IP Library Granted Patent US 10,917,998
Granted Patent B2
US 10,917,998 · App. 16/733,857 · Granted Feb 9, 2021

Rack information handling system having modular liquid distribution (MLD) conduits

Inventors: Austin Michael Shelnutt (Leander, TX); Travis C. North (Cedar Park, TX); Christopher M. Helberg (Austin, TX); Steven Embleton (Austin, TX); Edmond I. Bailey (Cedar Park, TX); James D. Curlee (Round Rock, TX)
Assignee: Dell Products, L.P.
H05K7/20781H05K7/20772
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Quick Facts
Patent No.
US 10,917,998
App. No.
16/733,857
Granted
Feb 9, 2021
Kind
B2
Abstract

A liquid cooled information handling system (LC_IHS) includes a first liquid cooled node coupled to a first chassis. The LC_IHS further includes a supply conduit in fluid communication with the first chassis to cool a first liquid cooled node. The supply conduit includes a plurality of fluid paths configured such that when a first fluid path of the plurality of fluid paths is interrupted, cooling of the first liquid cooled node continues.

Claims (29)

1. A method of liquid cooling an information handling system, the method comprising:

cooling a first liquid cooled node in a first chassis with a liquid flow from a facility supply, wherein the liquid flow comprises a plurality of fluid paths enabling multiple different flow directions of cooling liquid towards an intake liquid transfer conduit of the first liquid cooled node; and

receiving the liquid flow at the first chassis, wherein the liquid flow is in fluid communication with the first liquid cooled node such that, when a first fluid path of the plurality of fluid paths is interrupted, cooling the first liquid cooled node continues.

2. The method of liquid cooling an information handling system of claim 1 , further comprising receiving the liquid flow at a first liquid manifold coupled to the first chassis.

3. The method of liquid cooling an information handling system of claim 2 , wherein the first liquid manifold is in fluid communication with the first liquid cooled node.

4. The method of liquid cooling an information handling system of claim 1 , further comprising:

cooling a second liquid cooled node in a second chassis with the liquid flow from the facility supply; and

receiving the liquid flow at the second chassis, wherein the liquid flow is in fluid communication with the second liquid cooled node such that, when a second fluid path of the plurality of fluid paths is interrupted, cooling the first liquid cooled node continues.

5. The method of liquid cooling an information handling system of claim 4 , further comprising receiving the liquid flow at a first liquid manifold and at a second liquid manifold, wherein the first liquid manifold is coupled to the first chassis and the second liquid manifold is coupled to the second chassis.

6. The method of liquid cooling an information handling system of claim 5 , wherein the first liquid manifold is in fluid communication with the first liquid cooled node and the second liquid manifold is in fluid communication with the second liquid cooled node.

7. The method of liquid cooling an information handling system of claim 6 , further comprising interrupting a liquid conduit when the first fluid path of the plurality of fluid paths is interrupted, wherein the liquid conduit comprises the first liquid manifold fluidly coupled to the second liquid manifold.

8. The method of liquid cooling an information handling system of claim 1 , further comprising directing the liquid flow from the first chassis to a facility return.

9. The method of liquid cooling an information handling system of claim 8 , further comprising receiving the liquid flow at a first liquid manifold fluidly coupled to the facility return, wherein the first liquid manifold is coupled to the first chassis and in fluid communication with the first liquid cooled node.

10. The method of liquid cooling an information handling system of claim 2 , further comprising:

cooling a third liquid cooled node in a third chassis with the liquid flow from the facility; and

receiving the liquid flow at the third chassis, wherein the liquid flow is in fluid communication with the third liquid cooled node such that when the first fluid path of the plurality of fluid paths is interrupted, cooling the first and the second liquid cooled nodes continues.

11. A liquid cooled information handling system comprising:

a first liquid cooled node coupled to a first chassis; and

a supply conduit in fluid communication with the first chassis to cool a first liquid cooled node, wherein the supply conduit comprises a plurality of fluid paths enabling multiple different flow directions of cooling liquid towards an intake liquid transfer conduit of the first liquid cooled node and configured such that when a first fluid path of the plurality of fluid paths is interrupted, cooling of the first liquid cooled node continues.

12. The liquid cooled information handling system of claim 11 , further comprising a return conduit, wherein the return conduit is in fluid communication with the first liquid cooled node.

13. The liquid cooled information handling system of claim 12 , wherein the supply conduit is coupled to a facility supply and the return conduit is coupled to a facility return.

14. The liquid cooled information handling system of claim 12 , further comprising a first liquid manifold coupled to the first chassis, wherein the first liquid manifold is in fluid communication with the first liquid cooled node.

