Pickup head with photocurable polymers for assembling light emitting diodes
Embodiments relate to using photocurable polymers to place light emitting diodes (LEDs) onto an electronic display substrate after fabrication of the LEDs. A LED assembly system places LEDs on a temporary substrate after fabrication and applies a a photocurable polymer onto the top surfaces of the LEDs. A transparent pickup head aligns with a subset of the LEDs. The pickup head is positioned on the top surfaces of the subset of LEDs such that the layer of the photocurable polymer is in between the pickup head and the top surface of the subset of the LEDs. Light is directed through the pickup head to cure the photocurable polymer, adhering the subset of LEDs to the pickup head. The subset of LEDs is removed away from the temporary substrate, due to relative movement between the temporary substrate and the pickup head.
1. A method comprising:
depositing a photocurable polymer across top surfaces of a set of light emitting diodes (LEDs) mounted on a temporary substrate;
placing a pickup head on a top surface of a subset of the LEDs with the photocurable polymer between the pickup head and the top surface of the subset of the LEDs;
curing a portion of the photocurable polymer between the pickup head and the subset of the LEDs by directing light through the pickup head; and
removing the subset of the LEDs away from the temporary substrate by causing relative movement between the temporary substrate and the pickup head attached with the subset of LEDs through the cured photocurable polymer.
2. The method of claim 1 , wherein removing the subset of the LEDs away from the temporary substrate further comprises:
decomposing the cured portion of the photocurable polymer;
placing the subset of LEDs on a target substrate; and
releasing the subset of LEDs on the target substrate.
3. The method of claim 2 , wherein decomposing the cured portion of the photocurable polymer comprises:
thermally decomposing the cured portion of the photocurable polymer.
4. The method of claim 2 , wherein decomposing the cured portion of the photocurable polymer further comprises:
decomposing the cured portion of the photocurable polymer by wet etching.
5. The method of claim 1 , wherein the pickup head is used to remove a plurality of subsets of LEDs away from the temporary substrate.
6. The method of claim 1 , wherein the pickup head is made of material that is optically translucent or transparent.
7. The method of claim 6 , wherein the pickup head is made of material that has a coefficient of thermal expansion (CTE) close to a CTE of the LEDs.
8. The method of claim 7 , wherein the pickup head is made of fused silica.
9. The method of claim 1 , further comprising:
removing a portion of the polymer by radio frequency (RF) plasma etching.
10. The method of claim 1 , wherein a feature size of each of the LEDs is from 0.1 μm to 10 μm.