Method of imaging a 3D sample with a multi-beam particle microscope
A fast method of imaging a 3D sample with a multi-beam particle microscope includes the following steps: providing a layer of the 3D sample; determining a feature size of features included in the layer; determining a pixel size based on the determined feature size in the layer; determining a beam pitch size between individual beams in the layer based on the determined pixel size; and imaging the layer of the 3D sample with a setting of the multi-beam particle microscope based on the determined pixel size and based on the determined beam pitch size.
1. A method, comprising:
determining a pixel size based on a feature size in a layer of a 3D sample;
determining a beam pitch size between individual beams of a multi-beam particle microscope based on the determined pixel size; and
using the multi-beam particle microscope to image the layer of the 3D sample with a setting of the multi-beam particle microscope based on the determined pixel size and based on the determined beam pitch size.
2. The method of claim 1 , further comprising repeatedly performing at least part of the method for a plurality of layers of the 3D sample.
3. The method of claim 2 , wherein a number of pixels in a single field of view is kept constant for imaging the plurality of layers of the 3D sample.
4. The method of claim 1 , wherein the feature size is a minimum feature size in the layer of the 3D sample.
5. The method of claim 1 , wherein:
the pixel size is at most half of a minimum feature size; and
for a first single field of view, single fields of view adjacent to the first single field of view overlap with the first single field of view by between 5% and 10% in each scanning direction of the multi-beam particle microscope.
6. The method of claim 1 , wherein the pixel size is at most half of a minimum feature size.
7. The method of claim 1 , further comprising selecting the beam pitch size from a set of discrete values of the multi-beam particle microscope.
8. The method of claim 7 , further comprising rounding down the determined beam pitch size to the next discrete value for the beam pitch size.
9. The method of claim 1 , further comprising using a priori knowledge to determine the feature size in the layer of the 3D sample.
10. The method of claim 1 , further comprising using a light microscope to image the layer of the 3D sample to determine the feature size of the layer of the 3D sample.
11. The method of claim 1 , further comprising using the multi-beam particle microscope to take at least one test image to determine the feature size in the layer of the 3D sample.
12. The method of claim 1 , further comprising analyzing scattered light or scattered particles to determine the feature size in the layer of the 3D sample.
13. The method of claim 1 , further comprising classifying the layer of the 3D sample into a plurality of regions based on feature sizes in the regions.
14. The method of claim 13 , further comprising:
determining, per region, a feature size of features in the layer of the 3D sample;
determining, per region, a pixel size based on the determined feature size in the region;
determining, per region, a beam pitch size between individual beams of the multi-beam particle microscope; and
imaging, per region, the layer of the 3D sample with a setting of the multi-beam particle microscope based on the determined pixel size in the region and based on the determined beam pitch size for the region.
15. The method of claim 14 , further comprising repeatedly performing at least part of the method for a plurality of layers of the 3D sample,
wherein a number of regions within a respective layer of the 3D sample and/or a position of the regions within a respective layer of the 3D sample: a) varies from layer to layer for a plurality of layers; orb) is constant for a plurality of layers.
16. The method of claim 1 , further comprising non-destructive delayering of the 3D sample.
17. The method of claim 1 , further comprising destructive delayering of the 3D sample.
18. The method of claim 17 , wherein delayering comprises at least one member selected from the group consisting of ion beam milling, ion beam sputtering, and charged particle beam induced gas etching.
19. The method of claim 1 , wherein the 3D sample comprises an integrated circuit.
20. One or more machine-readable hardware storage devices comprising instructions that are executable by one or more processing devices to perform operations comprising the method of claim 1 .
21. A system comprising:
one or more processing devices; and
one or more machine-readable hardware storage devices comprising instructions that are executable by the one or more processing devices to perform operations comprising the method of claim 1 .
22. The system of claim 21 , further comprising a multi-beam particle microscope.
23. The method of claim 1 , wherein, for a first single field of view, single fields adjacent to the first single field of view overlap with the first single field of view by between 5% and 10% in each scanning direction of the multi-beam particle microscope.