Semiconductor device fabrication method and semiconductor device
A first-layer insulating film having a barrier property against a determined element contained in a ferroelectric capacitor as well as an oxygen permeability, a hydrogen permeability, and a water permeability is formed over a surface of the ferroelectric capacitor formed over a substrate. After that, heat treatment is performed in an oxidizing atmosphere. After the heat treatment, a second insulating film having a hydrogen permeability and a water permeability lower than those of the first-layer insulating film respectively is formed over a surface of the first-layer insulating film in a non-reducing atmosphere. A third-layer insulating film is formed over a surface of the second-layer insulating film. By doing so, degradation of a ferroelectric film under and after the formation of a semiconductor device having the ferroelectric capacitor is suppressed and deterioration in the characteristics of the ferroelectric capacitor is suppressed.
1. A semiconductor device comprising:
a substrate;
a ferroelectric capacitor formed over the substrate;
a first insulating film formed over a surface of the ferroelectric capacitor, having a barrier property against a first element contained in the ferroelectric capacitor, and having an oxygen permeability, a hydrogen permeability, and a water permeability;
a second insulating film formed over a surface of the first insulating film and having a hydrogen permeability and a water permeability lower than the hydrogen permeability and the water permeability, respectively, of the first insulating film;
a third insulating film formed over a surface of the second insulating film; and
an interlayer insulating film formed over a surface of the third insulating film and having a hydrogen permeability and a water permeability higher than a hydrogen permeability and a water permeability, respectively, of the third insulating film.
2. The semiconductor device according to claim 1 , wherein the second insulating film contains nitrogen or carbon.
3. A semiconductor device fabrication method comprising:
forming a ferroelectric capacitor over a substrate;
forming over a surface of the ferroelectric capacitor a first insulating film having a barrier property against a first element contained in the ferroelectric capacitor and having an oxygen permeability, a hydrogen permeability, and a water permeability;
performing a heat treatment in an oxidizing atmosphere after the forming of the first insulating film;
forming over a surface of the first insulating film in a non-reducing atmosphere a second insulating film having a hydrogen permeability and a water permeability lower than the hydrogen permeability and the water permeability, respectively, of the first insulating film after the performing of the heat treatment, the second insulating film containing nitrogen or carbon; and
forming a third insulating film over a surface of the second insulating film.
4. The semiconductor device fabrication method according to claim 3 , wherein the forming of the second insulating film includes forming the second insulating film by nitriding an outer layer portion of the first insulating film by a heat treatment in an atmosphere containing nitrogen.
5. The semiconductor device fabrication method according to claim 3 , further comprising:
forming over a surface of the third insulating film an interlayer insulating film having a hydrogen permeability and a water permeability higher than a hydrogen permeability and a water permeability, respectively, of the third insulating film.
6. A semiconductor device fabrication method comprising:
forming a ferroelectric capacitor over a substrate;
forming over a surface of the ferroelectric capacitor a first insulating film having a barrier property against a first element contained in the ferroelectric capacitor and having an oxygen permeability, a hydrogen permeability, and a water permeability;
performing a heat treatment in an oxidizing atmosphere after the forming of the first insulating film;
forming, after the performing of the heat treatment, a second insulating film having a hydrogen permeability and a water permeability lower than the hydrogen permeability and the water permeability, respectively, of the first insulating film by denaturing the first insulating film in a non-reducing atmosphere; and
forming a third insulating film over a surface of the second insulating film.
7. The semiconductor device fabrication method according to claim 6 , wherein the second insulating film contains nitrogen or carbon.
8. The semiconductor device fabrication method according to claim 6 , wherein the forming of the second insulating film includes forming the second insulating film by denaturing the first insulating film by nitriding the first insulating film by a heat treatment in an atmosphere containing nitrogen.
9. The semiconductor device fabrication method according to claim 6 , further comprising:
forming over a surface of the third insulating film an interlayer insulating film having a hydrogen permeability and a water permeability higher than a hydrogen permeability and a water permeability, respectively, of the third insulating film.