combiner/divider is coupled to a fourth beam forming stage and a fifth beam forming stage.

8. The multi-layered PCB of claim 7 , wherein the third beam forming stage and the fifth beam forming stage are on the same level as the first beam forming stage and the second beam forming stage within the hierarchical relationship of the BFN.

9. The multi-layered PCB of claim 1 , wherein the coordinate system is a global coordinate system, and each of the plurality of antenna cells has a respective local coordinate system, and each of the plurality of antenna cells intersects a respective via extending from the BFN at a particular set of coordinates in the respective local coordinate system.

10. The multi-layered PCB of claim 9 , wherein the particular set of coordinates in the respective local coordinate system is the same for each of the plurality of antenna cells.

11. The multi-layered PCB of claim 1 , wherein the BFN comprises a plurality of BFN cells, wherein each BFN cell is coupled to a respective integrated circuit (IC) chip that is coupled to the multi-layered PCB for adjusting signals communicated with the plurality of antenna cells through the respective vias.

12. The multi-layered PCB of claim 11 , wherein each of the plurality of BFN cells overlays the respective IC chip.

13. The multi-layered PCB of claim 1 , wherein each of the plurality of antenna cells is interconnected with the BFN through two vias.

14. A beam-forming network (BFN) comprising:

a plurality of beam forming stages, wherein each beam forming stage is positioned within a coordinate system of a multi-layered PCB, wherein a given beam forming stage of the plurality of beamforming stages has the same geometric shape as another beam forming stage of the plurality of beam forming stages; and

wherein the BFN communicates with a plurality of antenna cells positioned in the coordinate system of the multi-layered PCB to form the regular tiling pattern, and each of the plurality of antenna cells is interconnected with the BFN through a via extending between the BFN and a respective antenna cell and each of the plurality of antenna cells has a predetermined angle of rotation defined in the coordinate system, wherein at least two of the plurality of antenna cells have different predetermined angles of rotation.

15. The BFN of claim 14 , wherein the given beam forming stage is rotated in the coordinate system relative to the other beam forming stage.

16. The BFN of claim 14 , wherein each of the plurality of beam forming stages of the BFN are arranged in a hierarchical relationship and the given beam forming stage and the other beam forming stage are on the same level within the hierarchical relationship of the BFN.

17. The BFN of claim 16 , wherein the given beam forming stage and the other beam forming stage are both connected to a given combiner/divider.

18. The BFN of claim 14 , wherein each of the plurality of antenna cells is interconnected with the BFN through two vias.

19. The BFN of claim 14 , wherein the BFN comprises a plurality of BFN cells, wherein each BFN cell overlays and is coupled to a respective integrated circuit (IC) chip that is coupled to the multi-layered PCB for adjusting signals communicated with the plurality of antenna cells through the respective vias.

20. The BFN of claim 14 , wherein the coordinate system is a global coordinate system, and each of the plurality of antenna cells has a respective local coordinate system, and each of the plurality of antenna cells intersects a respective via extending from the BFN at a particular set of coordinates in the respective local coordinate system and the particular set of coordinates in the respective local coordinate system is the same for each of the plurality of antenna cells.