15. The liquid cooled information handling system of claim 14 , wherein the first liquid manifold is in fluid communication with the supply conduit.

16. The liquid cooled information handling system of claim 14 , wherein the first liquid manifold is in fluid communication with the return conduit.

17. The liquid cooled information handling system of claim 11 , further comprising:

a second liquid cooled node coupled to a second chassis, wherein the second liquid cooled node is in fluid communication with the supply conduit such that when a second fluid path of the plurality of fluid paths is interrupted, the first liquid cooled node continues to cool.

18. The liquid cooled information handling system of claim 17 , further comprising a first liquid manifold and a second liquid manifold, wherein the first liquid manifold is coupled to the first chassis and the second liquid manifold is coupled to the second chassis.

19. The liquid cooled information handling system of claim 18 , wherein the first liquid manifold is in fluid communication with the first liquid cooled node and the second liquid manifold is in fluid communication with the second liquid cooled node.

20. The liquid cooled information handling system of claim 19 , further comprising a liquid conduit coupled to the supply conduit, wherein the liquid conduit comprises the first liquid manifold fluidly coupled to the second liquid manifold.

Assignments (9)
RELEASE OF SECURITY INTEREST IN PATENTS PREVIOUSLY RECORDED AT REEL/FRAME (053311/0169) Recorded Jun 23, 2022
From: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
To: DELL PRODUCTS L.P.; EMC CORPORATION; EMC IP HOLDING COMPANY LLC
Reel/Frame 060438/0742 →
RELEASE OF SECURITY INTEREST IN PATENTS PREVIOUSLY RECORDED AT REEL/FRAME (053546/0001) Recorded Jun 23, 2022
From: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
To: DELL MARKETING L.P. (ON BEHALF OF ITSELF AND AS SUCCESSOR-IN-INTEREST TO CREDANT TECHNOLOGIES, INC.); DELL INTERNATIONAL L.L.C.; DELL PRODUCTS L.P.; DELL USA L.P.; EMC CORPORATION; DELL MARKETING CORPORATION (SUCCESSOR-IN-INTEREST TO FORCE10 NETWORKS, INC. AND WYSE TECHNOLOGY L.L.C.); EMC IP HOLDING COMPANY LLC
Reel/Frame 071642/0001 →
RELEASE OF SECURITY INTEREST IN PATENTS PREVIOUSLY RECORDED AT REEL/FRAME (052216/0758) Recorded Jun 23, 2022
From: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
To: DELL PRODUCTS L.P.; EMC IP HOLDING COMPANY LLC
Reel/Frame 060438/0680 →
RELEASE OF SECURITY INTEREST AF REEL 052243 FRAME 0773 Recorded Nov 2, 2021
From: CREDIT SUISSE AG, CAYMAN ISLANDS BRANCH
To: DELL PRODUCTS L.P.; EMC IP HOLDING COMPANY LLC
Reel/Frame 058001/0152 →
SECURITY INTEREST Recorded Jun 5, 2020
From: DELL PRODUCTS L.P.; EMC CORPORATION; EMC IP HOLDING COMPANY LLC
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS COLLATERAL AGENT
Reel/Frame 053311/0169 →
SECURITY AGREEMENT Recorded Apr 22, 2020
From: CREDANT TECHNOLOGIES INC.; DELL INTERNATIONAL L.L.C.; DELL MARKETING L.P.; DELL PRODUCTS L.P.; DELL USA L.P.; EMC CORPORATION; FORCE10 NETWORKS, INC.; WYSE TECHNOLOGY L.L.C.; EMC IP HOLDING COMPANY LLC
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A.
Reel/Frame 053546/0001 →
SECURITY AGREEMENT Recorded Mar 26, 2020
From: DELL PRODUCTS L.P.; EMC IP HOLDING COMPANY LLC
To: CREDIT SUISSE AG, CAYMAN ISLANDS BRANCH
Reel/Frame 052243/0773 →
PATENT SECURITY AGREEMENT (NOTES) Recorded Mar 24, 2020
From: DELL PRODUCTS L.P.; EMC IP HOLDING COMPANY LLC
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS COLLATERAL AGENT
Reel/Frame 052216/0758 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 3, 2020
From: SHELNUTT, AUSTIN MICHAEL; NORTH, TRAVIS C.; HELBERG, CHRISTOPHER M.; EMBLETON, STEVEN; BAILEY, EDMOND I.; CURLEE, JAMES D.
To: DELL PRODUCTS, L.P.
Reel/Frame 051411/0855 →