IP Library Granted Patent US 11,073,737
Granted Patent B2
US 11,073,737 · App. 16/729,668 · Granted Jul 27, 2021

Method and system for an all-optical wafer acceptance test

Inventors: Gianlorenzo Masini (Carlsbad, CA); Roman Bruck (Carlsbad, CA); Kam-Yan Hon (Oceanside, CA); Attila Mekis (Carlsbad, CA)
Assignee: Luxtera LLC
G02F1/2252G02B6/12004G02B6/34G02F1/0123G02F1/2257H04B10/40G02F1/212
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Quick Facts
Patent No.
US 11,073,737
App. No.
16/729,668
Granted
Jul 27, 2021
Kind
B2
Abstract

Methods and systems for an all-optical wafer acceptance test may include an optical transceiver on a chip, the optical transceiver comprising first, second, and third grating couplers, an interferometer comprising first and second phase modulators, a splitter, and a plurality of photodiodes. A first input optical signal may be received in the chip via the first grating coupler, where the first input optical signal may be coupled to the interferometer. An output optical signal may be coupled out of the chip via the second grating coupler for a first measurement of the interferometer. A second input optical signal may be coupled to a third grating coupler and a portion of the second input optical signal may be communicated to each of the plurality of photodiodes via the splitter. A voltage may be generated using the photodiodes based on the second input signal that may bias the first phase modulator.

Claims (44)

1. A method comprising:

receiving a first input optical signal via a first grating coupler coupled to an interferometer;

propagating the first input optical signal from the first grating coupler to the interferometer;

obtaining a first measurement of an output optical signal received by a second grating coupler coupled to the interferometer, wherein the output optical signal is output by the interferometer based on the first input optical signal;

receiving a second input optical signal via a third grating coupler;

communicating a portion of the second input optical signal to each photodiode of a plurality of photodiodes via a splitter;

biasing a first phase modulator of the interferometer using a voltage generated by the plurality of photodiodes based on the second input optical signal;

obtaining a second measurement of the output optical signal received by the second grating coupler while the first phase modulator is biased by the voltage; and

extracting a phase shift efficiency of the first phase modulator based on the voltage, the first measurement and the second measurement.

2. The method according to claim 1 , further comprising reverse biasing the first phase modulator using the voltage.

3. The method according to claim 1 , further comprising forward biasing the first phase modulator using the voltage.

4. The method according to claim 1 , further comprising regulating the voltage using a series-coupled resistor and a pair of forward-biased photodiodes coupled to ground.

5. The method according to claim 1 , further comprising coupling a third input optical signal to a fourth grating coupler.

6. The method according to claim 5 , further comprising generating a second voltage using a second plurality of photodiodes based on the third input optical signal.

7. The method according to claim 6 , further comprising biasing a second phase modulator of the interferometer using the second voltage.

8. The method according to claim 7 , further comprising obtaining a third measurement of the output optical signal while the second phase modulator is biased by the second voltage.

9. The method according to claim 1 , wherein the plurality of photodiodes comprise germanium.

10. A system comprising:

an optical transceiver on a chip, the optical transceiver comprising first, second, and third grating couplers, an interferometer comprising first and second phase modulators, a splitter, and a plurality of photodiodes, the optical transceiver being operable to:

receive a first input optical signal in the chip via the first grating coupler coupled to the interferometer;

propagate the first input optical signal to the interferometer;

propagate an output optical signal from the interferometer based on the first input optical signal out of the chip via the second grating coupler for a first measurement of the interferometer;

receive a second input optical signal via a third grating coupler;

communicate a portion of the second input optical signal to each photodiode of the plurality of photodiodes via the splitter;

bias the first phase modulator using a voltage generated by the plurality of photodiodes based on the second input optical signal;

measure the output optical signal for a second measurement of the interferometer with the first phase modulator being biased by the voltage; and

extract a phase shift efficiency of the first phase modulator based on the voltage, the first measurement and the second measurement.

11. The system according to claim 10 , wherein the optical transceiver is operable to reverse bias the first phase modulator using the generated voltage.

12. The system according to claim 10 , wherein the optical transceiver is operable to forward bias the first phase modulator using the generated voltage.

13. The system according to claim 10 , wherein the optical transceiver is operable to regulate the generated voltage using a series-coupled resistor and a pair forward-biased photodiodes coupled to ground.

14. The system according to claim 10 , wherein the optical transceiver is operable to receive a third input optical signal via a fourth grating coupler.

15. The system according to claim 14 , wherein the optical transceiver is operable to generate a second voltage using a second plurality of photodiodes based on the third input optical signal.

16. The system according to claim 15 , wherein the optical transceiver is operable to bias the second phase modulator using the second voltage.

17. The system according to claim 16 , wherein a measurement of the output optical signal comprises a third measurement of the interferometer with the second phase modulator being biased by the second voltage.

18. The system according to claim 10 , wherein the chip comprises a complementary metal oxide semiconductor (CMOS) die and the plurality of photodiodes comprise germanium.

19. A system comprising:

an interferometer including a first phase modulator;

a plurality of photodiodes;

a splitter connected to each photodiode of the plurality of photodiodes;

a first coupler configured to receive a first input optical signal for the interferometer;

a second coupler configured to receive an output optical signal from the interferometer based on the first input optical signal;

a third coupler configured to receive a second input optical signal and communicate a portion of the second input optical signal to each photodiode of the plurality of photodiodes via the splitter; and

wherein the plurality of photodiodes is configured to bias the first phase modulator via a voltage based on the second input optical signal.

20. The system of claim 19 , wherein the voltage based on the second input optical signal is set by selecting a number of photodiodes of the plurality of photodiodes that to connect in series with the first phase modulator.

Assignments (4)
CORRECTIVE ASSIGNMENT TO CORRECT THE THE ASSIGNOR'S NAME PREVIOUSLY RECORDED AT REEL: 058979 FRAME: 0027. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. Recorded Mar 24, 2022
From: LUXTERA LLC
To: CISCO TECHNOLOGY, INC.
Reel/Frame 059496/0803 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 8, 2022
From: CISCO SYSTEMS, INC.
To: CISCO TECHNOLOGY, INC.
Reel/Frame 058979/0027 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 13, 2020
From: MASINI, GIANLORENZO; BRUCK, ROMAN; HON, KAM-YAN; MEKIS, ATTILA
To: LUXTERA INC.
Reel/Frame 054043/0789 →
CHANGE OF NAME Recorded Feb 6, 2020
From: LUXTERA, INC.
To: LUXTERA LLC
Reel/Frame 052019/0811 →